CN1503992A - 高功率led - Google Patents

高功率led Download PDF

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CN1503992A
CN1503992A CNA028068084A CN02806808A CN1503992A CN 1503992 A CN1503992 A CN 1503992A CN A028068084 A CNA028068084 A CN A028068084A CN 02806808 A CN02806808 A CN 02806808A CN 1503992 A CN1503992 A CN 1503992A
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lens
led
anode
tube core
led assembly
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CN1330007C (zh
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J
汤玛斯·J·巴奈特
P�����ָ�˹��
肖恩·P·蒂林噶斯特
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Weldon Technologies Inc
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Abstract

所述的方法和系统是用于包括LED组件的一种系统。LED组件可包括一阳极，连接到阳极的阴极，连接到阴极和阳极的LED管芯，及位于由透镜、阴极和阳极限定的一腔体中黏滞的或硅树脂材料。黏滞的或硅树脂材料可以是凝胶，润滑脂，非弹性材料，或非液体材料。该方法和系统可进一步包括一安装装置，其中透镜机械连接到插口，卡销，或螺栓连接等方式的安装装置。该方法和系统可进而包括一阳极条带，该条带包括用来形成LED组件阵列的阳极阵列，并包括一载体条带，该条带包括容纳装置，容纳LED组件阵列。透镜的部分可或者以覆盖或者包含光可激发材料，或者黏滞材料可包括光可激发材料，使得系统发射白光。

Description

高功率LED
领域
各实施例一般涉及用于在制造发光二极管(LED)等的组装，这可提供更大的光输出和增加的可靠性。实施例的一种方式可产生光学上有效的LED，这种LED可产生每单位面积比当前业内可得的更高的照明。实施例的另一方式可提供一种装置，把器件机械附加到灯具或印刷电路板。实施例的另一方式可提供一种对于LED改进的组件，以及用于在条带上组装多个LED的方法，这更好地便于用于使用LED的组件的自动制造方法。实施例的另一方式可提供产生白色光的装置。实施例的另一方式可提供安装多个LED管芯的一种装置。
先有技术
制造LED发光元件的技术在业内被广泛述及，并为专业人员所熟知。此外，产生白色LED的技术在业内周知且有述。相关的专利包括：U.S.Patent No.5,813,752颁发给Singer et al.On September29，1998，标题为“UV/Blue LED-Phosphorus Devise With ShortWave Pass，Long Wave Pass Band Pass and Peroit Filters，”该文献描述了分层蓝色/UV LED半导体的使用，具有磷光体的顶层与用于产生白光的滤光器；U.S.Patent Nos.5,998,928与6,060,440颁发给Shimizu et al.分别在December 7，1999 and May 20，2000，且每一个标题为“Light Emitting Device Having A Nitride CompoundSemiconductor And A Phosphor Containing A Gamet FluorescentMaterial，”该文献描述了白色光LED的设计，采用蓝色LED以激发磷光体材料层，包括以铈激励的暗红色荧光材料和/或包括使用围绕磷光体的分散材料，该磷光体包含元件以扩散所得的照明。
各种LED组件结构的形成还在若干LED制造商的市售数据记录单(data sheet)中公开；例如参见技术数据记录单，用于Super FluxLED，by LumiLeds(Philips Lighting and Agilent Technology之间的合资公司)；SnapLED 150 LEDS，by LumiLeds；Six LED Hgh MountStop Light Array，by LumiLeds；Luxeon Star，by LumiLeds；SharkSeries，High Flux LED Illuminators，by Opto Technology，Inc。
背景
发光二极管(LED)是当电流通过时产生各色光的一种小型半导体器件。颜色基本上取决于LED管芯发光元件或芯片的化学成分。LED表现出对基于灯丝的发光器件的各种优势，诸如较长的寿命，较低的功率需求，良好的初始驱动特性，高抗震性及对重复电源切换的高耐受性。因为这些出色的特性，LED广泛用于诸如指示器和低功率发光应用。
近来，已经开发出具有高照明和效率的红色、绿色与蓝色(RGB)LED，并在大屏幕LED显示器中采用。这类LED显示器能够以较低的功率工作，并具有重量轻且表现出长寿命的出色特性。使用LED作为可替代的光源的应用正在成长。
即使其有这些正面的特性，由于该装置在从供给的电流产生光时并不是100％有效，LED芯片能够产生大量的热。因而，要采用散热器以驱散由LED产生的热，这通常通过LED本身的金属引线框提供。如果热不能被适当驱散，则由于不同的热膨胀系数所至应力要加在LED的各种内部元件上。某些制造商已经，但是以一种折衷的方式，生产出具有大散热器的更强大的LED。首先，如果带有大散热器的LED使用传统的方法进行焊接(即波动焊，回流焊)，来自焊接过程的热量传导到LED芯片，这可能引起LED失效。其次，如果使用非传统的技术(即巴(bar)焊或激光焊接)焊接LED，由于过程的热敏感性一般这必须由LED制造商进行。因而，LED制造商作为“板级(bord level)”元件提供高通量LED。但是这种结构并适合意向的最终产品设计物理空间要求。
此外，LED与一相关透镜的光耦合是效率低的。一般来说，LED由使用透光环氧树脂封装到基片上的半导体芯片组成。芯片(折射率n≈3.4)对环氧树脂(n≈1.56)的这一直接界面生成两种材料之间剧烈的折射率梯度。在光从高折射率介质向低折射率介质行进时，由于光不能逃逸由内部反射引起的封装而受到菲涅耳损失。因而，使折射率过渡最小化的材料或材料层，将降低否则将出现的菲涅耳损失。通过以具有LED芯片材料与环氧树脂之间中间值折射率的一层或多层光凝胶或液体(以下统称为“凝胶”)，代替透明的环氧树脂，将强化光子抽取因而光的输出。
进而，因为用来密封传统的LED芯片的环氧树脂在完全凝固时一般是刚性的，热膨胀能够在导线和LED芯片之间的粘合上引起一定程度的剪切和拉伸应力。通过把芯片和导线的粘合密封在凝胶而不是环氧树脂中，能够使导线粘合在正常工作条件下在凝胶内作某种运动，因而降低了芯片和导线粘合之间的剪切和拉伸应力。
最后，当接合到各种产品的应用时，LED(在其各种封装设计中)一般设计为组装到印刷电路板并使用焊接过程固定。然而，由于本发明的LED组件能够使用另外的机械过程(即抽头&插口，激光焊接等)组装，LED的使用对于自动制造过程更为灵活，使用比先前所需较少的板上空间，并能够适合种类更广泛的产品应用。本实施例LED组件的机械安装一般将较少或完全消除LED组装过程期间LED受到的热，因而消除了元件失效的主要根源。此外，LED装有整体的金属引线框架，提供了实际上比接合到环氧树脂印刷电路板上的传统LED所提供的更大的散热。
概述
一个实施例提供了包括一LED组件的一种系统。该LED组件包括一环形阳极与连接到环形阳极的阴极。该LED组件还包括连接到阴极和环形阳极的LED管芯，及连接到环形阳极的透镜。LED组件还包括位于由透镜、阴极和环形阳极限定的腔体中的黏滞材料。
另一实施例提供了一种系统，包括一安装装置和一LED组件。LED组件包括一带有中心开口的环形引线框架，连接到与中心开口相邻引线框架的散热器，连接到散热器并通过导线粘合到颜色框架的LED管芯，以及连接到引线框架的透镜。透镜包括一突起，该凸起用来把LED组件机械固定到安装装置。LED组件还包括位于由透镜、散热器和引线框架限定的腔体中的硅树脂材料。
另一实施例提供了制造带有LED组件的系统的一种方法。LED组件的制造包括以下步骤a)提供带有管芯杯的散热器，b)提供带有容纳散热器的同心开口的环形引线框架，c)把LED管芯连接到散热器管芯杯，d)把LED管芯通过导线粘合经过同心开口连接到引线框架，e)向由透镜、引线和散热器限定的腔体分配黏滞材料，以及f)把透镜连接到引线框架。
另一实施例提供了包括一LED组件的一种系统。该LED组件包括一环形阳极及连接到环形阳极的阴极。该LED组件还包括连接到阴极及环形阳极的一LED管芯，以及连接到环形阳极的一透镜。该LED组件还包括由透镜、阴极与环形阳极限定的一腔体。
另一实施例提供了包括一LED组件的一系统。该LED组件包括一阳极和连接到阳极的阴极。该LED组件还包括连接阴极与阳极的LED管芯及连接到阳极的一透镜。LED组件还包括位于由透镜、阴极和阳极限定的一腔体。
另一方式可以是，黏滞或硅树脂材料为凝胶，润滑脂，非弹性材料，或非液体材料。
另一方式可以是，该系统包括一安装装置，其中LED组件通过透镜机械连接到安装装置。
另一方式可以是，该系统还包括一阳极条带，该条带包括用来形成LED组件阵列的阳极阵列，以及载体条带，该条带包括容纳LED组件阵列的容纳装置。
另一方式可以是，透镜的一部分或者涂敷或包括光可激发材料，使得系统发射白光。另一方式可以是，硅树脂或黏滞材料包含光可激发材料，使得系统方式白光。
另一方式可以是，使用多个LED管芯。
附图的简要说明
通过参照附图阅读以下说明书和权利要求，对这些实施例所涉及的业内专业人员本发明进一步的特性将变得显而易见，其中：
图1A是LED组件一实施例的的剖视图；
图1B是一系统的实施例的剖视图；
图2是LED组件一实施例的的分解图；
图3是LED组件一实施例截面的局部剖视图；
图4根据几个实施例的阳极的透视图；
图5是包括一印刷电路板和LED组件的系统的另一实施例的示意图；
图6是包括一载体条带和LED组件的系统的另一实施例的示意图；
图7是带有多个LED管芯LED组件的另一实施例的分解图；
图8A是LED组件另一实施例的侧视图；
图8B是图8A的LED组件的底视图；
图9A是LED组件另一实施例的侧视图；
图9B是图9A的LED组件的底视图；
图10是包括壳体和LED组件的系统的另一实施例的示意图；以及
图11是包括载体阵列和LED组件的系统另一实施例的示意图。
优选实施例的说明
参见图1-4，示出系统100的LED组件10。系统100的LED组件10包括一环形阳极12，阴极14，LED管芯16和透镜18。这一黏滞材料20可以是透明的硅树脂凝胶或润滑脂，非弹性材料，非液体材料等。在其它实施例中，腔体22可包含液体，弹性或固体材料，或可不包含任何材料。
LED管芯16连接到阴极14的管芯帽24，并通过导线接合26连接到阳极12。LED管芯16可通过热和电传导环氧树脂等连接到管芯杯24。管芯杯24可具有反射面。阴极14通过使用连接材料28连接到阳极12，这可以是液晶聚合物等，只要材料是热传导的和电绝缘的。在向腔体22分配黏滞材料20之后，透镜18通过互补连接装置30(参见图3)连接到阳极12，这可以是倒刺或阳极保持接头，及连接装置31(参见图3)，这可以是容纳开口。透镜18还包括突起32，其可以是透镜脚，允许LED组件10可拆卸固定在插口方式的安装装置54的连接装置36中，其中对脚32通过从阳极12的周边部分延伸长的柔性延伸34向连接装置36加偏压。另外，如在图9-10可见，插口装置可直接接合到电灯器具，以消除对二次连接装置及印刷电路板的需要。在可拆卸固定到安装装置54之后，从安装装置54延长的延伸部分55被容纳在印刷电路板(PCB)40中的开口56中，且从安装装置54延长的延伸部分57被容纳在印刷电路板40中的开口58中，以便把安装装置54连接到PCB 40。在安装装置54内，开口59容纳阴极柱60。
环形阳极12乘以系统100的中心。环形阳极12是用于LED系统100的引线框架。如图4中最好可见，在所示的圆形实施例中，环形引线框架12有些象倒置的平底锅，具有一集中的，最好是同心的在“底部”52形成的窗口50，提供到LED管芯16和导线接合26的通路，并且从LED管芯16发射的光通过其分布到透镜18。然而，其它实施例可以有其它一般为对称的形状，其与环形实施例那样同样适于作为引线框架。如以上所讨论，在一实施例中，模压的倒刺30在引线框架12体的周边附近四周形成，用于在LED组件组装期间在引线框架12与透镜18的容纳开口31之间俘获啮合。
LED组件10还允许产品组装过程中有明显的改进。由于圆形LED组件10不是特定指向的，这可以安装在PCB 40上的安装装置54中，或如图10所见，LED组件10可安装在电灯器具组件100中光照装置354中的安装装置254中，其中在任何这些实施例中LED组件10安装在关于其中心辐射反向的任何指向。这消除了在组装之前对特定元件指向的需要。图1-5中所示的实施例可能类似于RCA-型插座，这允许LED组件10易于安装到类似样子的插口中安装装置54中的连接装置36中，而无需加热或任何特定的工具。
引线框架12的环形设计还使其可提供大的面积，用于散发在使用中产生的热。由于环形几何形状所固有的圆周应力，该形状还进一步有益于降低热膨胀。
LED组件10的其它的实施例使用多个LED管芯16，诸如图7所示的实施例，其可包括红色、绿色和蓝色LED管芯16。这些实施例的某些中，每一LED管芯16必须通过导线接合26连接到引线框架12不同的段，以便对每一LED管芯16提供分开的阳极段12A-C。使用实施例的环形结构，可易于容纳从引线框架12到多个LED管芯16的多个导线接合26。
最后，引线框架12可用激光焊接而不是焊锡焊接，或其它方式到PCB 40的机械连接，以提供LED组件10与PCB 40之间的电接触，从而尽量减少在LED组件10组装为产品或部件期间LED管芯16过热的危险。
LED组件10采用一透镜18，该透镜可以被预制模并可由已知的若干材料之一构成，这些材料是各种透镜模式或接合形状的环氧树脂、尿素树脂、硅树脂、丙烯酸树脂、玻璃等。虽然以圆形实施例示出，但透镜18的形状可以是任何一般每一限制的对称形状，诸如方形，六边形，三角形等。透镜18对LED组件10提供了光学模式，并可配置为凹陷，凸起，或准直透镜，并可以是光学透明，或包含分散剂以便散射输出光。在几个实施例中，透镜18的内表面可涂敷适当的光可激发材料，或透镜18可包含适当的光可激发材料，该材料可以是磷光体材料，用于当LED管芯以蓝色、紫外线或其它颜色激发时产生白光。在其它实施例中，硅树脂或黏滞材料20可包含光可激发材料。此外，透镜18既是对黏滞材料20部分地限定腔体，又作为LED管芯16及伴随的导线接合26的防护屏。通过预模制透镜18，LED组件10的光输出易于通过产生透镜18不同的配置、模式或几何形状被修改。
黏滞材料20可以是光学质量的凝胶或润滑脂或其它黏滞材料，它们的折射率可以是n≈1.7或更大。黏滞材料20包含在透镜18中，以便能够提供折射率大约为n≈3.40的LED管芯16，与折射率大约为n≈1.5的透镜之间的折射率逐步过渡。如果黏滞材料20是光学凝胶，这可以是由Nye Optical制造的类型的凝胶。此外，黏滞材料20降低了导线接合26与LED管芯16上由热膨胀引起的应力。在一个实施例中，黏滞材料20通过将其在透镜18内分布在各层而形成，使得它有变化的折射率，其中折射率最高的层最靠近LED管芯16。除了便于LED组件10的组装之外，LED管芯16与透镜18之间之间的黏滞材料的变化层次还减少了LED组件10内的菲涅耳损失。
如上所讨论，在某些实施例中使用蓝色、紫外线或其它颜色LED管芯16，通过光可激发材料产生发射的或输出的白光，这些材料可以是位于透镜18内或上的荧光材料，或类似于Shimizu et al.InU.S.Pat.Nos.5,998,925 and 6,069,440中所公开的情形，黏滞材料20可包含适当的磷光材料。然而，与Shimizu et al.专利不同，在某些实施例中一个或多个黏滞材料20层代替先有技术固化的环氧树脂涂敷树脂。此外，在另一些实施例中，磷光体承载黏滞材料20不是限定在保持LED管芯16的腔体22，而是填充整个透镜18的腔体。在图中所示的圆形实施例中，磷光体承载黏滞材料20半球结构，比Shimizu et al.一般描绘的LED提供了更多的全方向输出。
用来连接引线框架12到LED管芯16的导线接合26可以是金，但也可由铜，铂，铝或它们的合金制成。导线接合26的直径一般在范围10-45μm。如业内所知，因为根据先有技术方法制成的LED中的材料之间的热膨胀系数，不推荐使用直径小于25μm的导线接合，因为在接合点可能断裂。于是，与先有技术不同，导线接合26封入黏滞材料而不是硬质树脂，这样允许有某种膨胀而不会有电接合的损失。导线接合26通过通常的导线接合技术连接到LED管芯16的电极与引线框架12。
可作为铜套(slug)或散热器阴极14装设在LED组件的中心，并用作为LED组件10的阴极。如以上所讨论，阴极14配置为在其上表面具有管芯杯24，其内装有LED管芯16。又如上所讨论，液晶聚合物28可用来连接阴极14到阳极12的位置。液晶聚合物28还提供一种屏障以便密封黏滞材料20在适当的位置。此外，因为液晶聚合物28热连接到阳极12，这提供对LED管芯16附加的散热。管芯杯24的内表面可以通过电镀或其它方式抛光为一反射面，以便把从LED管芯16发射的光按预定的方式指向。阴极14的质量对LED管芯16提供了优秀的散热，以便允许较高的功率施加到LED管芯16，结果得到较高的流明输出。
在某些实施例中，阴极14可装有整体的中心柱60。当这样配置时，通过通常的焊接技术，或不使用热，通过向安装装置32和36互补插口排布压接配合LED组件10，能够组装到PCB 40部件。在其它实施例中，阴极14的基部62，当没有整体的中心柱时，能够被激光焊接或其它方式机械连接到阳极12，以提供电接触。参见图6在其它实施例中，每一LED组件10的阴极14可连接到载体条带42上的容纳装置72，其中阳极12的每一个可使用载体条带70连接。在如图8A-B中所示的其它实施例中，LED组件410包括一带有柱体460的阴极414，该柱体包括可连接到系统中互补的连接装置的一突起470，这可以是一卡口型的连接系统。在图9A-B中可见的其它实施例中，LED组件510包括带有螺纹位表面570的柱体560的一阴极，它可以连接到系统中的互补连接装置。
其折射率可以是n≈3.40的LED管芯16提供了流明输出。LED管芯16可以是多层外延半导体结构，其阳极和阴极分别电安装到内引线12和安装引线14。当加电时，LED管芯16是发射由其化学构成预定的波长的光的元件。如上所讨论，为了产生所需的白色LED输出，如图7中所见，LED管芯16的多种颜色，诸如红色、蓝色和绿色，可组合到单个的LED组件中。然而，在其它实施例中，绿色，紫外线或其它颜色的LED管芯16用来激发体积18中磷光体包含成分或硅树脂或黏滞材料22，以便产生白光。具有类似功能的某些先有技术装置是Singer et al.，主张在蓝色LED芯片顶部使用磷光体层以产生白光，Shimizu et al.，主张使用嵌入到LED芯片上树脂涂敷材料位置的磷光体材料，以及Shimizu et al.，主张在围绕LED芯片的模制透镜中使用磷光体。
如图6中所见，一个实施例提供了连续形成为载体条带70的阳极12的一阵列，其可以是阳极载体条带，这可通过模压或其它传统的手段形成。装置结构便于LED组件10的制造。阳极条带70还提供了把LED组件10组装为部件的另一装置。例如，可以是包含具有共用阴极容纳装置72的阴极载体条带的载体条带42，可用作为一个部件。在这种应用中，只需要到阴极的一个电连接。类似地，阳极载体条带70能够配置为具有共用阳极，这种情形下，只通过形成两个电连接，LED组件10的整个条带能够易于组装到产品中。阴极载体条带42和阳极载体条带70可沿它们的长度被周期地刻痕(如虚线所示)，以使阴极载体条带42和阳极载体条带70能够被分割为预定的长度。
已经就其特定实施例对各种实施例进行了详细说明，但显然，在不背离由以下权利要求所定义的实施例精神和范围之下，可以有各种变型和修改。

Claims (50)

1.包括一LED组件的一种系统，该LED组件包括：
一环形的阳极；
连接到环形阳极的一阴极；
连接到阴极和环形阳极的LED管芯；
连接到环形阳极的一透镜；及
位于由透镜、阴极和环形阳极限定的一腔体中的黏滞材料。
2.权利要求1的系统，还包括一安装装置，其中LED组件通过透镜机械连接到安装装置。
3.权利要求1的系统，其中该系统是一电灯器具
4.权利要求1的系统，还包括：
一阳极条带，该条带包括用来形成LED组件阵列的阳极阵列，以及
载体条带，该条带包括容纳LED组件阵列的容纳装置。
5.权利要求1的系统，其中环形阳极和透镜包括把它们连接在一起的互补连接装置。
6.权利要求5的系统，其中互补连接装置是环形阳极倒刺和透镜开口。
7.权利要求1的系统，其中LED管芯由多个LED管芯组成。
8.权利要求1的系统，其中LED管芯通过热和电传导环氧树脂连接到阴极，且LED管芯通过导线粘合连接到环形阳极。
9.权利要求1的系统，其中阴极是散热器。
10.权利要求1的系统，其中阴极包括LED管芯与其连接的管芯杯。
11.权利要求1的系统，其中环形阳极是一引线框架。
12.权利要求1的系统，其中透镜的一部分包括光可激发材料，使得该系统发射白光。
13.权利要求1的系统，其中透镜的一部分包括分散剂以漫射输出光。
14.权利要求1的系统，其中黏滞材料是非弹性材料。
15.权利要求1的系统，其中黏滞材料是润滑脂。
16.权利要求1的系统，其中黏滞材料是非液体材料。
17.权利要求1的系统，其中黏滞材料是硅树脂材料。
18.权利要求1的系统，其中透镜的一部分涂敷光可激发材料，使该系统发射白光。
19.权利要求1的系统，其中该系统是一前灯装置。
20.权利要求1的系统，其中该系统是一闪光灯装置。
21.权利要求1的系统，还包括安装在一板上的一插口装置，其中透镜通过透镜突起机械地连接到插口装置，并且通过从环形阳极延伸出的柔性延伸物紧固地偏压在插口装置中。
22.权利要求1的系统，其中阴极包括带螺纹部分，其中螺纹被用来把LED组件连接到系统。
23.权利要求1的系统，其中黏滞材料包括光可激发材料。
24.权利要求23的系统，其中白光通过光可激发材料产生。
25.权利要求1的系统，还包括：
一安装装置，以及
与阴极安装端相邻的突起，
其中LED组件通过突起机械安装到安装装置。
26.权利要求1的系统，其中透镜包括一光学几何结构，以便从LED管芯漫射照明。
27.权利要求1的系统，其中透镜包括一光学模式，以便从LED管芯漫射照明。
28.权利要求1的系统，其中透镜包括一光学几何结构，以便产生一所需的光图案。
29.权利要求1的系统，其中透镜包括一光学图案，以便产生一所需的光图案。
30.一种系统，包括：
一安装装置；及
一LED组件，该LED组件包括：
一带有中心开口的环形引线框架；
连接到与中心开口相邻引线框架的一散热器；
连接到散热器并通过导线粘合到引线框架的LED管芯；
连接到引线框架的透镜，该透镜包括一突起，用来把LED组件机械固定到安装装置；
位于由透镜、散热器和引线框架限定的腔体中的硅树脂材料。
31.权利要求30的系统，其中硅树脂材料是凝胶。
32.权利要求30的系统，其中硅树脂材料是黏性的。
33.权利要求30的系统，其中硅树脂材料是润滑脂。
34.制造带有LED组件的系统的一种方法，LED组件的制造包括以下步骤：
a)提供带有管芯杯的散热器；
b)提供带有容纳散热器的同心开口的环形引线框架；
c)把LED管芯连接到散热器管芯杯；
d)把LED管芯通过导线粘合经过同心开口连接到引线框架；
e)向由透镜、引线和散热器限定的腔体分配黏滞材料，以及
f)把透镜连接到引线框架。
35.权利要求34的方法，还包括以液晶聚合物把散热器连接到引线框架的步骤。
36.权利要求34的方法，还包括以管芯附着粘合剂把LED管芯连接到散热器的步骤。
37.权利要求34的方法，还包括对多个LED管芯重复步骤c)和d)。
38.权利要求34的方法，还包括以下步骤：
在安装装置中提供插口装置；以及
通过透镜把LED组件机械连接到插口装置。
39.权利要求34的方法，还包括提供阴极的有螺纹部分，以便把LED组件机械连接到系统。
40.权利要求34的方法，还包括以下步骤：
提供一安装装置，以及
在阴极附着端上提供突起，
其中突起由安装装置容纳，以便把LED组件机械连接到系统。
41.权利要求34的方法，还包括以下步骤：
在引线框架上提供倒刺；以及
在透镜上提供容纳孔；
其中倒刺容纳在容纳孔中，以便进行把引线框架连接到透镜的步骤。
42.权利要求34的方法，还包括引线步骤：
形成一阳极条带，该条带包括用来形成LED组件阵列的阳极阵列；以及
形成一载体条带，该条带包括一容纳装置以容纳LED组件阵列。
43.权利要求34的方法，还包括为透镜的一部分提供光可激发材料的步骤，使得该系统发射白光。
44.权利要求34的方法，还包括以光可激发材料涂敷透镜一部分的步骤，使该系统发射白光。
45.权利要求34的方法，还包括在黏滞材料中提供光可激发材料的步骤，使该系统发射白光。
46.包括一LED组件的一种系统，该LED组件包括：
一环形阳极；
连接到环形阳极的一阴极；
连接到阴极及环形阳极的一LED管芯；
连接到环形阳极的一透镜；以及
由透镜、阴极与环形阳极限定的一腔体。
47.权利要求46的系统，还包括在腔体中的一种材料。
48.权利要求47的系统，其中材料是黏滞材料。
49.包括一LED组件的一系统，该LED组件包括：
一阳极；
连接到阳极的一阴极；
连接阴极与阳极的LED管芯；
连接到阳极的一透镜；以及
位于由透镜、阴极和阳极限定的一腔体。
50.权利要求49的系统，其中阳极是环形阳极。
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CN107676647A (zh) * 2017-10-31 2018-02-09 商洛市虎之翼科技有限公司 一种调焦激光照明装置

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CN1330007C (zh) 2007-08-01
CA2438889A1 (en) 2002-09-06
US6541800B2 (en) 2003-04-01
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US20020113244A1 (en) 2002-08-22
CA2438889C (en) 2012-12-04

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