CN1495587A - 把导热销保持在导热扩散板内的方法和装置 - Google Patents
把导热销保持在导热扩散板内的方法和装置 Download PDFInfo
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Abstract
本发明公开一种导热扩散板,其具有形成于其中的多个销孔(22)和多个可在销孔内滑动的导热销(18)。每个导热销具有外围部分和形成于外围上的凸缘(82)。保持部件(110)位于每个销孔附近。保持部件和凸缘互相作用,以便将销保持在销孔内。
Description
技术领域
本发明涉及一种扩散板,该扩散板用于将来自电子元件的热能传递给散热片,尤其涉及一种在板内设有导热销的扩散板。
背景技术
如计算机的电子装置包含很多电路板。每个电子线路板通常设有其它电子元件,例如半导体微处理器芯片,这些元件被安装在电路板上并与其电连接。通常电子元件与电路板保持一定角度地连接到电路板,这样电子元件的上表面也与电路板保持一定角度。另外,电子元件的上表面具有轮廓和凹陷,使得上表面不是平直或连续的。在运行过程中,当电子元件和电路板之间传送电子信号时,电子元件产生大量的热量。通常,将散热片连接到电子元件上吸收并消除电子元件产生的热量。因为电子元件的表面是倾斜的或间断的,大多数散热片不能充分地与电子元件接触。从而,散热片与电子元件直接接触时不能充分有效地吸收电子元件产生的热量。
过去,一种含有润滑剂和陶瓷、硼或铝之一的导热涂层被设置于电子元件的上表面,并覆盖适应衬垫,散热片位于适应衬垫上面。导热涂层和适应衬垫接合电子元件的上表面轮廓、凹陷和角度,将电子元件的热量通过适应衬垫传递给散热片。
然而,导热涂层和适应衬垫具有若干缺点。首先,尽管导热涂层导热性比空气好,却不能十分有效地将电子元件的热量传递给散热片。因此,适应衬垫很厚而不能有效导热。
最近,一种金属传热介质被用于电子元件和散热片之间,该介质提供一种金属扩散板和金属可变间隙界面(VGI)。扩散板具有带至少一个可变间隙界面的前表面和后表面。可变间隙界面具有一个带有一阵列销孔的金属基座,每个销孔的底部安装一个弹簧,该弹簧支撑一个圆柱形金属销,这样金属销的一部分伸出销孔入口的外面。该销可以被向下按压进入销孔,此时销和销孔底部之间的弹簧被压缩。
在运行中,销、金属基座和销孔内部用一层导热涂层覆盖。扩散板被翻转并安装于电子元件的上部,这样销与电子元件的表面相配合并抵靠在其中。销支撑散扩散板并被压入销孔。多组销被安装于扩散板上,能够与具有不同角度、轮廓或凹陷的电子元件上表面相配合。这样,尽管电子元件上表面具有多种形状特征,多个销的使用允许该可变间隙界面与电子元件的上表面大部分充分接触。扩散板的后面覆盖一层导热涂层并装有散热片,于是位于扩散板的后面顶部上。
热量从电子元件的上表面传递给销,销再依次传递热量给弹簧和金属基座,通过扩散板的后面传递热量给散热片。利用置于金属基座内的可缩回金属销和金属扩散板可以有效地将电子元件的热量传递给散热片。另外,导热涂层填补电子元件与可变间隙界面、扩散板和热池之间的空隙以进一步加强该组件的热传导率。
然而,可变间隙界面也有诸多缺点。近来提出一种可变间隙界面,销被松弛地装在销孔内,销端部的导热涂层接触电子元件。这样,当可变间隙界面被从电子元件上拆卸下来时销可以从可变间隙界面内取出。另外,只要扩散板被翻转并准备安装于电子元件上时,销会从销孔内落下。
需要一种克服以上问题的可变间隙界面并提起有经验人员的其他关注。
发明内容
本发明涉及一种具有多个销孔和多个传热销的导热扩散板,其中每个销可以在销孔内滑动。每个传热销具有外围部分并且外围部分具有凸缘。在每个销孔周围设有保持部件。保持部件和凸缘相互作用以便把销保持在销孔内。
附图说明
图1是根据本发明实施例的扩散板的前面等角视图;
图2是图1扩散板的后面等角视图;
图3是根据本发明实施例的散热组件的侧视图;
图4是根据本发明实施例的可变间隙界面(VGI)的侧面剖视图,其中第一个销孔内有销,靠近的第二个销孔内空着;
图5是根据本发明实施例的VGI、弹簧和销的分解等角视图。
图6是根据本发明实施例的VGI、弹簧、销和敲击工具的分解等角视图,。
图7是根据本发明实施例敲击工具的局部等角视图。
图8是根据本发明实施例的与销配合的敲击工具和VGI金属基座的局部等角视图。
图9是根据本发明实施例的与销配合的敲击工具和VGI金属基座的侧面部分剖视图。
图10是根据本发明实施例的敲击工具与销和VGI侧面部分剖视图。
图11是根据本发明实施例的销的侧面部分剖视图。
图12是根据本发明实施例的容纳在销孔内销的侧面部分剖视图。
图13是根据本发明实施例的容纳销孔内销的侧面部分剖视图。
具体实施方式
图1是根据本发明实施例的扩散板10的前面等角视图。扩散板为矩形,由诸如铝一类的导热金属制成。扩散板10具有前面30,形成在前面中的导热可变间隙界面(VGIs)14从该前面延伸。该VGIs14呈方形,包括具有销孔22阵列的金属基座26(图4),销孔容纳对应的销18。销18具有导热性并且可缩进地保持于销孔22内,以使销18可在一定运动范围内被压入销孔。组装时,每个VGI 14的销18、销孔22以及金属基座26均被一层导热涂层46覆盖(图3),该导热涂层例如是润滑剂和陶瓷、硼、铝之一的混合物。
图2是图1中散热片的后面等角视图。散热片10具有平的后面34,该面在组装时也被导热涂层46(图3)覆盖。
图3是根据本发明实施例的散热组件54的侧视图。电子元件42(例如,硅半导体微处理器芯片)连接于电路板38上并且从该板延伸。然后将扩散板10定位在电子元件42上,从而使覆盖有导热涂层46的VGIs14的销18紧紧压在电子元件42的顶面168上,并在销孔22内被不等量压缩(图4),从而适应电子元件42的可变表面特征。然后将散热片50连接到扩散板10的后面34上,该面34也被导热涂层46覆盖。使用中,电子元件42产生热量,该热量通过导热涂层46传递给销18。销18部分缩回销孔22(图4)并传递热量给扩散板后面34,再通过另一层导热涂层46将热量传递给散热片50,该散热片吸收并散发多余的热量。
图4是根据本发明实施例VGI 14的局部侧剖侧视图,其中第一销孔22容纳销18,临近的第二销孔22是空的。每个销孔22具有延伸到金属基座内部的内壁58,该内壁58从金属基座26前面114的圆柱形入口或嘴62延伸到由具有一定角度的壁90所确定的尖形底部66。金属基座26的前面114围绕销孔22入口62的部分变形,从而构成保持物或保持部件110。
每个销孔22容纳并保持弹簧70和销18。弹簧70具有顶端106和末端86。销18为圆柱形并具有第一段74和第二段78。第一段74的直径比第二段78的直径小,这样,销18具有由第一段74和第二段78的外壁118和122所确定的阶梯状外表面。凸缘82位于第一段74和第二段78的交界处。第一段74具有上表面102,第二段78具有底面94。
使用中,弹簧70在底部66和销18之间被压缩在销孔22内。弹簧70的末端86接触底部66的倾斜壁(angled wall)90,弹簧70的顶端106接触销18的底面94。被压缩的弹簧70沿着箭头A的方向向上推动销18。销18的第一段74从销孔22的入口62向上伸出。沿金属基座26的上表面114延伸的保持部件110向下沿箭头B的方向接触凸缘82并对其施加作用力,这样销18的第二段78被保持在销孔22内并与弹簧70的顶端106配合。
销18还可以沿箭头B的方向更进一步进入销孔22,这样凸缘82不再与保持部件110配合,同时销18和底部66的倾斜壁90之间的弹簧70被进一步压缩。而且,保持部件110将销18保持在销孔22内,这样VGI 14可以被翻转而销18不从销孔22内落出。因此,VGI 14可以被安置在电子元件42(图3)上而销18不从销孔22内落出。另外,由于销18与电子元件42上表面168(图3)受阻力地配合,销18可以被进一步压入销孔22。因为每个销18单独缩进,VGI 14可以牢固地压在具有角度、不定或具有一定轮廓的上表面168上,同时每一个销18与上表面168配合。来自电子元件42的热量经由导热涂层46(图3)传递给销18。销18依次传递热量给弹簧70,弹簧再传给销孔22底部66的金属基座26。热量经由金属基座26、扩散板10(图2)的后面34(图2)以及导热涂层(46)传给散热片50(图3)。
图6是根据本发明实施例的VGI 14、弹簧70、销1和敲击工具126的局部等角剖面视图。敲击工具126具有带有头部134的圆柱形主体130。与头部134相对的、主体130的接触端138具有位于接触端138的相对两侧上并指向主体130外侧的两个圆形变形杆142。
图7是敲击工具126局部等角视图。主体130具有平整的销接触面146,该销接触面从接触端138回陷较短距离,从而确定可容纳销18的一部分的空腔139。当敲击工具126用来将销18安装到VGI 14上(图6)时,销接触面146与销18(图6)的上表面102(图6)配合。
回到图6,在组装过程中,首先将弹簧70插入销孔22。再将销18沿箭头B方向朝下插入弹簧70上面的销孔22中,这样销18的底面94与弹簧70的顶端106接触。销18置于弹簧70上以使销18的凸缘82伸出销孔22之外并高于金属基座26的前面114。然后敲击工具126在销18上方滑动,直到空腔139容纳销18的第一段74,销18的上表面102和敲击工具126的销接触面146(图7)接触。
如图8所示,敲击工具126朝下按压VGI 14,这样变形杆142与VGI 14邻近销孔22的入口62的上表面114接触。销接触面146(图7)按压销18进入销孔22以使凸缘82(图6)移动至稍微位于销孔22入口62周围的金属基座26的前面114下。然后敲击工具126沿箭头B方向击打头部134,从而通过变形杆142使入口62附近的金属基座26部分变形,形成保持部件110(图4)。
或者,在大量组装VGI 14过程中,敲击工具阵列被组装到按压器上。扩散板10(图1)的每个VGI 14定位于敲击工具阵列之下,以使每个销孔22与敲击工具对齐。朝下按压VGI 14使敲击工具一次使所有VGI 14入口周围金属基座26的上表面114变形。这样,将敲击工具阵列加入按压器可以大量地制成保持部件110(图4)。
图5是VGI 14、弹簧70和销18的局部分解等角视图,其中,销18的阵列被保持部件110保持在销孔22内。保持部件110通过变形杆142(图8)形成于金属基座26的上表面114中,该保持部件110位于每个销孔22的入口62的相对两侧。保持部件110接触销18的凸缘82并对其施加作用力,从而将销18保持在销孔22内。销18的第一段74部分可缩回地伸出销孔22。因此,VGI 14可以被翻转并置于电子元件42(图3)上以使销18的上表面102接触电子元件42的上表面168(图3)。
或者,围绕销孔22的入口62的所有材料都被带有圆柱形变形杆的敲吉工具变形,从而制成围绕入口62的环形保持部件,以便与每个销18的整个凸缘82接触。
图9是敲击工具126接触销18和VGI 14的金属基座26的局部侧剖视图。敲击工具126的主体130的内径由内壁148确定,外径由外壁150确定。主体130的内径大于第一段74的外径,但比第二段78的外径和销孔22的直径略小。主体130的外径大于第二段78的外径和销孔22的外径。变形杆142具有冲压凸缘154,该凸缘相对于水平轴158呈锐角地从主体的外壁150向主体130的内壁148延伸,从而确定出沿着外壁150的冲压尖端162。
如图9所示的敲击工具126处于对齐阶段,其中销18的第一段74容纳在敲击工具126的主体130内并位于变形杆142之间。敲击工具126位于VGI 14上,以便使冲压尖端162与围绕销孔22入口62的金属基座26接触。销接触面146与销18的上表面102接触,从而使销18被保持在销孔22中同时凸缘82稍微位于金属基座26的上表面114之下。因此,弹簧70被在销18的底面94和销孔22的倾斜壁90之间压缩。
图10是本发明实施例中敲击工具126、销18和VGI 14的局部侧剖视图。敲击工具126处于冲压阶段,其中敲击工具126沿着箭头B方向朝下冲击,以使冲击尖端162压入金属基座26的上表面114以及围绕销孔22的入口62的、上表面114的变形部分,从而形成保持部件110。保持部件110与销18的凸缘82配合并对其施加作用力,以便将销18保持在销孔22内。然后移走敲击工具126,并用该工具把其他的销18固定在销孔22内。
图11是根据本发明备选实施例的销200的侧剖视图。销200具有第一段204和第二段208,这两段具有相同的外径并被销200外周中的小凹槽212隔开。销200沿着凹槽212的部分的直径比第一段204和第二段208小。当弹簧70沿箭头A向上推动销200时,VGI 14的保持部件110容纳在凹槽212中,沿着凹槽212的凸缘216接触销200并对其施加作用力,从而将销200保持在销孔22中。如图9-10所示,通过使用敲击工具126围绕销200的凹槽212形成保持部件110。当VGI 14位于电子元件42(图3)上时,凹槽212容纳保持部件110,从而使销200可沿箭头B方向压入销孔22内。
图12是根据本发明实施例的销18的侧剖视图,其中,销18被保持在销孔22内。薄金属夹板300连接于金属基座26的上表面114并且具有直径小于第二段78的直径的孔。孔位于入口62周围并容纳销18的第一段74。夹板300具有下抵抗面304,该面接触销18围绕入口62的凸缘82并对其施加作用力。在销孔22内,弹簧70沿着箭头A所示方向向上推动销18,以便使凸缘82接触夹板300的下抵抗面304并对其施加作用力,从而将销18保持在销孔22内。当销18对着电子元件42(图3)放置时,销18则克服弹簧70的弹力被沿着箭头B所示方向压入销孔22中。
图13是根据本发明实施例的销400的侧剖视图,其中,销400被保持在销孔22中。销400具有外径相同的第一外段404和第二外段408,这两段被围绕销400延伸的外围凹槽412隔开。外围凹槽412包括下凸缘416和上凸缘418。薄金属夹板420连接至金属基座26的上表面114,并具有直径小于第一外段404和第二外段408外径的孔。孔位于入口62的周围,并容纳销400的外周凹槽412。夹板420具有下抵抗面424和上抵抗面430。下抵抗面424围绕入口62与销18的下凸缘416接触并对其施加作用力。较厚的帽440连接至夹板420并且具有直径基本等于销孔直径并略微大于第一外段404直径的孔。在销孔22内,弹簧70沿箭头A方向向上推动销400,以使下凸缘416接触夹板420的下抵抗面424并对其施加作用力,从而将销400保持在销孔22内。当销400位于电子元件42(图3)上时,销400沿着箭头B方向被压入销孔22,以使第一外段404的上凸缘418接触夹板420的上抵抗面430并对其施加作用力。当销18沿着箭头B方向被压入销孔22时,帽440环绕第一外段404以引导和支持第一外段404。
将销保持在VGI中的方法和装置提供了若干优点。使销孔入口周围的金属变形以便与销上的凸缘或凹槽接触配合,这样,当VGI翻转时,销保持在销孔内。因此,可以在定位时使用VGI,从而使销翻转并用于电子元件。而且,保持材料克服销孔内的压缩弹簧而将销保持在销孔中,这样,当VGI处于非配合状态,销的第一段总是能够伸出销孔外,而当VGI抵靠接触电子元件时,第一段可以被压入销孔。这样,当电子元件具有多种取向和不同的表面时,保持件使得销有效地传递来自电子元件的热量。
Claims (5)
1、一种具有多个销孔和多个导热销的导热扩散板,其中每个导热销在一个销孔内滑动,其特征在于:
每个导热销具有外围部分和形成于外围部分上的凸缘,保持部件位于每个销孔附近,该保持部件和凸缘互相作用,从而将销保持在销孔内。
2、如权利要求1所述的装置,其中,每个销孔包括内壁,保持部件包括内壁在销孔入口处的变形部分。
3、如权利要求1所述的装置,其中,保持部件是具有与销孔对齐的孔的夹板,该孔具有比销孔直径小的直径。
4、如权利要求1所述的导热扩散板,其中,每个销包括由具有不同的第一直径和第二直径的第一段和第二段所确定的阶梯状外表面,凸缘位于第一段和第二段的交界处。
5、如权利要求1所述的装置,其中,每个销包括沿其圆周形成的外围凹槽,外围凹槽的直径小于销的直径,外围凹槽包括所述凸缘,保持部件伸到外围凹槽内以便与所述凸缘互相作用。
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US10/238,341 US6890618B2 (en) | 2002-09-10 | 2002-09-10 | Method and apparatus for retaining a thermally conductive pin in a thermal spreader plate |
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CN113748751A (zh) * | 2019-05-07 | 2021-12-03 | 株式会社自动网络技术研究所 | 电路结构体 |
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US8273603B2 (en) * | 2008-04-04 | 2012-09-25 | The Charles Stark Draper Laboratory, Inc. | Interposers, electronic modules, and methods for forming the same |
US8017451B2 (en) | 2008-04-04 | 2011-09-13 | The Charles Stark Draper Laboratory, Inc. | Electronic modules and methods for forming the same |
CN102131371B (zh) * | 2010-11-11 | 2014-03-26 | 华为技术有限公司 | 一种导热装置及其应用的电子装置 |
US20160360639A1 (en) * | 2015-06-08 | 2016-12-08 | Advantech Co., Ltd. | Dynamic heat conduction system |
US9668380B2 (en) | 2015-09-29 | 2017-05-30 | Te Connectivity Corporation | Conformable thermal bridge |
US11829212B2 (en) * | 2021-09-27 | 2023-11-28 | Dell Products L.P. | Power distribution system for an information handling system |
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US3483826A (en) * | 1967-09-05 | 1969-12-16 | Acf Ind Inc | Method of and lever pin assembly in pump |
US4226281A (en) * | 1979-06-11 | 1980-10-07 | International Business Machines Corporation | Thermal conduction module |
US4235283A (en) * | 1979-12-17 | 1980-11-25 | International Business Machines Corporation | Multi-stud thermal conduction module |
US4528500A (en) * | 1980-11-25 | 1985-07-09 | Lightbody James D | Apparatus and method for testing circuit boards |
JPH02151055A (ja) * | 1988-12-01 | 1990-06-11 | Hitachi Ltd | 半導体装置 |
US6062870A (en) * | 1989-05-16 | 2000-05-16 | Labinal Components And Systems, Inc. | Electrical interconnects |
US5097385A (en) * | 1990-04-18 | 1992-03-17 | International Business Machines Corporation | Super-position cooling |
US5294830A (en) * | 1991-05-21 | 1994-03-15 | International Business Machines Corporation | Apparatus for indirect impingement cooling of integrated circuit chips |
US5382169A (en) * | 1994-01-14 | 1995-01-17 | Labinal Components And Systems, Inc. | Electrical connectors |
DE9404266U1 (de) * | 1994-03-14 | 1994-05-19 | Siemens Nixdorf Inf Syst | Kühl- und Abschirmvorrichtung für eine integrierte Schaltung |
US5805430A (en) * | 1996-07-22 | 1998-09-08 | International Business Machines Corporation | Zero force heat sink |
US5870286A (en) * | 1997-08-20 | 1999-02-09 | International Business Machines Corporation | Heat sink assembly for cooling electronic modules |
CN2333030Y (zh) * | 1998-06-19 | 1999-08-11 | 爱美达股份有限公司 | 具有抗转动力矩的中央处理器散热片 |
DE19924289A1 (de) * | 1999-05-27 | 2000-12-07 | Siemens Ag | Elektronisches Schaltungsmodul mit flexibler Zwischenschicht zwischen elektronischen Bauelementen und einem Kühlkörper |
CN2487111Y (zh) * | 2001-05-14 | 2002-04-17 | 友巨企业有限公司 | 散热器鳍片 |
US6591897B1 (en) * | 2002-02-20 | 2003-07-15 | Delphi Technologies, Inc. | High performance pin fin heat sink for electronics cooling |
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