CN1522464A - 电镀过程的控制方法及装置 - Google Patents
电镀过程的控制方法及装置 Download PDFInfo
- Publication number
- CN1522464A CN1522464A CNA028133544A CN02813354A CN1522464A CN 1522464 A CN1522464 A CN 1522464A CN A028133544 A CNA028133544 A CN A028133544A CN 02813354 A CN02813354 A CN 02813354A CN 1522464 A CN1522464 A CN 1522464A
- Authority
- CN
- China
- Prior art keywords
- prescription
- electroplating
- thickness
- processing layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 57
- 230000008569 process Effects 0.000 title claims abstract description 34
- 238000007747 plating Methods 0.000 title claims abstract description 25
- 238000012545 processing Methods 0.000 claims abstract description 50
- 238000009713 electroplating Methods 0.000 claims description 42
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 239000003792 electrolyte Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 description 11
- 230000004888 barrier function Effects 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000027756 respiratory electron transport chain Effects 0.000 description 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002520 cambial effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/897,626 | 2001-07-02 | ||
US09/897,626 US6444481B1 (en) | 2001-07-02 | 2001-07-02 | Method and apparatus for controlling a plating process |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1522464A true CN1522464A (zh) | 2004-08-18 |
CN1261980C CN1261980C (zh) | 2006-06-28 |
Family
ID=25408146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028133544A Expired - Fee Related CN1261980C (zh) | 2001-07-02 | 2002-06-12 | 电镀过程的控制方法及装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6444481B1 (zh) |
EP (1) | EP1402568A2 (zh) |
JP (1) | JP4307251B2 (zh) |
KR (1) | KR100847370B1 (zh) |
CN (1) | CN1261980C (zh) |
AU (1) | AU2002345688A1 (zh) |
TW (1) | TW580723B (zh) |
WO (1) | WO2003005430A2 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107808250A (zh) * | 2017-10-30 | 2018-03-16 | 珠海杰赛科技有限公司 | 一种垂直电镀投料控制方法及系统 |
CN111339581A (zh) * | 2018-12-18 | 2020-06-26 | 通用电气公司 | 形成电铸构件的方法及相关系统 |
CN111936311A (zh) * | 2018-04-17 | 2020-11-13 | 3M创新有限公司 | 导电膜 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3897922B2 (ja) * | 1998-12-15 | 2007-03-28 | 株式会社東芝 | 半導体装置の製造方法、及びコンピュ−タ読取り可能な記録媒体 |
US6428673B1 (en) * | 2000-07-08 | 2002-08-06 | Semitool, Inc. | Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology |
US6747734B1 (en) * | 2000-07-08 | 2004-06-08 | Semitool, Inc. | Apparatus and method for processing a microelectronic workpiece using metrology |
US6842659B2 (en) * | 2001-08-24 | 2005-01-11 | Applied Materials Inc. | Method and apparatus for providing intra-tool monitoring and control |
EP1446828A2 (en) * | 2001-11-13 | 2004-08-18 | Fsi International, Inc. | Reduced footprint tool for automated processing of substrates |
US7068303B2 (en) * | 2002-06-03 | 2006-06-27 | Microsoft Corporation | System and method for calibrating a camera with one-dimensional objects |
US6773931B2 (en) * | 2002-07-29 | 2004-08-10 | Advanced Micro Devices, Inc. | Dynamic targeting for a process control system |
US20050021272A1 (en) * | 2003-07-07 | 2005-01-27 | Jenkins Naomi M. | Method and apparatus for performing metrology dispatching based upon fault detection |
US7086927B2 (en) * | 2004-03-09 | 2006-08-08 | Micron Technology, Inc. | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
US6980873B2 (en) | 2004-04-23 | 2005-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment |
US7437404B2 (en) * | 2004-05-20 | 2008-10-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for improving equipment communication in semiconductor manufacturing equipment |
US7296103B1 (en) * | 2004-10-05 | 2007-11-13 | Advanced Micro Devices, Inc. | Method and system for dynamically selecting wafer lots for metrology processing |
US7736913B2 (en) * | 2006-04-04 | 2010-06-15 | Solopower, Inc. | Composition control for photovoltaic thin film manufacturing |
US20070227633A1 (en) * | 2006-04-04 | 2007-10-04 | Basol Bulent M | Composition control for roll-to-roll processed photovoltaic films |
JP5032360B2 (ja) * | 2008-02-12 | 2012-09-26 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US8406911B2 (en) | 2010-07-16 | 2013-03-26 | HGST Netherlands B.V. | Implementing sequential segmented interleaving algorithm for enhanced process control |
KR101681194B1 (ko) * | 2015-11-16 | 2016-12-12 | 대영엔지니어링 주식회사 | 전착도장 품질관리방법 |
JP6959190B2 (ja) | 2018-07-24 | 2021-11-02 | 旭化成エレクトロニクス株式会社 | 学習処理装置、学習処理方法、化合物半導体の製造方法およびプログラム |
KR102317993B1 (ko) * | 2019-11-27 | 2021-10-27 | 한국생산기술연구원 | 도금 막 두께 예측 장치 및 방법 |
US20230257900A1 (en) * | 2022-02-11 | 2023-08-17 | Applied Materials, Inc. | Parameter adjustment model for semiconductor processing chambers |
CN117813422A (zh) | 2022-08-26 | 2024-04-02 | 株式会社荏原制作所 | 基板状态测定装置、镀覆装置以及基板状态测定方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2895888A (en) * | 1957-10-07 | 1959-07-21 | Industrial Nucleonics Corp | Electrolytic plating apparatus and process |
US3984679A (en) * | 1975-02-18 | 1976-10-05 | Gte Laboratories Incorporated | Coating thickness monitor for multiple layers |
US5391285A (en) * | 1994-02-25 | 1995-02-21 | Motorola, Inc. | Adjustable plating cell for uniform bump plating of semiconductor wafers |
KR0165470B1 (ko) * | 1995-11-08 | 1999-02-01 | 김광호 | 반도체 소자의 박막형성 프로그램의 자동보정 시스템 |
US6020264A (en) * | 1997-01-31 | 2000-02-01 | International Business Machines Corporation | Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing |
US6238539B1 (en) * | 1999-06-25 | 2001-05-29 | Hughes Electronics Corporation | Method of in-situ displacement/stress control in electroplating |
US6405096B1 (en) * | 1999-08-10 | 2002-06-11 | Advanced Micro Devices, Inc. | Method and apparatus for run-to-run controlling of overlay registration |
US20020192944A1 (en) * | 2001-06-13 | 2002-12-19 | Sonderman Thomas J. | Method and apparatus for controlling a thickness of a copper film |
-
2001
- 2001-07-02 US US09/897,626 patent/US6444481B1/en not_active Expired - Lifetime
-
2002
- 2002-06-12 EP EP02744333A patent/EP1402568A2/en not_active Ceased
- 2002-06-12 KR KR1020037017275A patent/KR100847370B1/ko not_active IP Right Cessation
- 2002-06-12 JP JP2003511298A patent/JP4307251B2/ja not_active Expired - Fee Related
- 2002-06-12 AU AU2002345688A patent/AU2002345688A1/en not_active Abandoned
- 2002-06-12 WO PCT/US2002/018857 patent/WO2003005430A2/en active Application Filing
- 2002-06-12 CN CNB028133544A patent/CN1261980C/zh not_active Expired - Fee Related
- 2002-06-14 TW TW091112993A patent/TW580723B/zh not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107808250A (zh) * | 2017-10-30 | 2018-03-16 | 珠海杰赛科技有限公司 | 一种垂直电镀投料控制方法及系统 |
CN107808250B (zh) * | 2017-10-30 | 2021-10-08 | 珠海杰赛科技有限公司 | 一种垂直电镀投料控制方法及系统 |
CN111936311A (zh) * | 2018-04-17 | 2020-11-13 | 3M创新有限公司 | 导电膜 |
CN111339581A (zh) * | 2018-12-18 | 2020-06-26 | 通用电气公司 | 形成电铸构件的方法及相关系统 |
CN111339581B (zh) * | 2018-12-18 | 2024-02-02 | 通用电气公司 | 形成电铸构件的方法及相关系统 |
Also Published As
Publication number | Publication date |
---|---|
WO2003005430A3 (en) | 2003-05-08 |
KR100847370B1 (ko) | 2008-07-21 |
JP2004534908A (ja) | 2004-11-18 |
WO2003005430A2 (en) | 2003-01-16 |
EP1402568A2 (en) | 2004-03-31 |
AU2002345688A1 (en) | 2003-01-21 |
CN1261980C (zh) | 2006-06-28 |
US6444481B1 (en) | 2002-09-03 |
TW580723B (en) | 2004-03-21 |
KR20040013014A (ko) | 2004-02-11 |
JP4307251B2 (ja) | 2009-08-05 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: ADVANCED MICRO DEVICES INC Free format text: FORMER OWNER: ADVANCED MICRO DEVICES INC. Effective date: 20100708 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: CALIFORNIA, USA TO: GRAND CAYMAN ISLAND RITISH CAYMAN ISLANDS |
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TR01 | Transfer of patent right |
Effective date of registration: 20100708 Address after: Grand Cayman, Cayman Islands Patentee after: Globalfoundries Semiconductor Inc. Address before: California, USA Patentee before: Advanced Micro Devices Inc. |
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TR01 | Transfer of patent right |
Effective date of registration: 20210310 Address after: California, USA Patentee after: Lattice chip (USA) integrated circuit technology Co.,Ltd. Address before: Greater Cayman Islands, British Cayman Islands Patentee before: GLOBALFOUNDRIES Inc. |
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TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060628 Termination date: 20210612 |
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CF01 | Termination of patent right due to non-payment of annual fee |