CN1892372B - 显示板和显示装置 - Google Patents
显示板和显示装置 Download PDFInfo
- Publication number
- CN1892372B CN1892372B CN2006100959998A CN200610095999A CN1892372B CN 1892372 B CN1892372 B CN 1892372B CN 2006100959998 A CN2006100959998 A CN 2006100959998A CN 200610095999 A CN200610095999 A CN 200610095999A CN 1892372 B CN1892372 B CN 1892372B
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- China
- Prior art keywords
- mentioned
- conductive layer
- wiring
- otch
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 62
- 239000004020 conductor Substances 0.000 claims description 28
- 206010040844 Skin exfoliation Diseases 0.000 description 15
- 238000010586 diagram Methods 0.000 description 12
- 230000007797 corrosion Effects 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 7
- 230000015556 catabolic process Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000003321 amplification Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003199 nucleic acid amplification method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 101100260044 Arabidopsis thaliana TCP5 gene Proteins 0.000 description 2
- 101100098979 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CCT5 gene Proteins 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005200314A JP5022576B2 (ja) | 2005-07-08 | 2005-07-08 | 表示パネルおよび表示装置 |
JP200314/2005 | 2005-07-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1892372A CN1892372A (zh) | 2007-01-10 |
CN1892372B true CN1892372B (zh) | 2011-03-30 |
Family
ID=37597384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100959998A Active CN1892372B (zh) | 2005-07-08 | 2006-06-30 | 显示板和显示装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7719650B2 (zh) |
JP (1) | JP5022576B2 (zh) |
KR (1) | KR100821433B1 (zh) |
CN (1) | CN1892372B (zh) |
TW (1) | TW200715012A (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5022576B2 (ja) * | 2005-07-08 | 2012-09-12 | 株式会社ジャパンディスプレイイースト | 表示パネルおよび表示装置 |
JP5072518B2 (ja) * | 2007-09-28 | 2012-11-14 | 三菱電機株式会社 | マトリクスアレイ基板及び表示装置 |
KR101427584B1 (ko) * | 2008-01-22 | 2014-08-08 | 삼성디스플레이 주식회사 | 표시 장치 |
KR100897157B1 (ko) | 2008-02-28 | 2009-05-14 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시장치 |
JP5467449B2 (ja) | 2008-09-17 | 2014-04-09 | Nltテクノロジー株式会社 | 引出線配線装置、画像表示装置及び引出線配線装置の製造方法 |
JP2012195509A (ja) * | 2011-03-17 | 2012-10-11 | Canon Inc | 半導体装置及びその製造方法 |
JP6257428B2 (ja) * | 2014-04-15 | 2018-01-10 | 株式会社ジャパンディスプレイ | 電極基板、表示装置、入力装置および電極基板の製造方法 |
CN104644409A (zh) * | 2015-03-10 | 2015-05-27 | 吕莉 | 一种神经内科用按摩装置 |
JP6696567B2 (ja) | 2016-05-16 | 2020-05-20 | 株式会社村田製作所 | セラミック電子部品 |
Citations (3)
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2005
- 2005-07-08 JP JP2005200314A patent/JP5022576B2/ja active Active
-
2006
- 2006-06-30 CN CN2006100959998A patent/CN1892372B/zh active Active
- 2006-07-07 TW TW095124889A patent/TW200715012A/zh unknown
- 2006-07-07 KR KR1020060063815A patent/KR100821433B1/ko active IP Right Grant
- 2006-07-07 US US11/481,974 patent/US7719650B2/en active Active
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Also Published As
Publication number | Publication date |
---|---|
CN1892372A (zh) | 2007-01-10 |
KR100821433B1 (ko) | 2008-04-10 |
US20070007526A1 (en) | 2007-01-11 |
TWI354171B (zh) | 2011-12-11 |
JP5022576B2 (ja) | 2012-09-12 |
JP2007017767A (ja) | 2007-01-25 |
US7719650B2 (en) | 2010-05-18 |
TW200715012A (en) | 2007-04-16 |
KR20070006604A (ko) | 2007-01-11 |
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