CN1913151B - 用于闪光和自动聚焦应用的发光二极管模块 - Google Patents

用于闪光和自动聚焦应用的发光二极管模块 Download PDF

Info

Publication number
CN1913151B
CN1913151B CN2006101095466A CN200610109546A CN1913151B CN 1913151 B CN1913151 B CN 1913151B CN 2006101095466 A CN2006101095466 A CN 2006101095466A CN 200610109546 A CN200610109546 A CN 200610109546A CN 1913151 B CN1913151 B CN 1913151B
Authority
CN
China
Prior art keywords
light
emitting diode
control signal
flash module
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006101095466A
Other languages
English (en)
Other versions
CN1913151A (zh
Inventor
欧苏林
李健欣
李孟维
庞斯译
叶弘华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies ECBU IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies ECBU IP Singapore Pte Ltd filed Critical Avago Technologies ECBU IP Singapore Pte Ltd
Publication of CN1913151A publication Critical patent/CN1913151A/zh
Application granted granted Critical
Publication of CN1913151B publication Critical patent/CN1913151B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B15/00Special procedures for taking photographs; Apparatus therefor
    • G03B15/02Illuminating scene
    • G03B15/03Combinations of cameras with lighting apparatus; Flash units
    • G03B15/05Combinations of cameras with electronic flash apparatus; Electronic flash units
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B15/00Special procedures for taking photographs; Apparatus therefor
    • G03B15/02Illuminating scene
    • G03B15/03Combinations of cameras with lighting apparatus; Flash units
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30Driver circuits
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2215/00Special procedures for taking photographs; Apparatus therefor
    • G03B2215/05Combinations of cameras with electronic flash units
    • G03B2215/0503Built-in units
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2215/00Special procedures for taking photographs; Apparatus therefor
    • G03B2215/05Combinations of cameras with electronic flash units
    • G03B2215/0514Separate unit
    • G03B2215/0517Housing
    • G03B2215/0525Reflector
    • G03B2215/0535Built-in diffusor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2215/00Special procedures for taking photographs; Apparatus therefor
    • G03B2215/05Combinations of cameras with electronic flash units
    • G03B2215/0564Combinations of cameras with electronic flash units characterised by the type of light source
    • G03B2215/0567Solid-state light source, e.g. LED, laser
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2215/00Special procedures for taking photographs; Apparatus therefor
    • G03B2215/05Combinations of cameras with electronic flash units
    • G03B2215/0589Diffusors, filters or refraction means
    • G03B2215/0592Diffusors, filters or refraction means installed in front of light emitter
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements

Abstract

闪光模块具有光学耦合到具有第一视角的第一透镜的第一发光二极管(“LED”)以及光学耦合到具有第二视角的第二透镜的第二LED。第二视角大于第一视角。耦合到第一LED的第一控制信号线允许选择性地激活第一LED。耦合到第二LED的第二控制信号线激活第二LED。

Description

用于闪光和自动聚焦应用的发光二极管模块
技术领域
本发明涉及用于闪光和自动聚焦应用的发光二极管模块。
背景技术
数字静态成像装置,如数字静态照像机(“DSC”)和包括成像装置的移动电话(“照像机电话”)当在低光照条件下获取图像时通常需要例如来自闪光模块的辅助发光。DSC和照像机电话通常具有用于该目的的内置的闪光模块。一般希望闪光模块产生照像机的视角内的光,以便均匀地照射图像的目标。
不同类型的光源被用于产生用于闪光的光。白光一般能在图像中获得较好的色彩。气体放电管是一类用在闪光应用中的光源。发光二极管(“LED”)是另一类用在闪光应用中的光源。LED芯片产生基本是单色(波长)的光。“白光LED”是利用波长转换材料将来自LED芯片的光转换为不同波长而获得的,并且来自加有波长转换材料的LED芯片的光的组合将产生白光。
辅助发光也用在某些DSC中以在获取图像之前辅助将装置自动聚焦在目标上的操作。分离的LED被提供用于该目的,并且被通称为“自动聚焦辅助LED”(“AFA LED”)。AFA LED通常通过窄的视角产生高的亮度,这与闪光模块不同,闪光模块通过相对较宽的视角产生光,并且与闪光源相分离。
图1A示出了具有AFA LED 102和闪光模块104的现有技术的DSC100。闪光模块是非LED光源,如气体放电管。在DSC 100的表面上有足够的面积来放置AFA和闪光光源;然而,难以在更小的数字成像装置(如更小的DSC和照像机电话)上容纳这两种光源。AFA LED通常从照像机电话中略去,这影响了电话的自动聚焦功能,尤其是在低光照条件下。因此,希望提供一种避免了上述问题的自动聚焦辅助光。
发明内容
闪光模块具有光学耦合到具有第一视角的第一透镜的第一发光二极管(“LED”)以及光学耦合到具有第二视角的第二透镜的第二LED。第二视角大于第一视角。耦合到第一LED的第一控制信号线允许选择性地激活第一LED。耦合到第二LED的第二控制信号线激活第二LED。
附图说明
图1示出了具有AFA LED和闪光模块的现有技术的DSC。
图2是根据本发明实施例的闪光模块的截面图。
图3示出了在AF模式和闪光模式中图2的光源的相对光强与偏轴角(off-axis angle)之间的关系。
图4是根据本发明实施例的成像装置的图。
图5是根据本发明实施例操作成像装置的方法的流程图。
具体实施方式
图2是根据本发明实施例的闪光模块200的截面图。闪光模块200具有三个LED芯片202、204、206。在特定实施例中,每个LED芯片发射蓝光。或者,每个LED芯片发射紫外(“UV”)光。在其他实施例中,LED芯片发射不同波长的光。例如,第一芯片202是发蓝光的LED,第二芯片204是发红光的LED,第三芯片206是发绿光的LED。用于自动聚焦的LED可以是与自动聚焦系统相兼容的任何颜色。LED芯片202、204、206覆盖有波长转换材料208。波长转换材料将LED芯片发射的光(通称为“初级辐射”)转换为其他波长。从而,LED芯片发射的蓝光被转换为可见光谱中的不同颜色,这些颜色组合从而从闪光模块200中产生白光。
在特定实施例中,波长转换材料208具有分散在环氧树脂基体中的非常精细的无机发光材料材料粒子。当被来自LED芯片的初级辐射照射时,无机发光材料粒子发射具有更长波长的光(通称为“次级辐射”)。不同的无机发光材料发射不同波长(颜色)的次级辐射,从而无机发光材料在环氧树脂基体中混合,以从LED芯片的初级发射中产生白光。
或者,例如当LED芯片发射不同的初级辐射时,不同的波长转换材料被用于不同的LED芯片中。类似地,量子点(quantum dot)可与无机发光材料粒子结合使用或者替换无机发光材料粒子。在另一替换实施例中,诸如无机发光材料粒子和/或量子点之类的波长转换材料分散在诸如硅树脂弹性体之类的基体中,并且被施加到LED芯片的顶部。
透镜化结构210具有三个透镜(光学圆顶)212、214、216,这三个透镜光学耦合到各个LED芯片202、204、206,以分散选定辐射模式(“视角”)中的光。第一212和第三216光学圆顶分散约55度和约70度之间的视角218的光。第二光学圆顶214分散约8度和约10度之间的视角220的光。或者,透镜化结构具有两个光学圆顶。在实施例中,透镜化结构被形成(例如,注塑或模塑)为单片光学聚合物。
LED芯片202、204、206安装在衬底222上,一般在反射性杯状部224、226、228内。衬底是例如塑料封装衬底、印刷电路板衬底或引线框衬底。波长转换材料以液体形式分散到封装衬底上并且被固化,透镜化结构210被固定到封装衬底222上。在特定实施例中,固化的波长转换环氧树脂将透镜化结构固定到封装衬底上。或者,使用粘合剂(或者充满反射性杯状部或者位于两个组件的界面处)或热键合来将透镜化结构固定到封装衬底上。从而,波长转换材料208实质上充满了LED芯片和透镜化结构210之间的空间。结合透镜的外表面选择与LED芯片相对的透镜表面的曲率,以提供期望的辐射模式。波长转换材料提供了LED芯片和透镜化结构之间的折射率匹配,从而提高了闪光模块的效率。
选择LED芯片202的发射面和透镜化结构的相对面230之间的距离,以提供期望的波长转换,而不会不适当地减小光强。例如,轻微掺有无机发光材料的环氧基体比重掺有无机发光材料的环氧基体厚。如果初级辐射对闪光模块的颜色(“组合发射”)有贡献(例如当使用蓝光LED时),重掺杂的波长转换材料的厚层可能从闪光中去除太多的初级辐射,这改变了颜色平衡。
第二LED芯片204可与第一和第三LED芯片202、206独立控制。在成像设备的操作期间,第二LED芯片204被激活以提供明亮的窄光束,从而增强对比度,并使得DSC传感器能够在具有暗淡光照的环境中聚焦。成像设备聚焦在被第二LED芯片204和第二光学圆顶214照射的目标上。然后,所有三个LED芯片202、204、206被激活以提供照射目标的闪光,从而转向图像捕捉。在闪光操作期间期望有更宽的辐射模式,以更加均匀地照射目标。或者,第二LED芯片204在闪光操作期间不被激活。
图3示出了在从成像器(即光源)到图2的闪光模块的目标的距离处相对光强与偏轴角(即束扩展)之间的关系。第一曲线302示出了当第二LED芯片(参考图2,标号204)被激活以提供用于自动聚焦的辅助光时目标处的光分布。第二曲线304示出了当第一、第二和第三LED芯片(参考图2,标号202、204、206)被激活以提供闪光功能时目标处的光分布。在特定实施例中,LED芯片204在自动聚焦操作期间以约30mA到约50mA的电流驱动,并且在闪光操作期间以小于30mA的电流驱动。
图4是根据本发明实施例的成像装置400的一部分的图。成像装置400包括具有多个LED 404、406、408的闪光模块402。每个LED具有关联透镜(未示出,见图2,标号212、214、216)。LED是LED芯片,或者是具有波长转换层的LED芯片。在后一情形中,不需要额外的波长转换材料(见图2,标号208);然而,可以使用在LED和透镜之间实现折射率匹配的材料。来自第一和第三LED 404、408的辐射模式比来自第二LED 406的辐射模式宽。在特定实施例中,每个LED是发白光的LED。
成像设备具有闪光模块控制电路410,闪光模块控制电路410在控制信号线412、414上向闪光模块402提供控制信号。第一控制信号在AFA操作期间只激活第二LED 406。第二控制信号在闪光操作期间激活第一和第三LED 404、408。在一个实施例中,第二LED 406在闪光操作期间也由第一控制信号激活。透镜设计避免了在图像捕捉期间中央“热点”(即,照射量比其周围多的区域)的形成。在替换实施例中,第二二LED406在闪光操作期间由第三控制信号激活。在实施例中,第三控制信号使第二LED偏置在比第二控制信号低的电流处。这确保了闪光操作期间的足够亮度,并进一步避免了中央热点的形成。在又一实施例中,第二LED406在闪光操作期间被与激活第一和第三LED 404、408相同的控制信号激活。
图5是根据本发明实施例操作成像装置500的方法的流程图。第一控制信号被提供给闪光模块以激活闪光模块中的第一LED,从而提供AFA光束(步骤502)。成像装置聚焦在目标上(步骤504),然后第二控制信号被提供给闪光模块以激活闪光模块中的至少第二LED,从而提供辅助闪光光束(“闪光”)(步骤506)。在特定实施例中,第二控制信号还激活第一LED。在又一实施例中,第二控制信号在闪光期间激活额外的LED。在特定实施例中,第一和第二LED是发白光的LED。
尽管已经详细描述了本发明的优选实施例,但是应当清楚对于本领域技术人员来说可以对这些实施例进行修改和改动,而不脱离所附权利要求给出的本发明的范围。

Claims (12)

1.一种闪光模块,包括:
第一发光二极管;
光学耦合到所述第一发光二极管并且具有第一视角的第一透镜;
耦合到所述第一发光二极管以利用第一控制信号选择性地激活所述第一发光二极管的第一控制信号线;
第二发光二极管;
光学耦合到所述第二发光二极管并且具有大于所述第一视角的第二视角的第二透镜;
耦合到所述第二发光二极管以利用第二控制信号激活所述第二发光二极管的第二控制信号线,
其中,所述第一透镜、所述第二透镜结合在透镜化结构中,并且
其中,首先利用第一控制信号激活所述第一发光二极管以提供明亮窄光束,然后,再利用所述第二控制信号线激活所述第二发光二极管以与所述第一发光二极管一起提供较宽范围的均匀光分布。
2.如权利要求1所述的闪光模块,其中所述第二控制信号还耦合到所述第一发光二极管以并发地激活所述第一发光二极管和所述第二发光二极管。
3.如权利要求2所述的闪光模块,其中所述第一控制信号向所述第一发光二极管提供第一电流,所述第二控制信号向所述第一发光二极管提供第二电流,所述第一电流大于所述第二电流。
4.如权利要求3所述的闪光模块,其中所述第一电流不小于30mA,所述第二电流小于30mA。
5.如权利要求1所述的闪光模块,还包括:
第三发光二极管;
光学耦合到所述第三发光二极管并且具有第三视角的第三透镜,其中所述第二控制信号还耦合到所述第三发光二极管,并且所述第三发光二极管也被所述第二控制信号并发地激活。
6.如权利要求5所述的闪光模块,其中所述第三视角基本等于所述第二视角。
7.如权利要求5所述的闪光模块,其中所述第一发光二极管是第一白色发光二极管,所述第二发光二极管是第二白色发光二极管,所述第三发光二极管是第三白色发光二极管。
8.如权利要求1所述的闪光模块,其中所述第一透镜、所述第二透镜和所述第三透镜结合在透镜化结构中。
9.如权利要求8所述的闪光模块,还包括分散在所述透镜化结构与所述第一发光二极管、所述第二发光二极管和所述第三发光二极管之间的波长转换材料。
10.如权利要求9所述的闪光模块,其中所述波长转换材料包括分散在环氧基体中的无机发光材料粒子。
11.如权利要求10所述的闪光模块,其中所述波长转换材料从所述第二发光二极管延伸到所述透镜化结构的相对面。
12.如权利要求1所述的闪光模块,其中所述第一视角在约8度和约10度之间,所述第二视角在约55度和约70度之间。
CN2006101095466A 2005-08-08 2006-08-08 用于闪光和自动聚焦应用的发光二极管模块 Expired - Fee Related CN1913151B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/199,509 US7284871B2 (en) 2005-08-08 2005-08-08 Light-emitting diode module for flash and auto-focus application
US11/199,509 2005-08-08

Publications (2)

Publication Number Publication Date
CN1913151A CN1913151A (zh) 2007-02-14
CN1913151B true CN1913151B (zh) 2010-06-16

Family

ID=37027202

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006101095466A Expired - Fee Related CN1913151B (zh) 2005-08-08 2006-08-08 用于闪光和自动聚焦应用的发光二极管模块

Country Status (5)

Country Link
US (1) US7284871B2 (zh)
JP (1) JP2007047787A (zh)
KR (1) KR101278124B1 (zh)
CN (1) CN1913151B (zh)
GB (1) GB2429073A (zh)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060006793A1 (en) * 2004-07-12 2006-01-12 Baroky Tajul A Deep ultraviolet used to produce white light
EP1689148B1 (en) * 2005-02-03 2009-04-01 Sony Ericsson Mobile Communications AB An optical device
US20070064420A1 (en) * 2005-09-19 2007-03-22 Ng Kee Y LED device with enhanced light output
US7461948B2 (en) * 2005-10-25 2008-12-09 Philips Lumileds Lighting Company, Llc Multiple light emitting diodes with different secondary optics
US20070153495A1 (en) * 2005-12-29 2007-07-05 Wang Michael Dongxue Illumination mechanism for mobile digital imaging
TWI303494B (en) * 2006-04-26 2008-11-21 Everlight Electronics Co Ltd Surface mounting optoelectronic device
US7829899B2 (en) 2006-05-03 2010-11-09 Cree, Inc. Multi-element LED lamp package
US20080080188A1 (en) * 2006-09-29 2008-04-03 Chin-Wen Wang Modulized Assembly Of A Large-sized LED Lamp
US8102465B2 (en) * 2006-11-07 2012-01-24 Fujifilm Corporation Photographing apparatus and photographing method for photographing an image by controlling light irradiation on a subject
US7896521B2 (en) * 2007-05-04 2011-03-01 Abl Ip Holding Llc Adjustable light distribution system
DE112007003623T5 (de) * 2007-08-14 2010-09-16 Opticon Inc. Optimierte Beleuchtung für einen Rundstrahlabtaster
DE102007046339A1 (de) * 2007-09-27 2009-04-02 Osram Opto Semiconductors Gmbh Lichtquelle mit veränderlicher Abstrahlcharakteristik
US8136961B2 (en) * 2007-11-28 2012-03-20 Global Oled Technology Llc Electro-luminescent area illumination device
JP5280106B2 (ja) * 2007-12-07 2013-09-04 デクセリアルズ株式会社 光源装置および表示装置
US7942553B2 (en) * 2008-01-25 2011-05-17 Eveready Battery Company, Inc. Lighting device and optics package therefor
JP2009206246A (ja) * 2008-02-27 2009-09-10 Stanley Electric Co Ltd 半導体発光装置
CN102132089A (zh) * 2008-10-15 2011-07-20 建兴电子科技股份有限公司 可控制照明区域的照明装置与方法
US7995911B2 (en) * 2009-01-26 2011-08-09 Koninklijke Philips Electronics N.V. Matching led flash to camera's ambient light compensation algorithm
JP5340763B2 (ja) * 2009-02-25 2013-11-13 ローム株式会社 Ledランプ
US8317369B2 (en) * 2009-04-02 2012-11-27 Abl Ip Holding Llc Light fixture having selectively positionable housing
US10422503B2 (en) 2009-10-30 2019-09-24 Ideal Industries Lighting Llc One-piece multi-lens optical member and method of manufacture
EP2449540A1 (de) * 2009-06-30 2012-05-09 Siemens Aktiengesellschaft Verfahren und vorrichtung zur überwachung des strassenverkehrs
DE102009047788A1 (de) * 2009-09-30 2011-03-31 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung für eine Kamera sowie Verfahren zum Betrieb derselben
TWM387947U (en) * 2010-02-06 2010-09-01 B&M Optics Co Ltd Lens and LED lighting device equipped with the lens
CN102155635A (zh) * 2010-02-11 2011-08-17 亿光电子工业股份有限公司 发光二极管模组
US9110480B2 (en) 2010-06-09 2015-08-18 Infineon Technologies Austria Ag Voltage ramp circuitry and voltage ramp methods for voltage regulators
TWI462340B (zh) * 2010-09-08 2014-11-21 Epistar Corp 一種發光結構及其製造方法
EP2490439B1 (en) * 2011-02-18 2013-07-03 Axis AB Illumination device for a monitoring camera
KR101867284B1 (ko) * 2011-07-01 2018-06-15 삼성전자주식회사 카메라 플래시 모듈
DE102011107895B4 (de) 2011-07-18 2020-11-05 Heraeus Noblelight Gmbh Optoelektronisches Modul mit Linsensystem
KR101993346B1 (ko) * 2012-02-16 2019-06-26 엘지이노텍 주식회사 조명 장치 및 그의 설계 방법
DE102012107829B4 (de) 2012-08-24 2024-01-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Bauelemente und Verfahren zur Herstellung eines optoelektronischen Bauelements
US10400984B2 (en) * 2013-03-15 2019-09-03 Cree, Inc. LED light fixture and unitary optic member therefor
US10352529B2 (en) 2014-04-05 2019-07-16 Whelen Engineering Company, Inc. Collimating optic for LED illumination assembly having transverse slots on emission surface
KR102219489B1 (ko) * 2014-05-14 2021-02-24 엘지이노텍 주식회사 발광 소자 패키지
KR102190740B1 (ko) * 2014-05-28 2020-12-14 엘지이노텍 주식회사 발광 장치
KR102244461B1 (ko) * 2014-06-17 2021-04-26 루미리즈 홀딩 비.브이. 인광체-변환형 led들에 대한 반사기 컵들의 어레이를 포함하는 플래시 모듈
US10090434B2 (en) * 2015-02-26 2018-10-02 Apple Inc. Illumination device having dual-emitting light emitting diode (LED) die structures
WO2017067515A1 (zh) * 2015-10-23 2017-04-27 欧普照明股份有限公司 透镜组合及应用透镜组合的照明装置
CN108386817B (zh) * 2015-10-23 2020-05-01 欧普照明股份有限公司 透镜组合及应用透镜组合的照明装置
DE102016101810A1 (de) * 2016-02-02 2017-08-03 Osram Opto Semiconductors Gmbh Leuchtvorrichtung
KR102465436B1 (ko) * 2016-02-16 2022-11-10 엘지이노텍 주식회사 듀얼 플래쉬 장치 및 이를 갖는 휴대 기기
DE102016224090B4 (de) * 2016-12-05 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement, Modul mit mindestens zwei optoelektronischen Bauelementen und Verfahren zum Herstellen eines optoelektronischen Bauelements
US11201267B2 (en) 2018-12-21 2021-12-14 Lumileds Llc Photoresist patterning process supporting two step phosphor-deposition to form an LED matrix array
US10914434B2 (en) 2019-03-29 2021-02-09 Technomate Manufactory Limited Flashlight apparatus and battery cartridge for the flashlight apparatus
USD957722S1 (en) 2019-03-29 2022-07-12 Technomate Manufactory Limited Lens for flashlights
USD955033S1 (en) 2019-03-29 2022-06-14 Technomate Manufactory Limited Lens apparatus for use with flashlights
USD959729S1 (en) 2019-03-29 2022-08-02 Technomate Manufactory Limited Lens for flashlights
CN111965888B (zh) * 2019-05-20 2023-08-29 群创光电股份有限公司 显示设备
CN111988531B (zh) * 2019-05-21 2022-07-08 北京小米移动软件有限公司 补光模组、补光模组的补光控制方法、终端及装置
USD972755S1 (en) 2020-09-15 2022-12-13 Technomate Manufactory Limited Flashlight
USD970073S1 (en) 2020-09-15 2022-11-15 Technomate Manufactory Limited Flashlight

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068383A (en) * 1998-03-02 2000-05-30 Robertson; Roger Phosphorous fluorescent light assembly excited by light emitting diodes
US6773139B2 (en) * 2001-09-17 2004-08-10 Gelcore Llp Variable optics spot module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020191102A1 (en) * 2001-05-31 2002-12-19 Casio Computer Co., Ltd. Light emitting device, camera with light emitting device, and image pickup method
KR100497143B1 (ko) * 2002-10-11 2005-06-28 서울반도체 주식회사 카메라 조명용 발광 다이오드 소자
KR100550750B1 (ko) * 2003-07-25 2006-02-08 엘지이노텍 주식회사 발광 다이오드 패키지 및 그 제조방법
JP2005114924A (ja) * 2003-10-06 2005-04-28 Pentax Corp 撮影用照明装置
US20060067074A1 (en) * 2004-09-29 2006-03-30 Ming-Kuei Lin Dynamic decoration light
JP4449679B2 (ja) * 2004-09-29 2010-04-14 日本電気株式会社 携帯型電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068383A (en) * 1998-03-02 2000-05-30 Robertson; Roger Phosphorous fluorescent light assembly excited by light emitting diodes
US6773139B2 (en) * 2001-09-17 2004-08-10 Gelcore Llp Variable optics spot module

Also Published As

Publication number Publication date
GB0615467D0 (en) 2006-09-13
JP2007047787A (ja) 2007-02-22
KR101278124B1 (ko) 2013-06-24
GB2429073A (en) 2007-02-14
CN1913151A (zh) 2007-02-14
US7284871B2 (en) 2007-10-23
KR20070017920A (ko) 2007-02-13
US20070030675A1 (en) 2007-02-08

Similar Documents

Publication Publication Date Title
CN1913151B (zh) 用于闪光和自动聚焦应用的发光二极管模块
CN1914530A (zh) 包括固态照明装置的显示器以及使用该显示器的方法
KR101933233B1 (ko) 광발광 파장 변환을 갖는 고체 상태 발광 디바이스 및 사이니지 및 이를 위한 광발광 부품
US20060267037A1 (en) Light emitting diode package
US7519287B2 (en) Electronic flash, imaging device and method for producing a flash of light having a rectangular radiation pattern
US8545721B2 (en) UV coating composition for LED color conversion
KR20100132496A (ko) 라이트 모듈 장치
US20080158907A1 (en) Backlight module having light guide plate with fluorescent layer thereon
KR101955188B1 (ko) 조명 장치
KR101694191B1 (ko) 하나 이상의 광원을 구비한 광파이프를 사용하여 휘도를 증가시키기 위한 리사이클링 시스템 및 방법, 및 이를 포함하는 프로젝터
US7452736B2 (en) Surface emitting device, manufacturing method thereof and projection display device using the same
US20070064420A1 (en) LED device with enhanced light output
KR101655463B1 (ko) 발광소자 패키지 및 이를 구비한 라이트 유닛
US7315048B2 (en) Method and apparatus for mixing light emitted by a plurality of solid-state light emitters
KR100497143B1 (ko) 카메라 조명용 발광 다이오드 소자
WO2010088658A9 (en) Phosphor composite coated diffuser device and method
US9523883B2 (en) LED unit and display incoporating the same
US20190273072A1 (en) Chip Scale Package Light Emitting Diode Module For Automotive Lighting Applications
CN113632251B (zh) 照明模块及包括其的照明装置
US20140175479A1 (en) Led unit with light mixing element
CN117605970A (zh) 照明装置
KR101765902B1 (ko) 발광장치

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100616

Termination date: 20130808