CN1348570A - 通过滚压制造无触点卡的方法及用该方法制造的无触点卡 - Google Patents

通过滚压制造无触点卡的方法及用该方法制造的无触点卡 Download PDF

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CN1348570A
CN1348570A CN00806628A CN00806628A CN1348570A CN 1348570 A CN1348570 A CN 1348570A CN 00806628 A CN00806628 A CN 00806628A CN 00806628 A CN00806628 A CN 00806628A CN 1348570 A CN1348570 A CN 1348570A
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延·利梅勒特
海亚特·艾尔亚梅尼
皮埃尔·沃尔普
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Thales DIS France SA
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Abstract

本发明涉及用于制造卡形式的便携物体的方法,并且该便携式物体包括:便携物体主体,其包括塑料支承片材(12)、塑料结合片材(18)、以及第一覆盖片材(19)和第二外覆盖片材(20);设置有两个天线端子(13)的天线(11);以及集成电路芯片(14),其结合在结合片材(18)中并且电连接到一个天线端子(13)上。本发明的方法特征在于,该方法包括下面步骤,根据这些步骤:滚压其上安装带有结合片材(18)的芯片(14)的支承片材(12),从而得到第一滚压单元,且在接下来的步骤中,第一滚压单元覆盖有第一(19)和第二(20)外覆盖片材。本发明特别适用于通过热滚压制造无触点卡。

Description

通过滚压制造无触点卡的方法 及用该方法制造的无触点卡
                       技术领域
本发明涉及制造具有卡形式的便携物体的方法，特别是这样的物体，它首先包括由被外部覆盖片材或覆盖面覆盖的塑片片材构成的塑料主体，并且其次包括两个端子连接到嵌于卡体中的集成电路芯片连接焊盘(pad)上的天线。
                       背景技术
这些卡形式的便携式物体适合于在卡体天线和相关读取器天线之间的感应耦合的辅助下形成电接触。它们特别用作徽章或通行权以接近所保护的事物。
为了制造这些物体，该方法传统上如图1和2所示进行。
首先，聚碳酸酯片材(PC)以四色胶版印刷。PC的第一片材1的前面和第二片材2的后面被印刷。
此外，之前已经设置了突起4的预定数量的芯片3安装在PVC支承片材5上，从而将所述各芯片3的连接焊盘电连接到丝网印刷到支承片材5表面上的天线6端子上。密封树脂7接着沉积在连接位置以及芯片3的活性表面(active surface)上。
接着，在已经将热活性胶丝网印刷到各片材上之后，以下列顺序将下述部件叠加：第一外覆盖片材8、PC的第二片材2、承载芯片3和天线6的支承片材5、用于结合该芯片3的片材9、PC的第一片材1和第二外覆盖片材10。片材5、9、8和10是PVC片材。这样就可得到叠加的单元，其中各种片材的厚度如下：
-第一外覆盖片材：50微米
-第一PC片材：150微米
-结合片材：300微米
-支承片材：190微米
-芯片：260微米
-第二PC片材：150微米
-第二外涂层片材：50微米
然后根据所确定的温度和压力操作过程，该单元经受第一接着经受第二热滚压。特别是，在大约140℃温度下进行的第一滚压用于经由热活性胶的活化作用将构成单元的各片材胶粘，并且确保芯片3结合进结合片材9中，而且类似地在大约140℃的温度下进行的第二滚压用于首先提高该单元各种片材之间的粘结性，其次改善所述单元的表面状况。
接着切割滚压单元，并且得到如标准ISO7816-1所定义的卡形式的最终便携式体，其具有大约0.760mm的厚度、85mm的长度和大约54mm的宽度。
然而，上述方法具有某种缺陷。
它需要存在两种主要的热塑性材料：PC和PVC。目前，大约150℃的PC的玻璃质转变温度高于只有大约70℃的PC的玻璃质转变温度。因此，在第一和第二滚压过程中，PC没有达到其玻璃质转变温度。这就是为什么必须使用胶来将各种片材胶粘到一起的原因。
此外，PC胶版印刷的控制是不完善的，连同这种塑料材料的切割，造成卡具有缺陷。
当然，为了减轻上述方法的缺陷，人们已经考虑到用PVC片材替代PC片材。然而，所得到的卡将在其表面上和芯片上方及下方的垂直线上显现出表面缺陷，这些缺陷包括在这些位置的白色线迹的存在，白色线迹是由于滚压单元各种片材的PVC的聚合和解聚作用，且特别是在不同于卡体其余部分中存在的条件的特定条件中的覆盖片材的聚合和解聚作用所引起的。
                        发明内容
本发明致力于解决的问题包括使制造卡形式的便携物体的方法具体化，其中便携物体包括：
-便携物体主体，其由塑料支承片、塑料结合片材、以及第一和第二外覆盖片材构成；
-设置有两个天线端子的天线；以及
-集成电路芯片，其设置有两个连接焊盘，所述芯片结合在结合片材中，所述连接焊盘每一个电连接到一个天线端子上，
所述方法包括下面步骤，根据该步骤：
-芯片安装在支承片材上，
减轻上述缺陷特别是使之可能避免使用PC而得到无外观缺陷的卡的方法。
鉴于该问题，本发明的解决方案包括提供所述类型的方法，其特征在于，它包括下述步骤，该步骤为：
-滚压其上安装了带有结合片材的芯片的支承片材，从而得到第一滚压单元，其中芯片结合在结合片材中，在接下来的步骤中，
-第一滚压单元覆盖第一和第二再次覆盖(recovering)片材。
因此，通过以两步骤处理，得到第一PVC滚压单元并然后通过用覆盖片材覆盖该第一单元，就可以只使用一种给定塑料，以用于卡形式便携物体片材的制造，特别是避免了使用PC而所得到的卡无外观缺陷。
                         附图说明
下述结合附图的非限定性的说明清楚地示出了本发明在实际中是如何应用的。
图1是示出根据现有技术制造卡的方法的分解剖视图；
图2是示出根据现有技术的方法所获得的卡的剖视图；
图3是示出根据本发明制造卡的方法的滚压步骤的剖视图；
图4是示出基于本发明的滚压步骤获得的第一单元的剖视图；
图5是示出用于以本发明的覆盖片材滚压第一单元的步骤的分解剖视图；
图6是示出根据本发明的方法获得卡的剖视图。
                     具体实施方式
本发明的目的是提供卡形式的便携芯片物体(chip object)。这些芯片物体尤其在标准ISO7810和ISO7816、暂行标准ISO14443和标准ETSI/GSM11.11和ESTI/GSM11.14中定义，该标准的内容在本文件中引用作为参考。
有利的是，这些物体的制造在大的片材上完成。例如，这些片材的宽度大约为22cm、其长度大约为32cm。因此，在切割之后快速获取较大数量的卡是可行的。在所述示例中，该数量大约为10。
然而，为了便于阅读以下描述，本发明对单张卡的制造进行主要描述。
根据本发明，为了制造一张卡，天线11丝网印刷到支承片材12表面上。
支承片材12是塑料的，特别是热塑性的，并且优选地由具有大约70℃的玻璃转变温度及大约190微米厚度的PVC制成。
天线11为由填充银的环氧基导电涂料形成的三螺旋的螺旋形式，而且其末端构成彼此靠近设置的两个端子13。
在接下来的步骤中，集成电路芯片14安装在天线11的端子13上，从而将所述芯片14的接触焊盘15连接到天线11的端子13上。
该芯片14的形状近似于平行六面体和厚度为260微米且边长为2毫米的长方体。它包括设置有至少两个接触焊盘15的活性表面。这些焊盘15设置有由热塑性或硬塑性(duroplastic)导电聚合物的突起16或凸缘，诸如填充银的环氧基聚合物。
密封树脂17以液体形式沉积在芯片14对应于其活性面的一侧。该密封树脂在芯片14下面经由毛细管作用迁移，涂覆连接元件，也就是接触焊盘15、天线11的突起16或端子13，并且将芯片14密封到支承片材12上。
然后，如图3所示，结合片材18叠置在支承片材12上，在该支承片材上已经安装了芯片14。该片材18是塑料片材，特别是热塑性的，并且优选是具有低玻璃质转变温度的热塑性片材。其尤其是由玻璃质转变温度大约为70℃的PVC制造。
根据本发明，所获得的叠加单元依照一特定的操作过程，在大约140℃的温度和压力下滚压。例如，该单元经受140℃的温度和10巴的压力10分钟，然后压力增加持续7分钟，直到达到100巴，这时所述压力稳定持续4分钟。然后该温度降低到20℃，而且该单元经受200巴的压力持续18分钟。
图4示出了所获得的第一滚压单元。在该第一单元中，芯片14结合有结合片材18，所述片材18实际上已经经受了如此的温度和压力条件，以便它已经熔融，而使所述芯片14能够集成。该第一滚压单元称作镶嵌物。它可被存储和处理，而无损害芯片14或天线11的风险，这些元件完全埋置在所述单元中。
在本发明另一步骤中，第一覆盖片材19和第二覆盖片材20在第一片材19前侧和第二片材20后侧以四色和反转图像胶版印刷。这些片材19、20是塑料的并尤其是热塑性的，而且优选地由具有大约50微米厚度的PVC制成。
如图5所示，第一滚压单元接着覆盖有两个覆盖片材19、20。第一片材19直接覆盖结合片材18，而第二片材20直接覆盖支承片材12，所述片材19、20的印刷侧分别与所述片材18、12接触。本发明的该步骤，即其中第一单元被覆盖本发明的步骤可以优选地伴随着带有片材19、20的所述第一单元的第二滚压步骤。根据允许两个覆盖片材与第一滚压单元焊接在一起的所述类型的温度和压力操作过程，进行第二滚压步骤。实际中，在该操作过程中达到的温度大约为140℃。
由此，可以得到可被切割成卡形式的第二滚压单元。
所得到的卡实际上只包括四个由片材19、12、18和20构成的最厚部分，以及由片材12承载并结合入片材18的芯片。所有这些最厚部分优选地由相同的塑料材料即PVC构成。

Claims (6)

1.一种用于制造卡形式的便携物体的方法，并且便携物体包括：
便携物体主体，其由塑料支承片材(12)、塑料结合片材(18)、以及第一覆盖片材(19)和第二外覆盖片材(20)构成；
设置有两个天线端子(13)的天线(11)；以及
集成电路芯片(14)，其设置有两个连接焊盘(15)，所述芯片(14)结合在结合片材(18)中，所述两个连接焊盘(15)每一个电连接到一个天线端子(13)上，
所述方法包括下面步骤，根据该步骤：
芯片(14)安装在支承片材(12)上，
其特征在于，所述方法还包括下面步骤，根据这些步骤：
滚压其上安装带有结合片材(18)的芯片(14)的支承片材(12)，从而得到第一滚压单元，其中芯片(14)结合在结合片材(18)中，在接下来的步骤中：
第一滚压单元覆盖了第一(19)和第二(20)外覆盖片材。
2.如权利要求1所述的方法，其特征在于，支承片材(12)、结合片材(18)以及第一(19)和第二(20)外覆盖片材是由热塑性材料即PVC制成的。
3.如权利要求1或2所述的方法，其特征在于，第一覆盖片材(19)直接覆盖结合片材(18)，而且第二覆盖片材(20)直接覆盖支承片材(12)。
4.如权利要求1、2或3中任一项所述的方法，其特征在于，第一滚动单元覆盖第一(19)和第二(20)外覆盖片材的步骤伴随带所述第一(19)和第二(20)覆盖片材的第一滚压单元的滚压。
5.一种滚压卡形式的便携物体包括：
便携物体主体，其包括塑料支承片(12)、塑料结合片材(18)、以及第一外覆盖片材(19)和第二外覆盖片材(20)；
设置有两个天线端子(13)的天线(11)；以及
集成电路芯片，其设置有两个连接焊盘(15)，所述芯片(14)结合在结合片材(18)中，所述连接焊盘(15)的每一个电连接到一个天线端子(13)上，
其特征在于，还包括：
直接覆盖结合片材(18)的第一覆盖片材(19)，以及直接覆盖支承片材(12)的第二覆盖片材(20)。
6.如权利要求5所述的方法，其特征在于，支承片材(12)、结合片材(18)和第一(19)和第二(20)覆盖片材由PVC制成。
CNB008066280A 1999-04-29 2000-04-28 通过滚压制造无触点卡的方法及用该方法制造的无触点卡 Expired - Lifetime CN1204529C (zh)

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