CN85107932A - 电联接件 - Google Patents
电联接件 Download PDFInfo
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Abstract
一种联接件(100)是由印刷在第一衬底上的一个或多个导电墨料导体(12)形成,导电墨料(10)是由其中含有第一组和第二组导电单元的聚合绝缘介质组成,导体(12)上覆盖一层绝缘的可流动的胶(22)。第一组单元被细分成粒子,第二组单元(20)是单个或集合成团的较大粒子。需要联接时,可把第一衬底导体与第二衬底上的导体对齐位置,使单元(20)与第二衬底导体接触和形成电的联接,同时把第一衬底剩下的表面与第二衬底的表面粘在一起。
Description
本发明关系到电的联接件,特别是关系到基于胶粘的电联接件。
电子工业中,联接电路的低剖面和低成本的联接件有着不断增加的需要。传统上,联接件采用接插座、接触端子以及许多情况下采用焊接剂。弹性接头亦有使用,特别是用来联接像液晶显示(LCD)之类的元件。本发明在许多应用中免除了对接插座、接触端子和焊接剂的需要。本发明亦去掉了对弹性接头及其维持压力的附件的需要。
电子工业中要用到大量的印刷电路板、薄膜转换等元件。电路常用网版印刷方法印刷在所需的衬底上。网版印刷比之蚀刻或其它印刷技术既安全又简单。特别在可弯曲衬底上印刷时,网版印刷比其它方法更容易自动化和更经济。
这里透露的这件发明是使衬底上网版印刷的导电电路轨道或导电面积与第二衬底上所需的导电电路轨道或导电面积在机械上和电气上联接在一起提供出一种手段。其中第二衬底上的导电电路轨道或导电面积不必需网版印刷的。
对于联接两块衬底上都不是网版印刷的导电电路轨道或导电面积的联接件,在审理中的我们的美国专利申请串号№.657,717“胶粘的电联接件”中已经透露过。
典型的网版印刷用的导电墨料含有导电材料做成的细粒,细粒长轴直径约为15微米,短轴约为3微米,分散在含有树脂粘合剂和溶剂的聚合物介质中。按照本发明,要修改这种基本导电墨料的成分,加入约1%至约50%基本上为球形的大的导电填料粒子。所说粒子的平均大小约从15微米至约90微米。另外需添加附加的树脂粘合剂和溶剂,以保持墨料的树脂与导电固体之比和混合物的网版印刷性质。较大的粒子在介质中随机分散成单粒的导电单元和集合成团的导电单元。结果的导体是其中含有第一和第二导电单元组的聚合物介质组成,第一组由很细的粒子组成,第二组则包括较大的单粒和集团粒子,如果衬底上印有这种改良导电墨料,则较大的粒子单元大得足以使它们突出在这导电墨料的表面。
按照本发明,联接件是按所需图形用改良的混合墨料网版印刷在衬底上。然后在衬底表面涂一层热塑或对热敏感的胶,特别要涂在将与另一衬底上导电面积联接的印有墨料的暴露表面上。按重迭导通的关系对齐所需联接面积的位置,並在这两导通面积之间要有热塑层存在,以便进行联接。于是在对齐位置的面积上加热和加压力,使热塑层软化和从对齐位置的面积处流出,这样就把突出的导电粒子或粒子集团暴露出来,从而使所说的对齐位置的导电面积联接起来。同时,衬底周围的面积也粘合在一起。
按照本发明的改良混合墨料能用于各种衬底,可用于硬衬底和可弯曲衬底。这种成分能用网版印制成各种图形。在一种实施例中,联接件是一条连续可弯曲的薄膜,其上印有若干条长的平行的改良导电墨料轨道,所说轨道表面上主要涂有热塑介质胶以形成一段可弯曲的电缆接头。可弯曲电缆接头能被切成任意长度,並在其长度上任一处都能与第二衬底粘接,因为联接的能力已存在于轨道本身之中。
这里透露的发明对于点对点矩阵联接特别有用。任何暴露的导电轨道或导电面积都能和具有按本发明墨料轨道的其它导电面积联接。
依据本发明做出的联接件具有电路路径内部或面积本身之间的联接能力,因此两个表面能直接联接,不需要任何接插座。当在玻璃上使一些不能弯曲的表面相联时,这一点特别有利。此外,这种联接件特别适用于自动装配过程。按照本发明的联接件具有联接大量离散终端的能力。需要的时候,这些电路终端也可用标准的接插件来联接。
这里透露的联接件,还可以用来把电元件安装在衬底表面上。这种联接件特别适用于把没有引线的元件安装到可弯曲的或硬的衬底上。
依照本发明的另一方面,亦提供出一种联接方法,这种方法包括的步骤是:选出第一绝缘件;把至少一条导电路径加至所说的第一绝缘件,所说的导电路径是导电墨料形式,导电墨料由具有第一组和第二组导电单元的绝缘介质组成,所说的第一组是非常细的导电粒子,均匀地悬浮和分散在所说绝缘介质中,形成一条连续的导电路径,所说的第二组是体积较大的导电单元,随机分散在所说绝缘介质中,有一些所说较大的导电单元则突出在所说绝缘件外面;在具有至少一条导电路径的所说第一绝缘件上保护性地涂一层绝缘胶;所说至少一条导电路径按导通关系与所说第二绝缘件上所说至少一个导电件对齐位置,使所说绝缘胶层分布在所说至少一条导电路径和所说至少一个导电件之间;然后在至少一条导电路径和至少一个导电件的位置上施加压力,使所说的胶流出並变薄,这样就使所说至少一条导电路径上的所说较大导电单元穿过所说的胶层而与所说至少一个导电件形成电的联接。
参照下列附图更能理解这种改良导电墨料配方的使用和由此做出的联接件。
图1是根据本发明做出的两段电缆的透视图,所说两段之间有一段搭接部分。
图2是沿着图1线段2~2所取的该电缆的剖面图。
图3是沿着图1线段3~3所取的搭接部分的剖面图。
图4是说明依照本发明的点对点矩阵联接的透视图。
图5是沿着图4线段5~5所取的一个矩阵联接点的剖面图。
图6是图1电缆的断片剖面图,说明它与第二衬底上电路的联接。
图7是一块断片透视图,说明利用本发明把一个没有引线的元件安装到一块衬底上。
图8是显微镜下所见的图1电缆的一段和其上有未改良墨料一段电缆在搭接处的剖面,图中的表面被光学显微镜放大200倍。
图9是放大500倍时图8的剖面。
图10是图形表示一段经过用改良导电墨料印成的引人导电轨道、用这里透露的本发明方法做出的两条导电轨道之间的搭接以及经过一段用未改良导电墨料印成的引出导电轨道后的总电阻与这两测量点之间的合並轨道长度减去搭接长度之间的关系。
图11是图10所述搭接的简图,说明这些测量是如何取数的。
图1和图2表示了电缆衬底14和16上印刷成若干条导电轨道12的导电墨混合胶10。导电墨混合胶10是由基本墨料18和大的导电粒子和导电粒子团20组成。如图所示,这些粒子是全部或一部分混合在基本墨料18内。
一般地说,电子工业中通常印刷电路用的任何导电墨料都能作为本发明的基本墨料来使用。有许多公司生产这种墨料,例如杜邦公司(E.I.Dupont de Nemours Co.,Wilmington,Delaware)阿基森公司(Achesion Colloids Co.Port Huron,Michigan)和高级涂层化学公司(Advanced Coatings and Chemicals Corp.,Temple City,California)。这种墨料都以树脂为基础,混合许多非常细的导电粒子,导电粒子的直径通常为15至20微米,厚0.5至3微米。
有许多种大的导电粒子可被利用。这些粒子可由单种金属做成,或者在一种基本金属上镀以贵金属,例如镀银、金、钯、铂或铼,也能用非金属粒子镀以贵金属,或者采用导电的非金属物质。然而所选的粒子必须与基本墨料中的细粒兼容。改良的墨料曾用15至90微米大的球形粒子做出。在推荐的实施例中,用的是30至45微米大小的粒子。异电面积或导电轨道的厚度通常为7.6到38微米。按照本发明,曾用球形镀银的镍粒做出改良导电墨料。我们从新金属公司(Nova-Met corp.,Wycoff,New Jersey)买到镀贵金属的和不镀贵金属的球形镍粒。
镀贵金属的玻璃球也能使用。这种球粒可以从波脱工业公司(Po-tters Industries,Inc.,HasbroucK Heights,Hew Jersey)得到。
应该理解到,上述的导电粒子仅是能够用来有效改良导电墨料的各种粒子中的一些例子。
改良墨料的配方是由调整导电墨料中导电填料的含量而定,一般包含约1%至约50%体积百分比的大导电粒子,同时要保持原来墨料的树脂与导电填料之比。这就需要在导电墨料中既加入大的导电粒子,又要加入没有填料的墨料。如果改良墨料配方中缺乏树脂,那末墨料将失去其整体性,因为其中的粒子彼此是不能粘合的,从而不能形成一条连续的电路路径。如果配方中树脂太多,那末粒子与粒子离得太远,也不能形成一条连续的电路路径。
图2进一步表明在轨道12和衬底14的表面上复盖一层热塑材料22。
从下列公司能够得到许多种热塑或对热敏感的胶料,例如杜邦公司(E.I.Dupont de Nemours & Co.,Wilmington,Del-aware)和佳年公司(Goodyear Tire and Rubber Co.,Chemical Division,AKron,Ohin)。胶料包括聚脂(Poly-esters)、聚酰胺(Polyamides)、丙烯酸树脂(acrylics)和聚烯物质(polyolefins),但並不限于这些。所用胶料的选择主要决定于胶料在什么温度下软化和流动。这个温度必须足够高,使胶料不致于在室温条件下流动,但也不能高到加热时将损坏衬底或墨料的配方。对压力敏感的胶料也能使用。
胶层厚度在某种程度上将受大的填料粒子尺寸的影响。通常胶层厚约0.5至2微米。胶层必须足够厚,以包住所有突出的粒子,这样才能对导体和衬底提供出绝缘性能。
例如,有一种联接件采用25.4微米厚的典型的聚酯热塑胶,在温度约130-150℃及压力2.1至3.5kg/cm2条件下,约需10-40秒钟就可使胶料流动並出现联接。
图1和图3表明衬底14和16之间形成的搭接23。如图3所示,衬底14和16上相当的轨道12都按重迭导通关系对齐位置,並有热塑层22涂在衬底14和16之间。对衬底14或衬底16用通常方法9加热和压力,绝缘的热塑层22便软化並从相当的轨道12之间流出,使相当轨道12中一条轨道上的导电粒子20能与位在对面的另一相当轨道12接触,于是形成了电的联接。
这里应理解到,图1至图3画的电缆衬底仅是代表性的衬底。这里透露的发明能应用于弯曲衬底或硬衬底,或者它们两者结合的衬底。此外,墨料10和热塑绝缘层22可以涂在一个表面上。
图4和图5表明了点对点的矩阵联接24,其中第一衬底26上的轨道12可以有选择地与第二衬底28上所需轨道12联接。对于可弯曲的多层衬底以及至少有一些轨道或导电面积需要有选择联接时,这种联接件特别有用。只要在所需联接点处用通常方法25加热和压力,就可完成联接。如图5所示,热塑绝缘层22软化並且只从予先选定的加热和加压点处流出。但热塑介质层仍留在衬底26、28的剩下部分之间,因此,对于剩下的轨道,虽然它们彼此交叉,但在电气上依旧是绝缘的。
这里也应理解到,图4和图5的例子仅作为代表。这里说明的技术对于两块衬底都是可弯曲的,或者一块衬底可弯曲另一块是硬的,都能应用。此外,墨料10和热塑绝缘层22可以只涂在一个表面上。再有根据特殊应用的不同,热和压力可加在联接处的一侧或两侧。点对点矩阵联接能使两块或更多衬底上的导电面积在较短空间内作出各种各样的联接。
图6说明本联接件的另一实施例,其中按照本发明做出的衬底30上的导电面积32是和第二衬底36上暴露的导体34联接。经过加热加压,热塑层22软化和变薄,使导电粒子20通过胶层22能与暴露的导体34形成电的联接。第二衬底36上导体34的成分可以和本发明透露的成分有所不同。
图7说明一种把没有引线的电元件38安装到衬底42上的方法,电元件38上有一些导电垫脚40而衬底42上有一些由改良导电墨料印成的轨道44和热塑胶层46。热塑层46可以只涂在安装区45上,或涂在衬底42整个表面上。对安装区45加热和压力,热塑层46就变软和变薄,並使墨料轨道40中的导电粒子穿过胶层46而与暴露的接触垫脚40形成电的联接。应该理解到,没有引线的电元件仅是依据本发明能够安装和联接在表面上的各种元件中的一个代表。
图8和图9是显微镜下所见的搭接48的图像,各放大200倍和500倍。搭接48由具有热塑胶层54的衬底52上的改良导电墨料轨道50和衬底58上未改良导电墨料56联接而成。在这两图内可看到与导电轨道56相联接的轨道50上的一簇簇粒子60。
曾经试验过改良墨料配方的各种组成,曾用一条可弯曲的衬底,在其若干条相距2.54毫米的中心线上印上厚为20微米、宽为1.27毫米的改良墨料轨道20,然后在导体和衬底上涂一层厚为25.4微米的热塑胶,把这样一段可弯曲电缆粘接到其上有未改良导电墨料轨道的另一条电缆上,形成一段2.54厘米宽的搭接。
曾测定过搭接电阻,以比较改良墨料各种配方组成的有效性。
现在参看图10,曾经测出经过第一衬底52、一段改良导电墨料轨道50的长度、经过搭接段48和经过第二衬底58上未改良导电墨料轨道56的等于改良导电墨料轨道长度的一段长度上的电阻。在不同距离间隔LA、LB和LC上取三次这种测量。测出的电阻与搭接除外的总轨道长度LT有关,其中LT等于间隔距离减去搭接长度。利用最小二乘法分析数据以及独立测出未改良墨料轨道的电阻,可得出搭接电阻值和改良墨料轨道单位长度上的电阻值。图11和下列方程表示了这些关系:
LTi=Li-Lj
PTM=(RT1+RT2)/2
R=Rj+RTM·LT
在LT=0处,Rj=R
RT1=2RTM-RT2
其中R是电阻,LT是轨道长度,i=A、B或C,RTM是轨道单位长度上的平均电阻,RT1是改良导电墨料轨道单位长度上的电阻,以及RT2是未改良导电墨料轨道单位长度上的电阻(独立测出的)。
对于搭接性能的比较,搭接效率被认为是有用的参数。搭接效率定义为搭接电导(即搭接电阻的倒数)除以理论的搭接电导(即理论的搭接电阻的倒数)。理论的搭接电阻只决定于改良导电墨料轨道单位长度上的电阻、未改良导电墨料轨道单位长度上的电阻和搭接长度。它与搭接中能找到的完全导通的桥接单元的数目无关。
下面两个例子将说明这件发明。但除了所附的权利要求外,这两例子不能构成对本发明的限制。所有的成分,除特别指出外,都表示体积百分比。
例1
我们从新金属公司(Nova-Met Inc.,Wyckoff,N.J.)得到镀银的镍球粒(15%重量的银)。用筛选出30-45微米直径的粒子。把6.55克这些选出的粒子和4.40克从K.C.涂料公司(K.C.Coatings Ins.,Lenexa,Kansas)得到的聚酯树脂溶液KC9627(33%固体)一起混合到100克以聚酯树脂为基础的导电墨料中,导电墨料的填料含有95%银和5%碳。这就形成了改良的导电墨料,並且保持了和未改良电墨料同样的树脂/导电填料体积比,然而现在的导电填料中含有10%体积的镀银镍球粒,用网版把这种墨料印在0.127毫米厚的聚酯薄膜上,形成在五条相距2.54毫米的中心线上的五条1.27毫米宽的轨道,溶剂挥发后轨道厚约25.4微米。然后在轨道及其间隔的空间上网版印刷一层聚酯树脂溶液(35%固体),形成绝缘层,绝缘层约比轨道厚12.7至63.5微米。曾利用2.54厘米长涂有聚酯层的改良墨料轨道样品来做搭接样品。再把不涂任何绝缘复盖层的用未改良银/碳导电墨料印成同样的轨道对齐放在有复盖层的改良墨料轨道上,搭接长度为2.54厘米,然后用2.8至3.5kg/cm2的压力和149℃的温度历时15秒钟把它们粘合。结果的导电电阻和绝缘电阻如表1所示。
例2
我们亦曾用类似于例1中所述方法去改良银/碳导电墨料,但其中镀银镍球粒代替成1.97克平均直径为25微米的镀银玻璃球(12%重量的银)。镀银玻璃球是从波脱工业公司(Potters Industries Inc.,Hasbrouck,N.J.)得到,他们的产品型号是S-3000S3。结果的成分亦保持了和未改良导电墨料同样的树脂/导电填料体积比,但它的导电填料中现含10%体积的镀银玻璃球粒。曾用这种改良导电墨料做出如例1所述的五条彼此绝缘的联接轨道。再用例1所述类似的方法使这种联接轨道和未改良墨料轨道做成搭接样品。结果的导电电阻和绝缘电阻亦都列在表1内。
从以上的说明,我们认为能够理解到本发明的改良导电墨料的配方和联接方法以及它的许多附属的优点。另外下列事实也是清楚的,即在不离开本发明的精神或范围,或在不牺牲所有它的材料优点情况下,无论在形式、结构或部件的安排上都能作出许多改变。因此,这里所述的形式仅是本发明的一个推荐或举例性的实施例。
表1
胶粘联接轨道的搭接性质
联接粒子型式 搭接区电阻a)绝缘电阻 改良的轨道电阻 未改良的轨道电阻
(欧) (欧) (欧/厘米) (欧/厘米)
镀银镍球b)0.75 10100.449 0.406
(例1) 0.79 10100.437 0.402
0.81 10100.441 0.413
平均()0.78 10100.441 0.406
镀银玻璃球b)1.14 10100.555 0.524
(例2) 1.27 10100.602 0.539
1.10 10100.571 0.602
平均c)1.17 10100.579 0.555
註释:
a)搭接长度=2.54厘米
b)五条轨道的平均
c)3个五轨道样品的平均
Claims (9)
1、一种电联接件(100),它包括其表面上有若干个导体(12)的第一绝缘衬底(14),这些导体上盖有一层在压力下能流动的绝缘胶(22),第一衬底上的导体与第二衬底(16)上的导体按重迭导通关系对齐位置,然后加压力,使第一衬底(14)上的导体(12)与第二衬底(16)上的导体联接,这种联接件的特征如下:
这些导体都由导电墨料(10)形成,导电墨料(10)是由其中含有第一和第二导电单元的绝缘聚合物介质(18)组成,
第一组导电单元是由极细的导电粒子组成,它们悬浮在介质中,並沿着每条导体的长度形成一条连续的导电路径,
第二组导电单元都是些体积较大的导电粒子,並且随机分散在导电路径上和突出在介质的表面,以及
可流动的胶料(22)复盖在导体表面,
第一衬底导体(12)要按重迭导通关系与第二衬底导体对齐位置,並使可流动胶料(22)充满在这两衬底(14、16)之间,然后向对齐位置的导体及其周围面积施加压力,胶料便从对齐位置处流出,並暴露出成团的导电单元,使相应的导体完成电的联接,同时也把第一衬底剩下的表面和第二衬底的表面粘在一起。
2、权利要求1定义的电联接件(100),其中所说的胶料是一种在热和压力下可以流动的热塑胶料。
3、权利要求1或2定义的电联接件(100),其中所说的电联接件包括电联接电缆。
4、权利要求1、2或3定义的电联接件(100),其中所说的第一衬底(14)是从可弯曲件、半弯曲件和硬部件诸类中选出。的第二衬底是从有引线的电元件、没有引线的电元件、可弯曲部件、半弯曲部件和硬部件诸类元部件中选出。
5、一种把第一绝缘体上至少一条导电路径(12)和第二绝缘体上至少一个导电件联接起来的联接方法,这种方法包括下列步骤:
选出第一绝缘件;
在所说第一绝缘体(14)上加入至少一条导电路径,所说的导电路径是导电墨料(10)形成,导电墨料(10)是含有第一和第二组导电单元的绝缘介质,所说的第一组是极细的导电粒子,均匀地悬浮和分散在所说绝缘介质内形成一条连续的导电路径,所说的第二组(20)是尺寸较大的导电单元,它们随机散布在所说绝缘介质内,有一些所说较大的导电单元向外突出在所说的绝缘体表面上;
在所说的第一绝缘件上涂一层绝缘胶22,把所说至少一条导电路径(12)复盖住;
使所说至少一条导电路径(12)按导通关系与所说第二绝缘件上所说至少一个导电件对齐位置,並使所说的胶层(22)介在所说至少一条导电路径(12)和所说至少一个导电件之间,以及在对齐位置的至少一条导电路径(12)和至少一个导电件上施加压力,使所说的胶层(22)软化、流出和变薄,在所说至少一条导电路径上暴露出所说较大的导电单元,並让这些导电单元穿过所说的胶层与所说至少一个导电件形成电的联接。
6、权利要求6定义的方法,其中所说的胶(22)是一种在热和压力下可以流动的热塑胶。
7、权利要求6或7定义的方法,其中所说的第一绝缘件(14)是从可弯曲部件、半弯曲部件和硬部件中选出。
8、权利要求6、7或8定义的方法,其中所说的第二绝缘体是从有引线的电元件、没有引线的电元件、可弯曲部件和硬部件诸类元部件中选出。
9、权利要求6、7或8定义的方法,其中所说的第一绝缘件(14)是一条电缆,它由一条绝缘衬底组成,在衬底的至少一个表面上具有至少一条长的导体。
Applications Claiming Priority (2)
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US06/657,851 US4554033A (en) | 1984-10-04 | 1984-10-04 | Method of forming an electrical interconnection means |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100444706C (zh) * | 2002-10-29 | 2008-12-17 | 新光电气工业株式会社 | 在布线板上安装电子部件的方法 |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4640981A (en) * | 1984-10-04 | 1987-02-03 | Amp Incorporated | Electrical interconnection means |
US4642421A (en) * | 1984-10-04 | 1987-02-10 | Amp Incorporated | Adhesive electrical interconnecting means |
US4740532A (en) * | 1985-04-30 | 1988-04-26 | Amp Incorporated | Photocurable dielectric composition of acrylated urethane prepolymer |
US4644092A (en) * | 1985-07-18 | 1987-02-17 | Amp Incorporated | Shielded flexible cable |
US4774634A (en) * | 1986-01-21 | 1988-09-27 | Key Tronic Corporation | Printed circuit board assembly |
DE3608010A1 (de) * | 1986-03-11 | 1987-09-17 | Philips Patentverwaltung | Verfahren zum herstellen einer elektrisch leitenden klebverbindung |
US4706097A (en) * | 1986-04-03 | 1987-11-10 | Hewlett Packard Company | Near-linear spring connect structure for flexible interconnect circuits |
US4694572A (en) * | 1986-06-13 | 1987-09-22 | Tektronix, Inc. | Printed polymer circuit board method |
US4923739A (en) * | 1987-07-30 | 1990-05-08 | American Telephone And Telegraph Company | Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method |
US4859813A (en) * | 1987-09-04 | 1989-08-22 | Calcomp Inc. | Digitizer tablet having electrical interconnect components on the writing substrate |
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
US5188698A (en) * | 1989-01-23 | 1993-02-23 | Nippon Steel Corporation | Resin-sandwiched metal laminate, process and apparatus for producing the same and process for the producing resin film for the resin-sandwiched metal laminate |
US5236533A (en) * | 1989-01-23 | 1993-08-17 | Nippon Steel Corporation | Resin-sandwiched metal laminate, process and apparatus for producing the same and process for producing resin film for the resin-sandwiched metal laminate |
US5235741A (en) * | 1989-08-18 | 1993-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Electrical connection and method for making the same |
JPH0831350B2 (ja) * | 1989-10-03 | 1996-03-27 | 日本黒鉛工業株式会社 | ファインピッチ用導電異方性ヒートシールコネクタ部材の製造法 |
US5611140A (en) * | 1989-12-18 | 1997-03-18 | Epoxy Technology, Inc. | Method of forming electrically conductive polymer interconnects on electrical substrates |
CA2038012A1 (en) * | 1990-03-14 | 1991-09-15 | Hideki Shimizu | Oxide superconductor lamination and method of manufacturing the same |
US5162613A (en) * | 1991-07-01 | 1992-11-10 | At&T Bell Laboratories | Integrated circuit interconnection technique |
US5354392A (en) * | 1992-01-24 | 1994-10-11 | Matsushita Electric Industrial Co., Ltd. | Method for connecting a wiring arranged on a sheet with another wiring arranged on another sheet by ultrasonic waves |
US5371327A (en) * | 1992-02-19 | 1994-12-06 | Shin-Etsu Polymer Co., Ltd. | Heat-sealable connector sheet |
US5221417A (en) * | 1992-02-20 | 1993-06-22 | At&T Bell Laboratories | Conductive adhesive film techniques |
US5288235A (en) * | 1992-12-14 | 1994-02-22 | Hughes Aircraft Company | Electrical interconnects having a supported bulge configuration |
US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
US5401913A (en) * | 1993-06-08 | 1995-03-28 | Minnesota Mining And Manufacturing Company | Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
JP2937705B2 (ja) * | 1993-08-31 | 1999-08-23 | アルプス電気株式会社 | プリント配線板の接続方法 |
US5527998A (en) * | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
US5357084A (en) * | 1993-11-15 | 1994-10-18 | The Whitaker Corporation | Device for electrically interconnecting contact arrays |
JPH09148731A (ja) * | 1995-11-17 | 1997-06-06 | Fujitsu Ltd | 配線基板間の接続構造の製造方法 |
US5877668A (en) * | 1995-11-30 | 1999-03-02 | Daewoo Electronics Co., Ltd. | Flyback transformer having a flexible coil winding structure and manufacturing process thereof |
JP2831970B2 (ja) * | 1996-04-12 | 1998-12-02 | 山一電機株式会社 | 回路基板における層間接続方法 |
US5741430A (en) * | 1996-04-25 | 1998-04-21 | Lucent Technologies Inc. | Conductive adhesive bonding means |
DE19618100A1 (de) * | 1996-05-06 | 1997-11-13 | Siemens Ag | Verfahren zur Herstellung einer Mehrlagen-Verbundstruktur mit elektrisch leitenden Verbindungen |
JP3928753B2 (ja) | 1996-08-06 | 2007-06-13 | 日立化成工業株式会社 | マルチチップ実装法、および接着剤付チップの製造方法 |
US5920037A (en) * | 1997-05-12 | 1999-07-06 | International Business Machines Corporation | Conductive bonding design for metal backed circuits |
US6019271A (en) * | 1997-07-11 | 2000-02-01 | Ford Motor Company | Method for ultrasonic bonding flexible circuits |
JP3625646B2 (ja) | 1998-03-23 | 2005-03-02 | 東レエンジニアリング株式会社 | フリップチップ実装方法 |
US6189208B1 (en) | 1998-09-11 | 2001-02-20 | Polymer Flip Chip Corp. | Flip chip mounting technique |
US6218446B1 (en) | 1999-01-11 | 2001-04-17 | Dymax Corporation | Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced |
US20070131661A1 (en) * | 1999-02-25 | 2007-06-14 | Reiber Steven F | Solder ball placement system |
US7389905B2 (en) | 1999-02-25 | 2008-06-24 | Reiber Steven F | Flip chip bonding tool tip |
US7124927B2 (en) * | 1999-02-25 | 2006-10-24 | Reiber Steven F | Flip chip bonding tool and ball placement capillary |
US20060261132A1 (en) * | 1999-02-25 | 2006-11-23 | Reiber Steven F | Low range bonding tool |
US7032802B2 (en) * | 1999-02-25 | 2006-04-25 | Reiber Steven F | Bonding tool with resistance |
US20080197172A1 (en) * | 1999-02-25 | 2008-08-21 | Reiber Steven F | Bonding Tool |
US20060071050A1 (en) * | 1999-02-25 | 2006-04-06 | Reiber Steven F | Multi-head tab bonding tool |
US6410415B1 (en) * | 1999-03-23 | 2002-06-25 | Polymer Flip Chip Corporation | Flip chip mounting technique |
JP4411819B2 (ja) * | 2000-03-23 | 2010-02-10 | ソニー株式会社 | 電気的接続材料 |
US7244675B2 (en) * | 2000-03-23 | 2007-07-17 | Sony Corporation | Electrical connection materials and electrical connection method |
US6490786B2 (en) * | 2001-04-17 | 2002-12-10 | Visteon Global Technologies, Inc. | Circuit assembly and a method for making the same |
CA2350853A1 (en) * | 2001-06-15 | 2002-12-15 | Groupe Minutia Inc. | Method of establishing electrical conductivity between oxide-coated electrical conductors |
US20070085085A1 (en) * | 2005-08-08 | 2007-04-19 | Reiber Steven F | Dissipative pick and place tools for light wire and LED displays |
JP2009135388A (ja) * | 2007-10-30 | 2009-06-18 | Hitachi Chem Co Ltd | 回路接続方法 |
US8816807B2 (en) * | 2010-05-21 | 2014-08-26 | Purdue Research Foundation | Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles |
KR101498112B1 (ko) * | 2012-06-15 | 2015-03-04 | (주)아이티헬스 | 전도성 섬유형의 도선을 이용한 대소변 감지센서 및 감지장치 |
JP6985624B2 (ja) * | 2020-02-25 | 2021-12-22 | 富士通クライアントコンピューティング株式会社 | 電子部品、および電子部品の製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US31411A (en) * | 1861-02-12 | Improvement in sewing-machines | ||
US2808352A (en) * | 1951-03-22 | 1957-10-01 | Burgess Battery Co | Electrically conductive adhesive tape |
US3514326A (en) * | 1967-11-17 | 1970-05-26 | Minnesota Mining & Mfg | Tape |
US3678437A (en) * | 1970-12-30 | 1972-07-18 | Itt | Flat cable wafer |
US3778306A (en) * | 1971-01-04 | 1973-12-11 | Minnesota Mining & Mfg | Tape |
US4113981A (en) * | 1974-08-14 | 1978-09-12 | Kabushiki Kaisha Seikosha | Electrically conductive adhesive connecting arrays of conductors |
USRE31411E (en) | 1974-09-27 | 1983-10-11 | General Electric Company | Radiation curable inks |
US3988647A (en) * | 1974-09-27 | 1976-10-26 | General Electric Company | Method for making a circuit board and article made thereby |
GB1496245A (en) * | 1975-07-07 | 1977-12-30 | Barish B | Stylus-actuated electrical switching devices |
JPS5357481A (en) * | 1976-11-04 | 1978-05-24 | Canon Inc | Connecting process |
DE2831984A1 (de) * | 1977-07-21 | 1979-02-01 | Sharp Kk | Elektrische verbindung zwischen zwei auf getrennte traeger aufgebrachten elektrischen schaltkreisen |
US4243455A (en) * | 1977-07-29 | 1981-01-06 | Nippon Graphite Industries, Ltd. | Method of forming electrode connector for liquid crystal display device |
GB2064873B (en) * | 1979-11-26 | 1984-09-05 | Eventoff Franklin Neal | Pressure sensitive electric switch |
US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
US4401843A (en) * | 1981-03-31 | 1983-08-30 | Rogers Corporation | Miniaturized bus bars and methods of fabrication thereof |
US4425263A (en) * | 1981-06-03 | 1984-01-10 | E. I. Du Pont De Nemours & Co. | Flexible screen-printable conductive composition |
US4446059A (en) * | 1982-04-15 | 1984-05-01 | E. I. Du Pont De Nemours & Co. | Conductor compositions |
FR2531599A1 (fr) * | 1982-08-03 | 1984-02-10 | Xerox Corp | Jonction multiple de fils tres etroitement espaces sur des substrats contigus |
-
1984
- 1984-10-04 US US06/657,851 patent/US4554033A/en not_active Expired - Lifetime
-
1985
- 1985-09-13 WO PCT/US1985/001741 patent/WO1986002231A1/en active IP Right Grant
- 1985-09-13 AU AU48021/85A patent/AU4802185A/en not_active Abandoned
- 1985-09-13 KR KR1019860700324A patent/KR910005533B1/ko not_active IP Right Cessation
- 1985-09-13 IE IE2265/85A patent/IE56869B1/en not_active IP Right Cessation
- 1985-09-13 BR BR8506957A patent/BR8506957A/pt unknown
- 1985-09-13 DE DE8585904573T patent/DE3575841D1/de not_active Expired - Fee Related
- 1985-09-13 JP JP60504058A patent/JPH06101614B2/ja not_active Expired - Fee Related
- 1985-09-13 EP EP85904573A patent/EP0198844B1/en not_active Expired - Lifetime
- 1985-09-26 CA CA000491646A patent/CA1220251A/en not_active Expired
- 1985-09-30 CN CN85107932.6A patent/CN1004910B/zh not_active Expired
- 1985-10-01 ES ES1985289336U patent/ES289336Y/es not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100444706C (zh) * | 2002-10-29 | 2008-12-17 | 新光电气工业株式会社 | 在布线板上安装电子部件的方法 |
Also Published As
Publication number | Publication date |
---|---|
IE56869B1 (en) | 1992-01-01 |
DE3575841D1 (de) | 1990-03-08 |
KR880700619A (ko) | 1988-03-15 |
EP0198844A1 (en) | 1986-10-29 |
IE852265L (en) | 1986-04-04 |
BR8506957A (pt) | 1986-12-23 |
US4554033A (en) | 1985-11-19 |
EP0198844B1 (en) | 1990-01-31 |
CA1220251A (en) | 1987-04-07 |
ES289336Y (es) | 1987-05-01 |
JPS62500828A (ja) | 1987-04-02 |
KR910005533B1 (ko) | 1991-07-31 |
WO1986002231A1 (en) | 1986-04-10 |
AU4802185A (en) | 1986-04-17 |
CN1004910B (zh) | 1989-07-26 |
JPH06101614B2 (ja) | 1994-12-12 |
ES289336U (es) | 1986-08-16 |
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