CN1348553A - 薄膜上形成图案的方法 - Google Patents
薄膜上形成图案的方法 Download PDFInfo
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- CN1348553A CN1348553A CN99816473A CN99816473A CN1348553A CN 1348553 A CN1348553 A CN 1348553A CN 99816473 A CN99816473 A CN 99816473A CN 99816473 A CN99816473 A CN 99816473A CN 1348553 A CN1348553 A CN 1348553A
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- coating
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- laser
- metal
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Images
Classifications
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- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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Abstract
形成图案的物件,诸如RFID天线,是由亚消融作出的,一个包含如下步骤的工艺:A.提供一种具有诸如金属或金属氧化物镀层的衬底,和包含薄区域的界面,在该区域,该镀层和衬底彼此是最接近的;B.把镀层总面积的至少一部分曝光于诸如聚焦的激态基态复合激光光束的电磁能量通量,它足以瓦解该表面但不足以消融该镀层;以及C.用诸如超声搅动来除去与已有瓦解的界面区域部分对准的镀层部分。该工艺在产品上未留下残留的化学抗蚀剂和没有图案或图像凹蚀方面优于光致抗蚀剂工艺。该工艺在相同能量可能有较高输出量和产品表面未留下微观废弃物方面优于激光消融。
Description
技术领域
本发明涉及在诸如涂上金属的衬底之类的物件上形成图像或图案。具体地说,它涉及到采用诸如激光或闪光灯,形成这样一种图像或图案。
背景技术
对许多有用的目的常在表面层材料上形成图像或图案。表面层包括真空沉积薄膜,溶液镀层,和无电极薄膜或电镀。已形成图案的导电表面层可在无源和有源这种电子线路,显示元件,用于无线电频率识别(RFID)辅助信号的天线,天线局域网络(LAN)和邻近探测器等,还有诸如寻呼机,蜂窝电话,和卫星接收等可以找到它的用途。光学表面层可作为诸如衍射光学元件和保密图像的光学部件找到应用,或作为能执行光开关,调制,和多路调制或信号分离的元件在光通信应用中找到应用。
有几种技术可用于在表面层形成图案。两种有用的方法是化学腐蚀和激光消融。用化学腐蚀产生的图像或图案是用合适的化学制品有选择地溶解表面层来形成的;而用能量消融产生的则是在一个有选择的方法下靠极迅速地分离并剥离薄表面层来形成的。但是,每一个这种方法都一有些局限性。
化学腐蚀是一种多工序工艺,它可能产生危险的废弃物。典型的是,把一种化学制品或光致抗蚀剂涂到一层将要形成图案或图像的表面经选择部位上。然后,在整个表面涂上一种化学制品并可以把暴露在表面上镀层(例如铜)除去,但不是由化学制品或光致抗蚀剂所覆盖的那部分表面上的镀层。然后把包含有被溶掉的表面层材料的化学溶液从已形成图像的物件上清洗掉。就要用一些化费把这通常有危险的溶液收集起来并在安全的方式下处理掉。这种方法由于多工序工艺和形成有图像的物件会具有残留的光致抗蚀剂的残渣和图像的凹蚀侧壁,所以是不受欢迎的。
采用激光来形成图案或微型机械材料的现代方法是依靠消融的物理现象。能量消融是一种较简单的工艺过程,它不牵涉到危险的废弃物垃圾。典型的是,把将要形成图像的物件的表面层曝露(例如通过掩模)在诸如激光或闪光灯的高能光源发出的光脉冲之下。这些能量脉冲被未覆盖掩模的表面层吸收,而撞击到表层的能量对表面温度造成短时间的突发升高。在温度上的迅速上升造成表面层材料剧烈的分离或从衬底上喷射出来并根据掩模的图案产生一个图案。
发明概述
已经创造出一种用于在表面层材料上形成图像或图案的改进方法,它包括的步骤如下:
A.提供一种衬底,它具有镀层和包括该薄的区域的界面,在这个区域其镀层和衬底彼此是紧靠在一起的;
B.只少把镀层总面积的一部分曝露在足以瓦解其界面但不足以消融镀层的一束电磁能量中;以及
C.除去在具有已被瓦解的界面区域部分的对准图像上的镀层部分。
衬底可以是任何一种适宜作为用于辐射感应的图像的支承物的材料。这个工艺对于对热损伤敏感的衬底尢为有利,诸如包括聚酯,聚碳酸酯,聚氯乙烯,和聚酰亚胺在内的一些聚合材料。镀层可以是任一种吸收辐射的可形成图像的材料。典型的镀层包括金属,金属合金,和诸如金属氧化物和金属氮化物的无机化合物,还有有机物。电磁能量的束流可以是来自诸如激光或短脉冲宽度的闪光灯的光源。
能量通量低于表面镀层的消融阈值但是足以瓦解在镀层和衬底之间的界面。瓦解阈值是从衬底瓦解镀层所需的最小能量,且与镀层,衬底和所用能量的波长有关。作为本说明来说,用于界面处的术语瓦解,意思是影响在衬底和镀层之间界面键合使得该界面较弱于还未曝露到能量通量的界面上的键合。这个界面键合的减弱足以能除去曝露于能量束流区域的镀层,正如在此所述的,向不会除去未曝露区域的镀层。
干扰或瓦解界面比消融工艺需较少的通量,即在镀层表面的能量密度,消融工艺意味着对一给定的电磁能量通量源的较大的通过量或输出量。并且,基本上没有镀层材料在工件上的再沉积,这一点减轻了已形成图像衬底涉及在所生产物件中碎屑的不利效果。
一种反射的,吸收的或衍射的掩模限定了所要的图案。作为一例子,不透明反射区域和透明区域限定了反射的掩模图案。当均匀的能量通量入射到该膜时,能量由反射区域反射并由透明区域传播,导致镀层材料所要的部分(对应于图案)曝露于能量通量。
在界面的干扰部分上的镀层用一种方法来除去,诸如,把它与一粘合剂滚筒相接触,把它曝露在温和液体和气体(例如空气或水的喷射)的高速流中,或在水溶液中作超声搅动。正如在本段中所采用的,术语温和是意指对镀层或衬底没有损伤效应(例如有化学反应,锈蚀,或物理剥蚀)的特性。这个在已被瓦解区域上镀层的除去工序相对来说是不贵的。
已形成图像的物件也是本发明的一部分。包括在衬底上已成像的镀层的发明物件同由消融制作的物件的差别在于基本上不存在热畸变和包括镀层材料的碎屑。它们也同由化学制品或光致抗蚀剂制成的物件的差别在于基本上不存在光致抗蚀剂和不存在可以随化学形成图案工艺中发生的图像的凹蚀。
能从本发明得到好处的应用包括用于有源和无源电子线路的无机薄膜的图案制作,用于无线电频率识别辅助信号的天线,EMI屏蔽,转接天线,和生物传感图案阵列。根据本发明制作的形成图案的光学表面也能在光波导,电光滤波器和调制器,全息照相,安全图像,图形和后反射材料中找到应用。在刚性和柔性的衬底上形成图案的透明导体都可在液晶显示(LCD)计算机显示屏,电视,触摸屏膜,经加热的和电铬窗口中找到应用。
附图简要说明
图1是用于实现本发明方法的装置的立体图。
图2是根据本发明工艺制作的天线的平面图。
图3是图2中天线的截面图。
图4是根据本发明工艺制作的RFID天线放大102倍的背散射扫描电子显微照相。
图5是根据激光消融制作的RFID天线放大102倍的背散射扫描电子显微照相。
详细说明
发明者认为在消融工艺过程中被工件材料所吸收的光能量造成热的和光化学的分解,导致了从曝光区域迅速扩张和喷射出材料碎片的气体副产品。这对整体材料的去除和预防阻止材料碎片沉积到工件或邻近的光学元件上需要相当高的通量。
本发明提供具有最小碎屑产生的精确分辨率的形成图案,不用危险的化学制品以及与化学腐蚀技术比较减少了工艺步骤。本发明方法利用了当消融时所采用的工艺过程,但是消除了在消融值下由降低能量密度引起的碎屑的产生和沉积的问题。曝露于电磁通量的表面层区域已经降低了对衬底的粘附,并可使表面层或镀层能用机械方法除去。
参阅图1,设备1的一个实施例,它可用来实现本发明的工艺包括:能源30,它可是激光器;光学系列,它包括快门34,光束成型器36,均质器38,以及圆柱形会聚透镜42;可移动平移台24,在它的上面装有掩模26;和由保护薄板条松开和卷起转轴分别为12和16,传送带托辊转轴分别为18和19,工件松开和卷起转轴分别为13和17以及传送带托辊转轴14和15构成的薄膜操纵子配件10。在完成工艺过程中,要处理的镀层衬底20从转轴13松开,在传送带托辊转轴14和15上卷起到转轴17上使它被曝光于矩形的激光光束44;并且透明的保护薄板条22从转轴12松开通过激光光束44入射的区域,并在已镀层衬底20和掩模26之间,在不毁坏掩模26情况下,允许对本发明工艺和有碎屑的消融工艺之间作出比较。当仅采用本发明的方法时不需要该保护层。
当掩模26保护薄板条22和已镀层衬底20在激光光束下曝光时,最佳是,保护薄板条22,镀层薄板层20和掩模26在激光光束44的前面以相同的速率移动,使得掩模的整个区域基本上均匀地在激光光束中曝光。这可以采用移动平移平台24和使镀层衬底20和保护薄板条22两者前行的现有技术方法来完成。激光光束因而横越在由掩模限定的整个区域上,这是为了要使已镀层衬底在掩模的后面曝光。在要形成图像的区域已在激光下曝光足够的时间之后,曝光停止(例如用快门34关闭)并且已镀层衬底20和保护薄板条22在它们的转轴上向前行进,使得新的区域获得处理。保护薄板条22对光束44的电磁能量是透明的。
镀层衬底20典型地由镀以薄膜材料的聚合物薄板条衬底构成。该该衬底可以是能支承图像的任何材料。因为本工艺在可能使一些衬底畸变的能级之下操作的,所以用这种衬底制成的物件有特别的好处。这种衬底一般由聚合物薄板条构成。用于衬底的有用的聚合物是:聚酯,聚碳酸酯,聚乙烯,聚酰胺,聚氯乙烯,聚苯乙烯,聚丙烯或聚酰亚胺。
通常,这些中的一些将不是图1所示的滚筒商品的形式。其实,根据应用,衬底可以是各种形式的。几种有用的形式包括,例如,薄层或滚筒形式的平薄膜或箔片,杆,纤维圆珠,薄晶片,板材,小底板,和无纺薄板条。这些形式可用许多种材料制备而得。并不是所有的材料可以制备成所有的形式,但是在材料工艺技术领域中的技术人员能够决定对各种材料配置的可能性。
衬底可以是有机的或无机的。无机衬底材料包括以二氧化硅作基底的玻璃,铁和非铁的金属,陶瓷,诸如硅,锗,砷化镓,氧化镓这种半导体,和诸如氧化铝和二氧化钛的其它金属无机物。
曾被用于制作本发明的一种衬底聚合物是PETG聚酯(Eastman ChemicalCompany,Kingsport,Teunessee)。它是一种基于聚对苯二甲酸乙二醇酯的无定形共聚酯,它的密度为1.27g/cm3,作为制作诸如RFID卡的热层压卡是有用的。能热层压的其它聚合物(例如用一层或几层乙烯树脂聚合物镀层的聚酯)对这种应用也是有用的衬底。
对一种特殊的应用,把可成像的材料镀层到衬底上至所要的厚度。这镀层可以是单层的也可以是多层的。根据材料的组成,可用许多种技术来镀层。例如,对金属薄膜镀层,真空蒸发或溅射沉积技术在本技术领域中生产优良的薄膜性质是公知的。对于有机薄膜镀层,一些溶液镀层方法,诸如照相凹版,槽沟,和轻触镀层,是众所周知的。在镀层和材料工艺技术领域中的技术人员对特定的镀层材料和衬底能够选出合适的镀层技术。具有可成像特性的材料包括有机的和无机的这两种材料。作为例子,具有有用特性的无机材料包括诸如NiFe,AgZn的金属合金;诸如氧化铟锡,二氧化硅,一氧化硅,氧化锌,氧化铝的氧化物薄膜;以及诸如铌酸锂,氟化镁,硫化锌和氟化钙。有机镀层包括丙烯酸酯,聚碳酸酯,和基于环氧树脂的聚合物。
镀层可以包含有机的和无机的材料以提供光学的,电学的,结构的或美学的特征。提供合适的光学性质的镀层可包括诸如氧化锗,二氧化硅,一氧化硅,铌酸锂,和/或LiTaO3的氧化物,诸如ZnS的硫化物,和诸如氟化钙和氟化镁的氟化物。美学特征可由诸如氧化铌,氧化钽,银锌合金,和氮化钛的合金,氧化物,和氮化物来提供。
在镀层和衬底之间的界面中也可能有一连接层,-它改变了镀层对衬底的粘合力。该连接层是一种既不同于镀层也不同于衬底的材料,且它是本发明工艺的一个重要好处,这样一种连接层可在像镀层同样的时间被除去。在通常的湿腐蚀工艺中,要求用不同化学制品的一个单独的工艺步骤来除去连接层。
能源是要可以对镀层表面产生足够范围的通量以导致镀层一衬底界面的合适瓦解。合适的能源包括激光和闪光灯。激光灯的工作波长可从紫外(UV)到红外。描述了两种对本工艺特别有用的激光。
激态基态复合激光是高功率的,能在紫外频率产生高通量光的激光器。它们的光激射能力是根据特定的双原子气体分子的。尤其是,激态基态复合激光器构成了激光器的一个系列,它们在157-355nm的波长范围内发射光。最普通激态基态复合激光器的波长和相应的双原子气体是XeCl(308nm),KrF(248nm)和ArF(193nm)。在激态基态复合激光器内的光激射作用是在由双原子气体形成的受激二聚物中的粒子数反转的结果。脉冲宽度一般是在纳秒的10s到100s,导致高能,短脉冲宽度的脉冲。激态基态复合激光器的这些特性可为在取决于所选的能量输出的激态基态复合激光的激发范围内。具有足够吸收的材料导致亚消融或消融的工艺条件。
固体激光器是高功率激光器,它们能够在从红外到紫外波长的范围内产生集中的光束。这些固体激光器的选出部分是根据材料并牵涉到钕掺杂到一固体基质中,诸如钇-铝-柘榴石(YAG),钇-锂-氟化物(YLF),和钒酸钇(YVO5)。这些特殊的材料在红外波长范围为1.04到1.08μm内在一基本波长上发出激光。这种光激射可以通过采用诸如硼酸锂(LBO)或磷酸钾钛(KTP)的非线性光学晶体延伸到较短的波长。作为一例子,采用这些非线性晶体,可把掺钕的YAG激光器的基本辐射为1.06μm,加倍其频率至波长为532nm或三倍其频率至355nm。与激态基态复合激光器一样,固体激光器的特性可为在适用的波长范围内吸收的材料导致亚消融(即在低子消融阈值的能级上)或消融的工艺条件。
对激态基态复合激光器的另一种光源是短脉冲线性激态基态复合激光器,紫外闪光灯,典型地,这样一种灯泡包括具有直径为约3到20mm的内腔,壁厚约1mm的透明石英灯管。这种闪光灯可以是长达30cm。(两个)电极最好用钨制成,把它封在灯管的(两个)尾部,灯管中充以诸如氙的惰性气体。采用电容器组合,把5到40KV范围的电压加到两极间,闪光灯发出的脉冲范围为1到20Hz。电荷把氙原子电离而形成一等离子体,它发射出波长范围从约200nm到约800nm的宽带辐射。该闪光灯可包括放在灯管的部分周围的反射器以使辐射成型并把它从灯泡导向掩模和工件。
线性闪光灯在较短波长处能够产生约5μs相当短的脉冲的高强度、高通量的能量输出。例如,已经发现具有宽带光谱输出的氙线性闪光灯,当脉冲约为2和6μs时能提供约在1.0和1.5J/cm2之间的有效能量密度。
每个镀层和衬底系统具有被定义为消融阈值和亚消融值的通量级,消融阈值通量是要造成镀层剧烈分解或从衬底消融,该镀层在单位面积所必需吸收的最小能量。亚消融通量是有镀层表面,加热该镀层足以瓦解在镀层和衬底之间的界面,但不是消融它在镀层表面所需的每单位面积的最小能量。亚消融发生在比消融阈值通量稍低一点的地方并延伸向下到亚消融阈值通量。
镀层对衬底的粘合力也是重要的。粘合力必须是充足的,使得与未瓦解的界面区域对准的该镀层不会被工序除去,该工序是要除去与瓦解了的界面区域对准的镀层。由于界面的瓦解,一般是减少在镀层和衬底之间的粘合力,所以当在未曝光的镀层和衬底之间的粘合力如下面描述的方法B所测量的在约40到700g/cm之间时得到了满意的图像。
示于图1的并用于导致本发明的几个实验中的激光器是激态基态复合激光器,从该激光器发射出具有宽高比约3∶1,近似矩形横截面的激光光束32。该激态基态复合激光器产生具有足够通量(测量单位为mJ/cm2)的瓦解界面的短脉冲(例如20ns)光束,与其它激光器相比较,高密度能量的激态基态复合激光器能在相当大的范围内获得。
光束成型器36主要起到把激光光束的顶边和底边重新成型的作用以便增加可用的脉冲能量。光束32以高斯能量分布离开激光器。在远离光束轴处能量密度有所减少。光束成型器将能最分布变得更接近矩形,有时候称为帽顶分布。光束成型器可在市场上获得,一个实施例购自比利时Site du Grand Hornu的Opteh。光束成型器最好具有至少为20mm的焦距。光束成型器的一实施例其实际镜头是焦距为240mm的平凸镜。其宽度部分(50mm)足以覆盖初始宽度为33mm的激光光束的整个宽度。镜头高度部分(12.5mm)等于光束高度(11mm)的至少一半。光束成型器部件作用在初始的激光基态复合激光光束的顶边和底边以便重新将它们垂直导向光束中心。
均质器38起到分开并重叠光束32的足够数目的分段,使得最后的光束40在水平方向(从一边到另一边横跨光束)均匀的作用。能量分布中点与点之间可通过采用光束所经过的例如垂直取向的小透镜阵列将激态基态复合激光光束各个部分彼此混合起来减少起伏。均质化可以增加激态基态复合激光光束40的有用部分。如Industrial Excimer Lasers 2nd ed.,Basting,D.,ed.,LambdaPhysik GmbH,Gottingen,Germany中所述,许多种均质器在本技术领域中是公知的。一种有用的均质器包含一焦距为16mm,具有七个圆柱形平一凸透镜的小透镜阵列。每个部件宽度为5mm,并且长度(38mm)足以覆盖光束的高度(11mm)。这些小透镜一个挨着一个以覆盖初始光束的整个宽度并在水平方向上实现均质化。
激光光束40在激光器30和圆柱形透镜42之间的整个距离上扩展横截面,但是圆柱形透镜42集中了整个光束40的强度。光束出射透镜42的高度基本上低于进入透镜42的光束40(例如约小10倍)。一有用实施例是一焦距为103mm的平一凸透镜。它的宽度是38mm,并且它的长度是350mm,使得其足够大的来接收一束经过重新成型且均质化的光束。圆柱形透镜42是由诸如熔融石英之类的高度透射材料制成的。因此,光束成型器36和圆柱形镜头42对激光光束的纵向分布起作用,而均质器38则在与纵向正交的均质化方面起作用。
最好掩模26是由对激态基态复激光光束是高度透明的基底材料制成。该基底材料可以是例如覆盖有一反射所用电磁能量波长的防护表层这种基底材料。举例来说,掩模的基底材料可以是合成的熔融石英,而防护表层可以是铝。可将铝真空沉积到熔融石英基底材料上,其沉积厚度约为600nm。在防护覆盖表层上用标准的半导体工业光刻和湿腐蚀工艺技术制成掩模图案。
采用照相机可将光学系列30,34,36,38,42和掩模26正确地联成一线,并进行距离和高度的正确测量。掩模26的初始高度可用本技术领域中技术人员公知的设备平移台24来调节。圆柱形镜头42和镀层衬底20正面之间距离是确定入射激光束宽度和通量或能量密度的一个参数。掩模26和镀层衬底20之间的距离称之为路径。该路径最好不大于2mm长,最好是约50到100mm长。
图2图示了一例可由本发明工艺制成的产品,而该工艺本身具有创造性。聚合物衬底52上形成有铜镀层46的图案,可用作RFID天线。RFID广泛用于识别物件或人以及电子物件监视。一般为矩形、象条子的系列区域48是镀层(例如铜)的组成部分,这部分未暴露于电磁能量通量并保持着与衬底52的粘合。把区域48分开的线条49,在图案中央区域且对应于镀层衬底部分,在通常矩形阵列中条状回路图案外面的区域未被掩模所保护,且将离开区域48的镀层在工艺过程中除去。在图3的截面图中,人们可以看到条状区域48伸出到衬底52表面上,而将离开区域48的其余镀层除去。
图4和图5说明本发明物件清净度的优点。图4基本上示出视场中没有碎屑,该视场是一个有创意的形成图案衬底的区域,离开这个区域按照本发明工艺在处理后已经将金属除去。另一方面,图5示出了留在相同金属镀层衬底类型的未曝光区域中的金属碎屑如条纹,而这个衬底是用激光消融来形成图案的。
本发明将用下面的实例作进一步说明,这些实例是示范性的并非用来限定本发明保护范围。实验工作中,用下列测试方法。
用分光光度计来决定光波长和适于界面瓦解的能源。将镀层衬底的镀层表面层放在分光光度计(Lambda 900型可从Perkin-Elmer,Norwalk,Connecticut获得)下,将该表面镀层的吸收作为波长函数进行测定。一般来说,会选择200nm和2μm之间的一个波长,在该波长下镀层具有最大吸收。然后,部分基于该能源波长工作范围中的波长是否被镀层充分吸收来选择能源。
用两种方法来评估镀层和衬底层之间的粘合力,并称之为层间粘合力。这两种方法是用来确定该层间粘合力是否能使已瓦解界面上的镀层有选择地除去,而不会除去未被瓦解界面上的镀层。方法A是定性的测试而方法B则是定量的测试。
方法A中,将分别约15cm×12cm的两种不同压力灵敏的粘合带(PSA)加到镀层衬底的镀层表面。带子1是一种具有相对弱粘合力的PSA带,以丙烯酸酯为基底的带子(Scotch Brand N0.810魔术带),而带子2是一种具有相对强粘合力的PSA带,以KratonTM块状共聚物为基底的带子(Scotch Brand NO.396封箱带)。用重量为1.5kg宽为5cm的滚筒在每个带子上通过一次使得每个带子具有未与镀层表面粘合的一个末端。让这两条带子静置一分钟。然后用手抓住每个带子的自由端并把带子以约每秒2cm速度按约180度从表面反向剥离。若镀层被带子1除去,层间粘合力便很可能不够。正好是未被瓦解界面上的镀层很可能随已瓦解界面上的镀层一起被除去。若该镀层未被带子2除去,界面粘合力对于允许让本发明的后续去除技术除去已瓦解界面上的镀层来说,便很可能太大了。
方法B中,测定了从衬底上除去镀层所需的力。衬底上的金属性镀层可能需要特殊制作的具有比在测试中用来作防止镀层过早撕裂的应用较大厚度的测试样品。准备了宽为5mm的镀层材料(例如铜)的具有表面狭条的测试狭条。用一薄刀片(例如scalpel)人工将镀层表面狭条的一个尾端与衬底分隔开来。于是该样品被粘着于平台系统,该平台系统响应离衬底90度的镀层垂直剥离可作水平移动。用速度约为每秒0.17cm工作的力测量设备(InstronTM1122型,可从Instron Corp.,Canton,Massachusetts获得)来平滑地完成剥离。若镀层和衬底之间的粘合力在约40到700g/cm之间,便可用本发明来实现合适的图案形成。实例1-3,对比例1-2
把金属镀层的衬底曝光于能源的足够的辐射下以瓦解在金属和衬底之间的界面。该金属镀层的衬底用一金属镀层(铜,在真空中用一电子束蒸发镀层至250nm厚度)的有机共聚物衬底(PETG,包含TiO2填料和具有厚度为125μm,可从VPI,Chebogan Falls,Wisconsin获得)来构成,并具有325mJ/cm2的消融阈值和190mJ/cm2的亚消融阈值通量。
用紫外能源(LP×315型150瓦激态基态复合激光器,可从德国LambdaPhysik获得),利用氟化氪(KrF)气体以产生248nm的紫外辐射。启动该能源以形成一重复频率为75Hz、脉冲宽度为10ns、能量输出为每脉冲750mJ的光束。该光束通过由光束成型器(HY-120型Excimer Laser Beam Shaper,OpterS.A.制造)组成的光学系列,随后是均质器,然后是单一的平一凸透镜。均质器是一个平一凸圆柱形透镜阵列,各透镜的焦距为16mm。单一透镜是焦距为103mm的平一凸圆柱透镜。激光光束在进入单一平凸圆柱形透镜前在水平方向扩展到约20cm。金属镀层衬底的金属表面与光束成型器、均质器和最接近金属表面的圆柱形透镜的各个表面之间的距离分别为670mm,620mm和93mm。最后所得的成型光束,其截面长为200mm、宽为0.76mm,入射到铜镀层上。
这个非常长和狭的光束从光学系列通过经过形成图案的掩模(由EQZ级的熔融石英板制成,可从Hoya,Corp.,Sheltor,Connecticut获得),该掩模是用铝真空镀层的,其厚度约为600nm,并用标准光刻和湿腐蚀技术有选择地把铝除去形成图像。然后,该光束通过防护长板条(OPP级7μm厚,聚丙烯,可从Bolmet Inc.,Dayville,Connecticut获得),把该长板条调节到与金属表面接触,与形成图案的掩模的间距为25μm。在铜表面的光束能量密度或通量为220mJ/cm2(由一Gentec Inc.,Quebec,Canada的有孔焦耳计ED-500型测定),该能量密度足以瓦解金属和衬底之间的界面。
形成图案的掩模和金属镀层衬底相对于成型光束的相对位置用线性平移台(OFL-1515型,可从NEAT Technologies,Lawrence,Massachusettes获得)来控制。平移台以线性速率为5.9cm/s移动。最后的光束分布由于连续的脉冲有12%的重叠。防护长板条和Cu/PETG衬底这两者都以5.9cm/s按平行于掩模行程的方向作移动,以形成一最后得到的约8.7cm×5.5cm的曝光矩形面积。在这矩形面积中,通过比较样品经过曝光和未曝光部分,掩模图案可直观地看到。透过掩模经曝光的金属表面较之于被掩模覆盖而未曝光的金属表面显得有点暗淡,但没有铜被激态基态复合激光辐射除去。
然后将经过曝光的金属镀层衬底的样品放入具有两个不透水的超声换能器(由EMLX30-12型发生器激励的LP610-6型不透水超声换能器,两者皆可从Branson Cleaning Equipment CO.,Shelton,Connecticut获得)的温度20℃水浴中。将样品金属表面放在离换能器18mm处约4秒,并把换能器的振幅限止到峰一峰值为18μm(0.7密耳)以除去铜/PETG界面瓦解区域的金属。这种超声处理,结果使经过曝光的铜而非未经曝光的铜全部被除去。铜镀层中的图案具有良好的分辨率,该精细特征与75μm宽的金属线条和75μm宽的间隔一样小。还有各线条间没有电短路或各线条中没有空段。
实例2和3除了通量分别为200和300mJ/cm2外,其制作和测试都与实例1一样。铜镀层中的图案具有良好的分辨率。该精良特征是如75μm宽的金属线如751μm宽的间隔一样小。还有,各线条间没有电短路或在各线条中没有断裂。
作为对比,对比例1和2除了激光的输出能量外,其制作与实例1相像。对比例1曝光于通量为150Jm/cm2,而对比例2则曝光于通量为400Jm/cm2。对比例1中经曝光的金属没有被去除,因为所用的通量不足以瓦解该界面。对比例2中,在形成图案的铜中观察到电短路,因为该通量足以消融该金属并且某些消融的熔融金属再沉积到样品的金属镀层表面。实例4
本例说明了不同的能源对图像特性的影响。
实例4利用类似于实例1的方法来制作,只是用不同的能源和光学系统,改变了某些条件,并使用不同的清洁方法。能源是红外激光(2660型Nd:YAG红外激光器,可从Excel Technology Inc.,Hauppange,New York获得),其中工作波长为1.06μm,重复频率为2000Hz,每脉冲能量为0.6mJ,以及脉冲宽为200ns。入射到金属镀层上的激光是一个圆点或尖点,和实例1中的直线或狭窄矩形光(示于图1)形成对比。光学系列仅由一焦距为10cm的圆形平一凸透镜组成。没有光束成型器,均质器或圆柱形透镜。没有用掩模和防护长板条。抵达金属表面最后得到的通量由如焦耳计(J3-09型,可从Molectron,Inc.Portland,Oregon获得)所测定的激光能量输出和辐射到金属表面的面积所确定,计算得到为350mJ/cm2,对该波长来说这个值低于从衬底消融该金属所需的通量。平台以速度为20cm/s作移动,结果造成金属表面上连续脉冲两两间有20%的重叠。激光每次通过后以平移台第二轴的交叉长板条移动所获得的线条间隔对平行线条纹曝光。
用YAG红外激光曝光,铜不会从PETG表面上除去,但红外辐射下曝光的区域可以根据与未经曝光区域在反射性上的差别检测出来。该金属层经曝光区域用下列方法来除去。将一覆盖压敏粘合剂的滚筒在金属镀层衬底的金属镀层一侧移动通过一次。该滚筒宽20cm、重量约4.5kg。在金属镀层薄膜上用肉眼观察的宽为50μm的线条和间隔表明,处于界面瓦解位置的经曝光区域上面的金属全部被除去,而界面未瓦解区域上面则全部完好无损。实例5
本例说明衬底上的金属氧化物镀层的应用。
除了采用金属氧化物镀层衬底和能量输出减少至约650mJ之外,实例3的制作与实例1一样,金属氧化物镀层衬底由经过氧化铟锡溅射镀层所获得的电导率为80欧姆/平方的聚酯所制成,如NO.OFC80可从CourtauldsPerformance Films Inc.,Canoga Park,California获得。将光学系列配置成在金属氧化物表面将入射的激态基态复合激光光束形成为150mm×0.89mm的矩形。在该矩形中对来自激态基态复合激光器的能量进行调节以获得所计算的通量约80mJ/cm2,低于该波长从该衬底上消融该镀层薄膜所需的90mJ/cm2的消融阈值。连续脉冲最后的光束分布有10%的重叠。后来的图案具有良好的分辨率,其精细特性小到50μm宽的线条和间距。实例6
本例说明不同衬底类别的应用。
除了采用不同衬底和减少了通量(能级约为650mJ)之外,实例6的制作与实例1中的一样。金属镀层衬底由经过铜溅射镀层以获得镀层厚度约为250nm的聚酰亚胺制成。用于瓦解镀层衬底界面的最后得到的亚消融通量经过计算为170mJ/cm2,低于该波长从该衬底上消融该金属所需的约为300mJ/cm2的消融阈值。后来的图案具有良好的分辨率,其精细特性小到50μm宽的线条和间距。实例7
本例说明一有机镀层的应用。除了材料与激光条件不同之外,实例7的制作类似于实例1的方法。在聚对苯二甲酸乙二醇酯(PET)衬底上喷射一层镀层厚度为3μm的清洁丙烯酸酯镀层(可从Spray On,divison of SherwinWilliams Co.,Bedford Heights,Ohio获得,产品编号为#02000)。让这镀层在周围条件下固化一小时。该镀层/衬底系统的消融阈值为100mJ/cm2。将激光能量调节到允许获得每脉冲450mJ的能量输出并提供足以瓦解丙烯酸酯和PET衬底之间界面达65mJ/cm2的能量通量。丙烯酸酯镀层不会被激态基态复合激光的曝光从PET表面上除去,但曝光于辐射下的区域可从未曝光区域的反射率差异检测出来。超声处理结果造成经过曝光的丙烯酸酯而非未经曝光的丙烯酸酯全部除去。丙烯酸酯中的图案具有良好的分辨率,其精细特性小到75μm宽线条和75μm宽间距。
为了说明本发明,上面虽讨论了某些有代表性的实施例和实例,但对本技术领域中的技术人员来说,显然在不背离下面权利要求书中提出的实质或范围的情况下,本发明可以作种种变动和改良。
Claims (18)
1.一种成像表面制作方法,其特征在于,包括:
A.提供一种衬底,具有镀层和界面,其中包括该镀层和衬底彼此最接近的区域;
B.将镀层总面积其中至少一部分暴露于足以瓦解该界面但不足以消融该镀层的电磁能量通量;以及
C.除去与所瓦解的界面区域部分对准的镀层部分。
2.如权利要求1所述的方法,其特征在于,该衬底选自由聚酯,聚碳酸酯,聚乙烯,聚酰胺,聚氯乙烯,聚苯乙烯,聚丙烯,和聚酰亚胺所组成的类中。
3.如权利要求1中所述的方法,其特征在于,该电磁能量选自由闪光灯光照和激光光辐射所组成的类中。
4.如权利要求3所述的方法,其特征在于,该电磁能量是经过成型并聚焦到镀层表面上,并且其通量在消融阈值通量的30%至99%之间的激光辐射。
5.如权利要求4所述的方法,其特征在于,该激光辐射经成型成为具有近似矩形横截面的光束。
6.如权利要求1所述的方法,其特征在于,该镀层和衬底之间的粘合力在约40和700g/cm之间。
7.如权利要求1所述的方法,其特征在于,步骤B还包括在一配置成有一掩模位于衬底和电磁辐射源之间的情况下将镀层面积其中至少一部分暴露于电磁辐射中,该掩模和该衬底之间的距离称为路径。
8.如权利要求7所述的方法,其特征在于,该路径不大于2mm。
9.如权利要求1所述的方法,其特征在于,该镀层是一有机材料。
10.如权利要求1所述的方法,其特征在于,该镀层是由金属、金属氧化物以及金属合金所组成类当中选出的材料制成的。
11.如权利要求10所述的方法,其特征在于,该镀层选自由铜,银,镍,铬,锡,金,铟,铝及其合金所组成的类中。
12.如权利要求1所述的方法,其特征在于,步骤C中还包括选自下列的一种方法:
A.用超声振动在液体介质中处理经镀层的衬底,直至与界面中所瓦解部分对准的镀层部分从衬底表面上除去为止;
B.用一种粘合剂与经镀层的衬底表面相接触,该粘合剂足以有选择地从经镀层的衬底上提起与所瓦解界面部分对准的镀层部分,但尚不足以从经镀层的衬底上提起与未瓦解界面部分对准的镀层部分;以及
C.用一种温和液体或气体的高速流与暴露于电磁辐射中的衬底表面相接触。
13.如权利要求1所述的方法,其特征在于,界面处有一连接层,还除去与步骤C中除去的镀层部分相对齐的连接层部分。
14.一种光学系列,其特征在于,包括按以下顺序配置的下列元件:
A.一光束成型器,包括焦距至少为20mm的两个半圆柱形透镜;
B.一均质器,与光束成型器产生的成型方向相正交取向使光束实现均质化;以及
C.一圆柱形透镜。
15.如权利要求14所述的光学系列,其特征在于,该均质器包括一配置成使某一维方向进入该阵列的光束实现均质化的小透镜阵列。
16.一种成像物件,包括一所具有图像形成图案的共聚物衬底,其特征在于,不具有
A.热畸变;
B.包括制作图像的材料或这种材料分解产物的碎屑;
C.光致抗蚀剂;以及
D.图像的凹蚀。
17.如权利要求16所述的成像物件,其特征在于,该共聚物衬底包括聚酯。
18.如权利要求16所述的成像物件,其特征在于,所形成图案的图像是一天线。
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CN105829970A (zh) * | 2013-10-30 | 2016-08-03 | 荷兰应用自然科学研究组织Tno | 包括电路图案的基底、用于提供包括电路图案的基底的方法及系统 |
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JP2002535701A (ja) | 2002-10-22 |
WO2000042472A1 (en) | 2000-07-20 |
KR20010112240A (ko) | 2001-12-20 |
US6399258B2 (en) | 2002-06-04 |
US20010006766A1 (en) | 2001-07-05 |
EP1141776A1 (en) | 2001-10-10 |
EP1141776B1 (en) | 2009-06-03 |
US6203952B1 (en) | 2001-03-20 |
DE69940959D1 (zh) | 2009-07-16 |
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