CN1647381A - 支持用于高速数字接口的低干扰信令方案的多模i/o电路 - Google Patents
支持用于高速数字接口的低干扰信令方案的多模i/o电路 Download PDFInfo
- Publication number
- CN1647381A CN1647381A CNA02826651XA CN02826651A CN1647381A CN 1647381 A CN1647381 A CN 1647381A CN A02826651X A CNA02826651X A CN A02826651XA CN 02826651 A CN02826651 A CN 02826651A CN 1647381 A CN1647381 A CN 1647381A
- Authority
- CN
- China
- Prior art keywords
- circuit
- transmitter circuitry
- receiver circuit
- supply voltage
- operated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
- H04L25/0264—Arrangements for coupling to transmission lines
- H04L25/0272—Arrangements for coupling to multiple lines, e.g. for differential transmission
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
- H04L25/0264—Arrangements for coupling to transmission lines
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/38—Synchronous or start-stop systems, e.g. for Baudot code
- H04L25/40—Transmitting circuits; Receiving circuits
- H04L25/45—Transmitting circuits; Receiving circuits using electronic distributors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
- H04L25/0264—Arrangements for coupling to transmission lines
- H04L25/028—Arrangements specific to the transmitter end
- H04L25/0282—Provision for current-mode coupling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
- H04L25/0264—Arrangements for coupling to transmission lines
- H04L25/0292—Arrangements specific to the receiver end
- H04L25/0294—Provision for current-mode coupling
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
- Computing Systems (AREA)
- Mathematical Physics (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Logic Circuits (AREA)
- Dc Digital Transmission (AREA)
- Amplifiers (AREA)
- Electronic Switches (AREA)
Abstract
Description
Claims (38)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/005,766 | 2001-11-02 | ||
US10/005,766 US7702293B2 (en) | 2001-11-02 | 2001-11-02 | Multi-mode I/O circuitry supporting low interference signaling schemes for high speed digital interfaces |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1647381A true CN1647381A (zh) | 2005-07-27 |
CN1295877C CN1295877C (zh) | 2007-01-17 |
Family
ID=21717630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB02826651XA Expired - Fee Related CN1295877C (zh) | 2001-11-02 | 2002-10-17 | 支持用于高速数字接口的低干扰信令方案的多模i/o电路 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7702293B2 (zh) |
EP (1) | EP1446883B1 (zh) |
KR (1) | KR100959569B1 (zh) |
CN (1) | CN1295877C (zh) |
WO (1) | WO2003039000A1 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103227648A (zh) * | 2012-01-26 | 2013-07-31 | 辉达公司 | 参考接地的单端信令 |
US9076551B2 (en) | 2013-03-15 | 2015-07-07 | Nvidia Corporation | Multi-phase ground-referenced single-ended signaling |
US9147447B2 (en) | 2013-03-15 | 2015-09-29 | Nvidia Corporation | Ground-referenced single-ended memory interconnect |
US9153539B2 (en) | 2013-03-15 | 2015-10-06 | Nvidia Corporation | Ground-referenced single-ended signaling connected graphics processing unit multi-chip module |
US9153314B2 (en) | 2013-03-15 | 2015-10-06 | Nvidia Corporation | Ground-referenced single-ended memory interconnect |
US9171607B2 (en) | 2013-03-15 | 2015-10-27 | Nvidia Corporation | Ground-referenced single-ended system-on-package |
US9170980B2 (en) | 2013-03-15 | 2015-10-27 | Nvidia Corporation | Ground-referenced single-ended signaling connected graphics processing unit multi-chip module |
US9338036B2 (en) | 2012-01-30 | 2016-05-10 | Nvidia Corporation | Data-driven charge-pump transmitter for differential signaling |
CN109314514A (zh) * | 2018-09-03 | 2019-02-05 | 深圳市汇顶科技股份有限公司 | 数据接口、芯片和芯片系统 |
CN109314515A (zh) * | 2018-09-03 | 2019-02-05 | 深圳市汇顶科技股份有限公司 | 数据接口、芯片和芯片系统 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6804497B2 (en) | 2001-01-12 | 2004-10-12 | Silicon Laboratories, Inc. | Partitioned radio-frequency apparatus and associated methods |
AU2003220281A1 (en) * | 2002-03-15 | 2003-09-29 | Silicon Laboratories Inc. | Radio-frequency apparatus and associated methods |
US6856169B2 (en) | 2003-05-09 | 2005-02-15 | Rambus, Inc. | Method and apparatus for signal reception using ground termination and/or non-ground termination |
US6924660B2 (en) * | 2003-09-08 | 2005-08-02 | Rambus Inc. | Calibration methods and circuits for optimized on-die termination |
JP4026593B2 (ja) * | 2003-12-25 | 2007-12-26 | セイコーエプソン株式会社 | 受信装置 |
EP1886411B1 (en) * | 2005-05-04 | 2011-10-26 | RF Magic, Inc. | Method and apparatus for distributing multiple signal inputs to multiple integrated circuits |
JP4960833B2 (ja) * | 2007-10-31 | 2012-06-27 | パナソニック株式会社 | シングルエンド伝送及び差動伝送の切替えが可能なインタフェース回路 |
US9367495B1 (en) * | 2008-09-30 | 2016-06-14 | Lattice Semiconductor Corporation | High speed integrated circuit interface |
KR101000289B1 (ko) * | 2008-12-29 | 2010-12-13 | 주식회사 실리콘웍스 | 차동전압구동방식의 송신부 및 차동전류구동방식과 차동전압구동방식을 선택적으로 적용할 수 있는 송신부와 수신부 및 인터페이스 시스템 |
WO2010129873A2 (en) * | 2009-05-07 | 2010-11-11 | Rambus Inc. | Drive supporting multiple signaling modes |
US10311010B2 (en) * | 2011-10-05 | 2019-06-04 | Analog Devices, Inc. | Two-wire communication systems and applications |
US10649948B2 (en) * | 2011-10-05 | 2020-05-12 | Analog Devices, Inc. | Two-wire communication systems and applications |
US9471518B2 (en) | 2011-11-03 | 2016-10-18 | Rambus Inc. | Multi-modal memory interface |
TW201346760A (zh) * | 2012-05-07 | 2013-11-16 | Realtek Semiconductor Corp | 檢查晶片設計中輸入輸出元件是否有連線錯誤的方法及相關的電腦可讀媒體 |
DE102012208454A1 (de) * | 2012-05-21 | 2013-11-21 | Robert Bosch Gmbh | Konditionierungsvorrichtung und Verfahren zum zum Konditionieren eines Datenkanals einer Zelle eines elektrischen Energiespeichers |
KR102237026B1 (ko) * | 2014-11-05 | 2021-04-06 | 주식회사 실리콘웍스 | 디스플레이 장치 |
US10193555B1 (en) * | 2016-06-29 | 2019-01-29 | Cadence Design Systems, Inc. | Methods and devices for a memory interface receiver |
DE102016224631B4 (de) * | 2016-12-09 | 2020-06-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Elektrisch leitende Verbindung zwischen mindestens zwei elektrischen Komponenten an einem mit elektronischen und/oder elektrischen Bauelementen bestücktem Träger, die mit einem Bonddraht ausgebildet ist |
US10748890B2 (en) * | 2017-03-31 | 2020-08-18 | Stmicroelectronics International N.V. | Negative voltage tolerant IO circuitry for IO pad |
Family Cites Families (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5243623A (en) * | 1990-09-25 | 1993-09-07 | National Semiconductor Corporation | Switchable multi-mode transceiver interface device |
US5371424A (en) * | 1992-11-25 | 1994-12-06 | Motorola, Inc. | Transmitter/receiver circuit and method therefor |
GB2278253B (en) * | 1993-05-05 | 1996-08-28 | Marconi Gec Ltd | An integrated transceiver circuit packaged component |
US5715409A (en) * | 1993-05-24 | 1998-02-03 | I-Tech Corporation | Universal SCSI electrical interface system |
US5485488A (en) * | 1994-03-29 | 1996-01-16 | Apple Computer, Inc. | Circuit and method for twisted pair current source driver |
US5541535A (en) * | 1994-12-16 | 1996-07-30 | International Business Machines Corporation | CMOS simultaneous transmission bidirectional driver/receiver |
SE504636C2 (sv) * | 1995-07-27 | 1997-03-24 | Ericsson Telefon Ab L M | Universell sändaranordning |
IT1281028B1 (it) * | 1995-11-13 | 1998-02-11 | Cselt Centro Studi Lab Telecom | Circuito serializzatore-parallelizzatore per segnali numerici ad alta velocita' |
JPH1020974A (ja) * | 1996-07-03 | 1998-01-23 | Fujitsu Ltd | バス構造及び入出力バッファ |
US5832370A (en) * | 1996-09-26 | 1998-11-03 | Motorola, Inc. | Current mode transceiver circuit and method |
US5966032A (en) * | 1996-09-27 | 1999-10-12 | Northern Telecom Limited | BiCMOS transceiver (driver and receiver) for gigahertz operation |
US5847581A (en) * | 1996-12-31 | 1998-12-08 | Intel Corporation | Low power CMOS precision input receiver with integrated reference |
US5929655A (en) * | 1997-03-25 | 1999-07-27 | Adaptec, Inc. | Dual-purpose I/O circuit in a combined LINK/PHY integrated circuit |
US6385235B1 (en) * | 1997-04-22 | 2002-05-07 | Silicon Laboratories, Inc. | Direct digital access arrangement circuitry and method for connecting to phone lines |
US6070211A (en) * | 1997-06-11 | 2000-05-30 | International Business Machines Corporation | Driver/receiver circuitry for enhanced PCI bus with differential signaling |
JP2001520029A (ja) * | 1997-10-20 | 2001-10-30 | ザ プロクター アンド ギャンブル カンパニー | モノグリセリド/ポリグリセロールエステル/脂質混合物を含む低脂肪スナックおよび練り粉組成物 |
US6009314A (en) * | 1997-11-17 | 1999-12-28 | Telefonaktiebolaget L/M Ericsson | Monolithic high frequency antenna switch |
US6031394A (en) * | 1998-01-08 | 2000-02-29 | International Business Machines Corporation | Low voltage CMOS circuit for on/off chip drive at high voltage |
AU2681799A (en) * | 1998-04-17 | 1999-11-08 | Conexant Systems, Inc. | Low cost line-based video compression of digital video stream data |
US6243776B1 (en) * | 1998-07-13 | 2001-06-05 | International Business Machines Corporation | Selectable differential or single-ended mode bus |
US6377666B1 (en) * | 1998-10-29 | 2002-04-23 | Legerity | Apparatus and method for a PHY transmitter with programmable power mode control in CMOS |
US6295323B1 (en) * | 1998-12-28 | 2001-09-25 | Agere Systems Guardian Corp. | Method and system of data transmission using differential and common mode data signaling |
US6424177B1 (en) * | 1999-06-28 | 2002-07-23 | Broadcom Corporation | Universal single-ended parallel bus |
US6961546B1 (en) * | 1999-10-21 | 2005-11-01 | Broadcom Corporation | Adaptive radio transceiver with offset PLL with subsampling mixers |
US6294933B1 (en) * | 2000-02-01 | 2001-09-25 | Motorola, Inc. | Method and apparatus for low power differential signaling to reduce power |
US6346832B1 (en) * | 2000-05-22 | 2002-02-12 | Motorola, Inc. | Multi-channel signaling |
US6535043B2 (en) * | 2000-05-26 | 2003-03-18 | Lattice Semiconductor Corp | Clock signal selection system, method of generating a clock signal and programmable clock manager including same |
US6760882B1 (en) * | 2000-09-19 | 2004-07-06 | Intel Corporation | Mode selection for data transmission in wireless communication channels based on statistical parameters |
US7342875B2 (en) * | 2000-11-06 | 2008-03-11 | The Directv Group, Inc. | Space-time coded OFDM system for MMDS applications |
US6703866B1 (en) * | 2000-12-19 | 2004-03-09 | International Business Machines Corporation | Selectable interface for interfacing integrated circuit modules |
US6492881B2 (en) * | 2001-01-31 | 2002-12-10 | Compaq Information Technologies Group, L.P. | Single to differential logic level interface for computer systems |
US6665339B1 (en) * | 2001-03-19 | 2003-12-16 | Cisco Systems Wireless Networking (Australia) Pty. Limited | Method and apparatus for reducing oscillator pull in a CMOS wireless transceiver integrated circuit |
US6859503B2 (en) * | 2001-04-07 | 2005-02-22 | Motorola, Inc. | Method and system in a transceiver for controlling a multiple-input, multiple-output communications channel |
US7310304B2 (en) * | 2001-04-24 | 2007-12-18 | Bae Systems Information And Electronic Systems Integration Inc. | Estimating channel parameters in multi-input, multi-output (MIMO) systems |
US6751187B2 (en) * | 2001-05-17 | 2004-06-15 | Qualcomm Incorporated | Method and apparatus for processing data for transmission in a multi-channel communication system using selective channel transmission |
US6566911B1 (en) * | 2001-05-18 | 2003-05-20 | Pixelworks, Inc. | Multiple-mode CMOS I/O cell |
US6784500B2 (en) * | 2001-08-31 | 2004-08-31 | Analog Devices, Inc. | High voltage integrated circuit amplifier |
US6911860B1 (en) * | 2001-11-09 | 2005-06-28 | Altera Corporation | On/off reference voltage switch for multiple I/O standards |
US6760388B2 (en) * | 2001-12-07 | 2004-07-06 | Qualcomm Incorporated | Time-domain transmit and receive processing with channel eigen-mode decomposition for MIMO systems |
ITVA20010048A1 (it) * | 2001-12-21 | 2003-06-21 | St Microelectronics Srl | Circuito analogico d'ingresso con compatibilita' di modo comune versoentrambi i nodi di alimentazione |
US6771127B2 (en) * | 2002-03-26 | 2004-08-03 | Broadcom Corporation | Single-ended-to-differential converter with common-mode voltage control |
US7088789B2 (en) * | 2002-07-19 | 2006-08-08 | Mediatek Inc. | Apparatus for providing a multi-mode interface between a baseband receiver and radio frequency circuitry |
US6894505B2 (en) * | 2002-08-01 | 2005-05-17 | Teradyne, Inc. | Flexible interface for universal bus test instrument |
US7127003B2 (en) * | 2002-09-23 | 2006-10-24 | Rambus Inc. | Method and apparatus for communicating information using different signaling types |
US7158536B2 (en) * | 2004-01-28 | 2007-01-02 | Rambus Inc. | Adaptive-allocation of I/O bandwidth using a configurable interconnect topology |
US7091791B1 (en) * | 2004-07-23 | 2006-08-15 | Atheros Communications, Inc. | Transformer implementation using bonding wires |
US7243176B2 (en) * | 2004-11-05 | 2007-07-10 | Intel Corporation | Method and apparatus for power efficient and scalable memory interface |
-
2001
- 2001-11-02 US US10/005,766 patent/US7702293B2/en not_active Expired - Fee Related
-
2002
- 2002-10-17 EP EP02802339A patent/EP1446883B1/en not_active Expired - Lifetime
- 2002-10-17 WO PCT/IB2002/004287 patent/WO2003039000A1/en not_active Application Discontinuation
- 2002-10-17 CN CNB02826651XA patent/CN1295877C/zh not_active Expired - Fee Related
- 2002-10-17 KR KR1020047006433A patent/KR100959569B1/ko not_active IP Right Cessation
-
2009
- 2009-02-23 US US12/380,092 patent/US8965304B2/en not_active Expired - Fee Related
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9071244B2 (en) | 2012-01-26 | 2015-06-30 | Nvidia Corporation | Ground referenced single-ended signaling |
CN103227648B (zh) * | 2012-01-26 | 2015-07-01 | 辉达公司 | 参考接地的单端信令 |
CN103227648A (zh) * | 2012-01-26 | 2013-07-31 | 辉达公司 | 参考接地的单端信令 |
US9338036B2 (en) | 2012-01-30 | 2016-05-10 | Nvidia Corporation | Data-driven charge-pump transmitter for differential signaling |
US9076551B2 (en) | 2013-03-15 | 2015-07-07 | Nvidia Corporation | Multi-phase ground-referenced single-ended signaling |
US9153539B2 (en) | 2013-03-15 | 2015-10-06 | Nvidia Corporation | Ground-referenced single-ended signaling connected graphics processing unit multi-chip module |
US9153314B2 (en) | 2013-03-15 | 2015-10-06 | Nvidia Corporation | Ground-referenced single-ended memory interconnect |
US9171607B2 (en) | 2013-03-15 | 2015-10-27 | Nvidia Corporation | Ground-referenced single-ended system-on-package |
US9170980B2 (en) | 2013-03-15 | 2015-10-27 | Nvidia Corporation | Ground-referenced single-ended signaling connected graphics processing unit multi-chip module |
US9147447B2 (en) | 2013-03-15 | 2015-09-29 | Nvidia Corporation | Ground-referenced single-ended memory interconnect |
CN109314514A (zh) * | 2018-09-03 | 2019-02-05 | 深圳市汇顶科技股份有限公司 | 数据接口、芯片和芯片系统 |
CN109314515A (zh) * | 2018-09-03 | 2019-02-05 | 深圳市汇顶科技股份有限公司 | 数据接口、芯片和芯片系统 |
WO2020047722A1 (zh) * | 2018-09-03 | 2020-03-12 | 深圳市汇顶科技股份有限公司 | 数据接口、芯片和芯片系统 |
CN109314514B (zh) * | 2018-09-03 | 2022-07-08 | 深圳市汇顶科技股份有限公司 | 数据接口、芯片和芯片系统 |
Also Published As
Publication number | Publication date |
---|---|
US20030087671A1 (en) | 2003-05-08 |
CN1295877C (zh) | 2007-01-17 |
WO2003039000A1 (en) | 2003-05-08 |
US8965304B2 (en) | 2015-02-24 |
US20090190639A1 (en) | 2009-07-30 |
US7702293B2 (en) | 2010-04-20 |
EP1446883B1 (en) | 2012-04-04 |
KR100959569B1 (ko) | 2010-05-27 |
EP1446883A4 (en) | 2010-05-05 |
EP1446883A1 (en) | 2004-08-18 |
KR20040053228A (ko) | 2004-06-23 |
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