CN1509516A - 具有增强的电池寿命和冷却的便携电子器件 - Google Patents
具有增强的电池寿命和冷却的便携电子器件 Download PDFInfo
- Publication number
- CN1509516A CN1509516A CNA018144527A CN01814452A CN1509516A CN 1509516 A CN1509516 A CN 1509516A CN A018144527 A CNA018144527 A CN A018144527A CN 01814452 A CN01814452 A CN 01814452A CN 1509516 A CN1509516 A CN 1509516A
- Authority
- CN
- China
- Prior art keywords
- electronic device
- electrothermal module
- phase change
- change material
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title abstract description 15
- 239000012782 phase change material Substances 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 2
- 229910002899 Bi2Te3 Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 14
- 238000007600 charging Methods 0.000 description 11
- 230000002708 enhancing effect Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
热电特性 | |
Tm(deg-C) | 58 |
K(W/m-K) | 10 |
密度 | 9001 |
比热,固体(J/kg-K) | 323 |
比热,液体(J/kg-K) | 721 |
平均比热(J/kg-K) | 522 |
熔化潜热(J/kg) | 28900 |
热扩散率 | 2.12833E-06 |
PCM厚度(m) | 熔化时间(分钟)* |
3.00E-03 | 8.391238056 |
5.00E-03 | 13.98539676 |
6.25E-03 | 17.48174595 |
1.00E-02 | 27.97079352 |
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/643,535 US6570362B1 (en) | 2000-08-22 | 2000-08-22 | Portable electronic device with enhanced battery life and cooling |
US09/643,535 | 2000-08-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1509516A true CN1509516A (zh) | 2004-06-30 |
CN100505353C CN100505353C (zh) | 2009-06-24 |
Family
ID=24581223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018144527A Expired - Lifetime CN100505353C (zh) | 2000-08-22 | 2001-08-22 | 电子器件以及对其进行充电的方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6570362B1 (zh) |
EP (1) | EP1316140B1 (zh) |
CN (1) | CN100505353C (zh) |
AU (1) | AU2001290558A1 (zh) |
ES (1) | ES2459746T3 (zh) |
WO (1) | WO2002017471A1 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102664559A (zh) * | 2010-12-15 | 2012-09-12 | 波音公司 | 使用温差发电器和相变材料发电 |
CN104602484A (zh) * | 2013-10-31 | 2015-05-06 | 展讯通信(上海)有限公司 | 便携式设备及其散热装置 |
CN104818523A (zh) * | 2015-05-01 | 2015-08-05 | 河南鸿昌电子有限公司 | 一种晶棒的拉晶方法 |
CN104917272A (zh) * | 2015-05-15 | 2015-09-16 | 合肥京东方光电科技有限公司 | 佩戴式电子设备 |
CN105393651A (zh) * | 2013-06-27 | 2016-03-09 | 索尼公司 | 电子设备、控制电子设备的方法、电力接收装置、电气装置和系统 |
CN105992454A (zh) * | 2015-02-10 | 2016-10-05 | 欣兴电子股份有限公司 | 电路板与其制作方法 |
CN106128300A (zh) * | 2015-05-07 | 2016-11-16 | 三星电子株式会社 | 显示设备 |
US10616992B2 (en) | 2015-04-24 | 2020-04-07 | Unimicron Technology Corp. | Circuit board and method for manufacturing the same |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8273474B2 (en) * | 2000-02-29 | 2012-09-25 | Illinois Institute Of Technology | Battery system thermal management |
US6942944B2 (en) * | 2000-02-29 | 2005-09-13 | Illinois Institute Of Technology | Battery system thermal management |
US6774300B2 (en) * | 2001-04-27 | 2004-08-10 | Adrena, Inc. | Apparatus and method for photovoltaic energy production based on internal charge emission in a solid-state heterostructure |
JP4423989B2 (ja) * | 2004-02-05 | 2010-03-03 | トヨタ自動車株式会社 | 内燃機関の熱電発電装置 |
EP1571718A1 (en) * | 2004-03-04 | 2005-09-07 | Van den Brandhof, Evert Alexander | Portable apparatus for generating electrical energy with a thermoelectric element |
US20050280987A1 (en) * | 2004-06-07 | 2005-12-22 | Kwitek Benjamin J | Phase change materials as a heat sink for computers |
CN1707935B (zh) * | 2004-06-11 | 2010-05-12 | 珍通科技股份有限公司 | 便携式电子设备的电能自给方法及系统 |
US7743614B2 (en) | 2005-04-08 | 2010-06-29 | Bsst Llc | Thermoelectric-based heating and cooling system |
US20060249724A1 (en) * | 2005-05-06 | 2006-11-09 | International Business Machines Corporation | Method and structure for Peltier-controlled phase change memory |
US20100155018A1 (en) | 2008-12-19 | 2010-06-24 | Lakhi Nandlal Goenka | Hvac system for a hybrid vehicle |
DE102006040853B3 (de) * | 2006-08-31 | 2008-02-14 | Siemens Ag | Einrichtung der Thermoelektrik mit einem thermoelektrischen Generator und Mitteln zur Temperaturbegrenzung an dem Generator |
JP5236265B2 (ja) * | 2007-11-29 | 2013-07-17 | 京セラ株式会社 | バッテリー |
US8618406B1 (en) * | 2008-02-18 | 2013-12-31 | B & B Innovators, LLC | Thermoelectric power generation method and apparatus |
CN101667738A (zh) * | 2008-09-01 | 2010-03-10 | 深圳富泰宏精密工业有限公司 | 充电装置及充电方法 |
KR102218137B1 (ko) | 2009-05-18 | 2021-02-22 | 젠썸 인코포레이티드 | 열전기 가열 및 냉각 시스템 |
FR2946353A1 (fr) * | 2009-06-09 | 2010-12-10 | Commissariat Energie Atomique | Materiau de stockage d'energie thermique et source d'energie thermoelectrique. |
FR2961956B1 (fr) | 2010-06-23 | 2012-08-17 | Commissariat Energie Atomique | Thermogenerateur a materiaux a changement de phase |
CN101931347B (zh) * | 2010-07-23 | 2014-07-30 | 惠州Tcl移动通信有限公司 | 提升能耗效率的方法及其移动终端和热电转换模块的用途 |
CN102130076B (zh) * | 2010-12-25 | 2012-05-30 | 紫光股份有限公司 | 一种热电式计算机芯片散热器 |
KR101950468B1 (ko) | 2011-07-11 | 2019-02-20 | 젠썸 인코포레이티드 | 전기 장치들의 열전 기반 열 관리 |
US20140176041A1 (en) * | 2012-12-20 | 2014-06-26 | Nvidia Corporation | Semiconductor thermoelectric module charger for mobile computing device |
US10170811B2 (en) | 2013-01-14 | 2019-01-01 | Gentherm Incorporated | Thermoelectric-based thermal management of electrical devices |
DE112014000607T5 (de) | 2013-01-30 | 2015-10-22 | Gentherm Incorporated | Auf Thermoelektrik basierendes Thermomanagementsystem |
US9312580B2 (en) * | 2013-07-30 | 2016-04-12 | Johnson Controls Technology Company | Battery module with phase change material |
FR3011067B1 (fr) * | 2013-09-23 | 2016-06-24 | Commissariat Energie Atomique | Appareil comportant un composant fonctionnel susceptible d'etre en surcharge thermique lors de son fonctionnement et un systeme de refroidissement du composant |
US9590282B2 (en) | 2013-10-29 | 2017-03-07 | Gentherm Incorporated | Battery thermal management systems including heat spreaders with thermoelectric devices |
US9641014B2 (en) | 2014-02-12 | 2017-05-02 | Qualcomm Incorporated | Circuits and methods for controlling skin temperature of an electronic device |
KR102226353B1 (ko) | 2014-09-12 | 2021-03-10 | 젠썸 인코포레이티드 | 흑연 열전기적 및/또는 저항성 열 관리 시스템 및 방법 |
FR3026287B1 (fr) * | 2014-09-30 | 2017-02-24 | Seb Sa | Poignee amovible comprenant un generateur thermoelectrique |
FR3026289B1 (fr) * | 2014-09-30 | 2016-10-07 | Seb Sa | Poignee pour recipient de cuisson comprenant un dissipateur thermique a chaleur latente |
AU2018248396A1 (en) | 2017-04-03 | 2019-10-24 | Yotta Solar, Inc. | Thermally regulated modular energy storage device and methods |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
US11676883B2 (en) * | 2019-03-15 | 2023-06-13 | Intel Corporation | Thermoelectric coolers combined with phase-change material in integrated circuit packages |
US11025092B2 (en) * | 2019-10-31 | 2021-06-01 | Huna, Llc | Wearable metabolic electrical charging apparatus |
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AT310811B (de) * | 1969-02-03 | 1973-10-25 | Beteiligungs Ag Haustechnik | Halbleiterelement mit Kühleinrichtung |
CH613087B (de) * | 1978-05-10 | Bulova Watch Co Inc | Thermoelektrische armbanduhr. | |
US4306613A (en) * | 1980-03-10 | 1981-12-22 | Christopher Nicholas S | Passive cooling system |
CH627610GA3 (zh) * | 1980-05-16 | 1982-01-29 | ||
US4377198A (en) | 1980-10-14 | 1983-03-22 | Motorola Inc. | Passive, recyclable cooling system for missile electronics |
US5083605A (en) | 1990-08-17 | 1992-01-28 | Sundstrand Corporaiton | Self-pumping phase change thermal energy device |
US5455458A (en) | 1993-08-09 | 1995-10-03 | Hughes Aircraft Company | Phase change cooling of semiconductor power modules |
US5419780A (en) * | 1994-04-29 | 1995-05-30 | Ast Research, Inc. | Method and apparatus for recovering power from semiconductor circuit using thermoelectric device |
JPH0837322A (ja) * | 1994-07-21 | 1996-02-06 | Seiko Instr Inc | 熱電モジュール |
US5737923A (en) * | 1995-10-17 | 1998-04-14 | Marlow Industries, Inc. | Thermoelectric device with evaporating/condensing heat exchanger |
JP3054932B2 (ja) * | 1996-10-01 | 2000-06-19 | セイコーインスツルメンツ株式会社 | 熱電素子を用いた電子時計 |
WO1999057768A1 (en) * | 1998-05-04 | 1999-11-11 | Siemens Westinghouse Power Corporation | A paired-tube thermoelectric couple |
US6020671A (en) * | 1998-07-28 | 2000-02-01 | The United States Of America As Represented By The United States Department Of Energy | In-line thermoelectric module |
US6053163A (en) * | 1999-08-04 | 2000-04-25 | Hi-Z Technology, Inc. | Stove pipe thermoelectric generator |
US6172486B1 (en) * | 1999-09-24 | 2001-01-09 | The United States Of America As Represented By The Secretary Of The Army | Battery life extender with engine heat |
-
2000
- 2000-08-22 US US09/643,535 patent/US6570362B1/en not_active Expired - Lifetime
-
2001
- 2001-08-22 WO PCT/US2001/026242 patent/WO2002017471A1/en active Search and Examination
- 2001-08-22 ES ES01970566.4T patent/ES2459746T3/es not_active Expired - Lifetime
- 2001-08-22 EP EP01970566.4A patent/EP1316140B1/en not_active Expired - Lifetime
- 2001-08-22 AU AU2001290558A patent/AU2001290558A1/en not_active Abandoned
- 2001-08-22 CN CNB018144527A patent/CN100505353C/zh not_active Expired - Lifetime
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102664559A (zh) * | 2010-12-15 | 2012-09-12 | 波音公司 | 使用温差发电器和相变材料发电 |
CN105393651A (zh) * | 2013-06-27 | 2016-03-09 | 索尼公司 | 电子设备、控制电子设备的方法、电力接收装置、电气装置和系统 |
CN104602484A (zh) * | 2013-10-31 | 2015-05-06 | 展讯通信(上海)有限公司 | 便携式设备及其散热装置 |
CN104602484B (zh) * | 2013-10-31 | 2017-04-26 | 展讯通信(上海)有限公司 | 便携式设备及其散热装置 |
CN105992454A (zh) * | 2015-02-10 | 2016-10-05 | 欣兴电子股份有限公司 | 电路板与其制作方法 |
CN105992454B (zh) * | 2015-02-10 | 2019-04-05 | 欣兴电子股份有限公司 | 电路板与其制作方法 |
US10616992B2 (en) | 2015-04-24 | 2020-04-07 | Unimicron Technology Corp. | Circuit board and method for manufacturing the same |
CN104818523A (zh) * | 2015-05-01 | 2015-08-05 | 河南鸿昌电子有限公司 | 一种晶棒的拉晶方法 |
CN106128300A (zh) * | 2015-05-07 | 2016-11-16 | 三星电子株式会社 | 显示设备 |
CN104917272A (zh) * | 2015-05-15 | 2015-09-16 | 合肥京东方光电科技有限公司 | 佩戴式电子设备 |
US10319894B2 (en) | 2015-05-15 | 2019-06-11 | Boe Technology Group Co., Ltd. | Wearable electronic device |
Also Published As
Publication number | Publication date |
---|---|
AU2001290558A1 (en) | 2002-03-04 |
EP1316140A4 (en) | 2005-01-19 |
WO2002017471A1 (en) | 2002-02-28 |
EP1316140A1 (en) | 2003-06-04 |
ES2459746T3 (es) | 2014-05-12 |
EP1316140B1 (en) | 2014-04-16 |
CN100505353C (zh) | 2009-06-24 |
US6570362B1 (en) | 2003-05-27 |
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