DE10085383T1 - Kontrollsystem mit schwingungsfester Bildaufnahme - Google Patents

Kontrollsystem mit schwingungsfester Bildaufnahme

Info

Publication number
DE10085383T1
DE10085383T1 DE10085383T DE10085383T DE10085383T1 DE 10085383 T1 DE10085383 T1 DE 10085383T1 DE 10085383 T DE10085383 T DE 10085383T DE 10085383 T DE10085383 T DE 10085383T DE 10085383 T1 DE10085383 T1 DE 10085383T1
Authority
DE
Germany
Prior art keywords
vibration
control system
image recording
resistant image
resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10085383T
Other languages
English (en)
Inventor
Timothy A Skunes
David Fishbaine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cyberoptics Corp
Original Assignee
Cyberoptics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Corp filed Critical Cyberoptics Corp
Publication of DE10085383T1 publication Critical patent/DE10085383T1/de
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2518Projection by scanning of the object
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/30Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/71Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/72Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors using frame transfer [FT]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646Soldering
DE10085383T 2000-01-07 2000-12-12 Kontrollsystem mit schwingungsfester Bildaufnahme Ceased DE10085383T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17504900P 2000-01-07 2000-01-07
US09/522,519 US6549647B1 (en) 2000-01-07 2000-03-10 Inspection system with vibration resistant video capture
PCT/US2000/042764 WO2001050410A1 (en) 2000-01-07 2000-12-12 Inspection system with vibration resistant video capture

Publications (1)

Publication Number Publication Date
DE10085383T1 true DE10085383T1 (de) 2003-04-17

Family

ID=26870812

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10085383T Ceased DE10085383T1 (de) 2000-01-07 2000-12-12 Kontrollsystem mit schwingungsfester Bildaufnahme

Country Status (6)

Country Link
US (2) US6549647B1 (de)
JP (1) JP2003524158A (de)
KR (1) KR100795761B1 (de)
DE (1) DE10085383T1 (de)
GB (1) GB2374233B (de)
WO (1) WO2001050410A1 (de)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3922853B2 (ja) * 1999-12-07 2007-05-30 松下電器産業株式会社 固体撮像装置
ES2312314T5 (es) * 2000-05-16 2017-07-18 Sicpa Holding Sa Método, dispositivo y sistema de seguridad, todos para autenticar una marcación
US7813559B2 (en) 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US7555831B2 (en) * 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US20050226490A1 (en) * 2002-01-29 2005-10-13 Phillips Brian S Method and apparatus for improved vision detector image capture and analysis
US7545949B2 (en) * 2004-06-09 2009-06-09 Cognex Technology And Investment Corporation Method for setting parameters of a vision detector using production line information
US9092841B2 (en) 2004-06-09 2015-07-28 Cognex Technology And Investment Llc Method and apparatus for visual detection and inspection of objects
US7012631B2 (en) * 2002-09-17 2006-03-14 Bojko Vodanovic Absolute position determination for a CCD-based acquisition unit
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
US8891852B2 (en) 2004-06-09 2014-11-18 Cognex Technology And Investment Corporation Method and apparatus for configuring and testing a machine vision detector
US8127247B2 (en) * 2004-06-09 2012-02-28 Cognex Corporation Human-machine-interface and method for manipulating data in a machine vision system
US8243986B2 (en) * 2004-06-09 2012-08-14 Cognex Technology And Investment Corporation Method and apparatus for automatic visual event detection
US20050276445A1 (en) * 2004-06-09 2005-12-15 Silver William M Method and apparatus for automatic visual detection, recording, and retrieval of events
EP1612509A1 (de) * 2004-07-01 2006-01-04 Sick IVP AB Optischer Profilometer
US20060016066A1 (en) * 2004-07-21 2006-01-26 Cyberoptics Corporation Pick and place machine with improved inspection
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
US9292187B2 (en) 2004-11-12 2016-03-22 Cognex Corporation System, method and graphical user interface for displaying and controlling vision system operating parameters
US7636449B2 (en) 2004-11-12 2009-12-22 Cognex Technology And Investment Corporation System and method for assigning analysis parameters to vision detector using a graphical interface
US7720315B2 (en) * 2004-11-12 2010-05-18 Cognex Technology And Investment Corporation System and method for displaying and using non-numeric graphic elements to control and monitor a vision system
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
US7508436B2 (en) * 2005-06-29 2009-03-24 Eastman Kodak Company Method for capturing a sequence of images in close succession
JP4896136B2 (ja) * 2005-09-14 2012-03-14 サイバーオプティクス コーポレーション 改善された構成部品ピックイメージ処理を備えたピックアンドプレース機
DE112006003019T5 (de) * 2005-10-31 2008-10-23 Cyberoptics Corp., Golden Valley Elektronikmontagevorrichtung mit eingebauter Lötpastenprüfung
EP1953534A1 (de) * 2005-11-15 2008-08-06 Omron Corporation Vorrichtung zur überprüfung von lötmaterial
DE102006002077A1 (de) * 2006-01-13 2007-07-26 GOM - Gesellschaft für Optische Meßtechnik mbH Einrichtung und Verfahren zum dreidimensionalen optischen Vermessen
DE102006002704A1 (de) * 2006-01-19 2007-08-02 Henkel Kgaa Verfahren und Vorrichtung zur Überwachung einer Produktionslinie
US20070276867A1 (en) * 2006-05-23 2007-11-29 David Fishbaine Embedded inspection image archival for electronics assembly machines
JP4917449B2 (ja) * 2006-07-11 2012-04-18 パナソニック株式会社 固体撮像装置の駆動方法、及び固体撮像装置
US20080117438A1 (en) * 2006-11-16 2008-05-22 Solvision Inc. System and method for object inspection using relief determination
WO2008086016A1 (en) * 2007-01-10 2008-07-17 Cyberoptics Corporation Inspection system
KR100887184B1 (ko) * 2007-05-09 2009-03-10 한국과학기술원 부분 경면 물체의 형상측정 장치 및 그 방법
US8237099B2 (en) * 2007-06-15 2012-08-07 Cognex Corporation Method and system for optoelectronic detection and location of objects
US8103085B1 (en) 2007-09-25 2012-01-24 Cognex Corporation System and method for detecting flaws in objects using machine vision
US20110175997A1 (en) * 2008-01-23 2011-07-21 Cyberoptics Corporation High speed optical inspection system with multiple illumination imagery
US8059280B2 (en) 2008-01-31 2011-11-15 Cyberoptics Corporation Method for three-dimensional imaging using multi-phase structured light
US7869645B2 (en) * 2008-07-22 2011-01-11 Seiko Epson Corporation Image capture and calibratiion
US8090184B2 (en) 2008-07-23 2012-01-03 Seiko Epson Corporation Fault detection of a printed dot-pattern bitmap
US8269836B2 (en) * 2008-07-24 2012-09-18 Seiko Epson Corporation Image capture, alignment, and registration
DK2438397T3 (en) * 2009-06-01 2019-01-28 Dentsply Sirona Inc Method and device for three-dimensional surface detection with a dynamic frame of reference
JP5567908B2 (ja) * 2009-06-24 2014-08-06 キヤノン株式会社 3次元計測装置、その計測方法及びプログラム
US8670031B2 (en) * 2009-09-22 2014-03-11 Cyberoptics Corporation High speed optical inspection system with camera array and compact, integrated illuminator
US8681211B2 (en) * 2009-09-22 2014-03-25 Cyberoptics Corporation High speed optical inspection system with adaptive focusing
US8894259B2 (en) * 2009-09-22 2014-11-25 Cyberoptics Corporation Dark field illuminator with large working area
US8872912B2 (en) * 2009-09-22 2014-10-28 Cyberoptics Corporation High speed distributed optical sensor inspection system
CN103429984B (zh) * 2011-03-14 2016-03-02 松下知识产权经营株式会社 焊锡高度检测方法以及焊锡高度检测装置
US9793673B2 (en) 2011-06-13 2017-10-17 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
US8873596B2 (en) 2011-07-22 2014-10-28 Kla-Tencor Corporation Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal
US10197501B2 (en) 2011-12-12 2019-02-05 Kla-Tencor Corporation Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors
US9651499B2 (en) 2011-12-20 2017-05-16 Cognex Corporation Configurable image trigger for a vision system and method for using the same
US9496425B2 (en) 2012-04-10 2016-11-15 Kla-Tencor Corporation Back-illuminated sensor with boron layer
US9601299B2 (en) 2012-08-03 2017-03-21 Kla-Tencor Corporation Photocathode including silicon substrate with boron layer
US9151940B2 (en) 2012-12-05 2015-10-06 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
JP2014115109A (ja) * 2012-12-06 2014-06-26 Canon Inc 距離計測装置及び方法
US9426400B2 (en) 2012-12-10 2016-08-23 Kla-Tencor Corporation Method and apparatus for high speed acquisition of moving images using pulsed illumination
US8929406B2 (en) 2013-01-24 2015-01-06 Kla-Tencor Corporation 193NM laser and inspection system
US9529182B2 (en) 2013-02-13 2016-12-27 KLA—Tencor Corporation 193nm laser and inspection system
US9608399B2 (en) 2013-03-18 2017-03-28 Kla-Tencor Corporation 193 nm laser and an inspection system using a 193 nm laser
WO2014162675A1 (ja) * 2013-04-01 2014-10-09 パナソニック株式会社 複数の光源を有するモーションセンサ装置
US9478402B2 (en) 2013-04-01 2016-10-25 Kla-Tencor Corporation Photomultiplier tube, image sensor, and an inspection system using a PMT or image sensor
US10126252B2 (en) 2013-04-29 2018-11-13 Cyberoptics Corporation Enhanced illumination control for three-dimensional imaging
US9347890B2 (en) 2013-12-19 2016-05-24 Kla-Tencor Corporation Low-noise sensor and an inspection system using a low-noise sensor
US9748294B2 (en) 2014-01-10 2017-08-29 Hamamatsu Photonics K.K. Anti-reflection layer for back-illuminated sensor
US9410901B2 (en) 2014-03-17 2016-08-09 Kla-Tencor Corporation Image sensor, an inspection system and a method of inspecting an article
US9804101B2 (en) 2014-03-20 2017-10-31 Kla-Tencor Corporation System and method for reducing the bandwidth of a laser and an inspection system and method using a laser
US9767986B2 (en) 2014-08-29 2017-09-19 Kla-Tencor Corporation Scanning electron microscope and methods of inspecting and reviewing samples
US9419407B2 (en) 2014-09-25 2016-08-16 Kla-Tencor Corporation Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
US9748729B2 (en) 2014-10-03 2017-08-29 Kla-Tencor Corporation 183NM laser and inspection system
US10748730B2 (en) 2015-05-21 2020-08-18 Kla-Tencor Corporation Photocathode including field emitter array on a silicon substrate with boron layer
US9958257B2 (en) 2015-09-21 2018-05-01 Kla-Tencor Corporation Increasing dynamic range of a height sensor for inspection and metrology
US10313622B2 (en) 2016-04-06 2019-06-04 Kla-Tencor Corporation Dual-column-parallel CCD sensor and inspection systems using a sensor
US10778925B2 (en) 2016-04-06 2020-09-15 Kla-Tencor Corporation Multiple column per channel CCD sensor architecture for inspection and metrology
US10175555B2 (en) 2017-01-03 2019-01-08 KLA—Tencor Corporation 183 nm CW laser and inspection system
US10899138B2 (en) 2017-01-11 2021-01-26 Applied Vision Corporation Container inspection system controlling printheads to correct for detected ink thickness errors
US10309908B2 (en) * 2017-01-11 2019-06-04 Applied Vision Corporation Light field illumination container inspection system
US10943760B2 (en) 2018-10-12 2021-03-09 Kla Corporation Electron gun and electron microscope
US11114491B2 (en) 2018-12-12 2021-09-07 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor

Family Cites Families (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2625856A (en) 1949-09-03 1953-01-20 American Optical Corp Telecentric objective
JPS57702B2 (de) 1971-10-15 1982-01-07
US3995107A (en) 1974-05-08 1976-11-30 Rca Corporation Charge coupled parallel-to-serial converter for scene scanning and display
US4270863A (en) * 1979-11-01 1981-06-02 Owens-Illinois, Inc. Method and apparatus for inspecting objects for defects
US4541010A (en) * 1983-06-17 1985-09-10 Polaroid Corporation Electronic imaging camera
JPS606813A (ja) 1983-06-24 1985-01-14 Gokou Eizou Kagaku Kenkyusho:Kk 高速印刷物の監視装置
US4598321A (en) 1983-12-19 1986-07-01 Rca Corporation CCD imagers with registers partitioned for simultaneous charge transfers in opposing directions
US4641972A (en) 1984-09-14 1987-02-10 New York Institute Of Technology Method and apparatus for surface profilometry
US4782394A (en) * 1985-06-03 1988-11-01 Canon Kabushiki Kaisha Image pickup apparatus having saturation prevention control modes
JPS61293657A (ja) 1985-06-21 1986-12-24 Matsushita Electric Works Ltd 半田付け外観検査方法
GB8518067D0 (en) * 1985-07-17 1985-08-21 Gen Electric Co Plc Image sensors
DE3628147C1 (de) * 1986-08-19 1988-01-07 Kappa Messtechnik Gmbh Verfahren zum Aufnehmen und Speichern von Bildern in schneller Folge
GB2196811B (en) 1986-10-25 1990-05-09 English Electric Valve Co Ltd Image sensors
US5091963A (en) 1988-05-02 1992-02-25 The Standard Oil Company Method and apparatus for inspecting surfaces for contrast variations
US4963024A (en) 1988-07-07 1990-10-16 Kaman Aerospace Corporation Method and apparatus for determining K factor
US4949172A (en) 1988-09-26 1990-08-14 Picker International, Inc. Dual-mode TDI/raster-scan television camera system
US5039868A (en) 1988-11-24 1991-08-13 Omron Corporation Method of and apparatus for inspecting printed circuit boards and the like
US5103105A (en) 1989-11-02 1992-04-07 Matsushita Electric Industrial Co., Ltd. Apparatus for inspecting solder portion of a circuit board
US4984893A (en) 1989-12-01 1991-01-15 Wyko Corporation Phase shifting device and method
DE4007502A1 (de) 1990-03-09 1991-09-12 Zeiss Carl Fa Verfahren und vorrichtung zur beruehrungslosen vermessung von objektoberflaechen
DE4011407A1 (de) 1990-04-09 1991-10-10 Steinbichler Hans Vorrichtung zur quantitativen absolutvermessung der dreidimensionalen koordinaten eines pruefobjekts
DE4013309A1 (de) 1990-04-26 1991-10-31 Zeiss Carl Fa Verfahren und anordnung zur optischen untersuchung von prueflingen
US5069548A (en) 1990-08-08 1991-12-03 Industrial Technology Institute Field shift moire system
US5576829A (en) * 1990-10-08 1996-11-19 Nikon Corporation Method and apparatus for inspecting a phase-shifted mask
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
US5278634A (en) 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system
JPH0587541A (ja) * 1991-05-20 1993-04-06 Suezo Nakatate 2次元情報測定装置
US5424552A (en) 1991-07-09 1995-06-13 Nikon Corporation Projection exposing apparatus
JPH05223532A (ja) 1991-07-10 1993-08-31 Raytheon Co 自動視覚検査システム
JPH05236359A (ja) * 1992-02-18 1993-09-10 Sony Corp 固体撮像装置
KR100281788B1 (ko) * 1992-03-18 2001-02-15 이데이 노부유끼 고체 촬상 장치
JP2711042B2 (ja) 1992-03-30 1998-02-10 シャープ株式会社 クリーム半田の印刷状態検査装置
JP3131801B2 (ja) * 1992-04-20 2001-02-05 株式会社リコー 分離型光ピックアップ装置
US5636025A (en) 1992-04-23 1997-06-03 Medar, Inc. System for optically measuring the surface contour of a part using more fringe techniques
US5216534A (en) 1992-04-24 1993-06-01 E-Systems, Inc. Read-write head for an optical tape recorder
US5307152A (en) 1992-09-29 1994-04-26 Industrial Technology Institute Moire inspection system
JPH06109438A (ja) * 1992-09-30 1994-04-19 Sharp Corp 3次元計測装置
US5504596A (en) * 1992-12-21 1996-04-02 Nikon Corporation Exposure method and apparatus using holographic techniques
US5461417A (en) 1993-02-16 1995-10-24 Northeast Robotics, Inc. Continuous diffuse illumination method and apparatus
JPH06268923A (ja) * 1993-03-16 1994-09-22 Toshiba Corp 固体撮像装置の駆動方法
US5406372A (en) 1993-04-16 1995-04-11 Modular Vision Systems Inc. QFP lead quality inspection system and method
JP3051279B2 (ja) 1993-05-13 2000-06-12 シャープ株式会社 バンプ外観検査方法およびバンプ外観検査装置
JP3189500B2 (ja) 1993-06-25 2001-07-16 松下電器産業株式会社 電子部品の外観検査装置および外観検査方法
DE4342830C1 (de) 1993-12-15 1995-04-20 Haeusler Gerd Vorrichtung zur Erzeugung streifenartiger Lichtmuster
JP3282331B2 (ja) * 1993-12-20 2002-05-13 ミノルタ株式会社 3次元形状測定装置
FR2714785A1 (fr) * 1993-12-30 1995-07-07 Thomson Csf Procédé d'adressage progressif d'un dispositif à transfert de charges et dispositif de prise de vue utilisant ce procédé.
US6445813B1 (en) 1994-08-24 2002-09-03 Matsushita Electric Industrial Co., Ltd. System for inspecting an apparatus of a printed circuit board
JPH0865000A (ja) 1994-08-24 1996-03-08 Matsushita Electric Ind Co Ltd プリント基板外観検査装置
US5555090A (en) 1994-10-24 1996-09-10 Adaptive Optics Associates System for dimensioning objects
DE19511160A1 (de) 1995-03-27 1996-10-02 Ralf Lampalzer Vorrichtung zur Erzeugung von streifenförmigen Intensitätsverteilungen
US5617209A (en) 1995-04-27 1997-04-01 View Engineering, Inc. Method and system for triangulation-based, 3-D imaging utilizing an angled scaning beam of radiant energy
EP0747743B1 (de) 1995-06-03 1997-08-27 Jos. Schneider Optische Werke Kreuznach GmbH & Co. KG Beidseitig telezentrisches Messobjektiv
US5668665A (en) 1995-07-10 1997-09-16 Optical Gaging Products, Inc. Telecentric, parfocal, multiple magnification optical system for videoinspection apparatus
US5867604A (en) 1995-08-03 1999-02-02 Ben-Levy; Meir Imaging measurement system
US5646733A (en) 1996-01-29 1997-07-08 Medar, Inc. Scanning phase measuring method and system for an object at a vision station
US5953448A (en) 1996-03-01 1999-09-14 Textile/Clothing Technology Corporation Contour measurement of an object having a discontinuous surface using block point identification techniques
US5774221A (en) 1996-08-21 1998-06-30 Polaroid Corporation Apparatus and methods for providing phase controlled evanescent illumination
JP3995030B2 (ja) 1996-09-17 2007-10-24 コグネックス・テクノロジー・アンド・インベストメント・コーポレーション 半導体パッケージの検査装置
JP4067602B2 (ja) * 1996-12-09 2008-03-26 富士通株式会社 高さ検査方法、それを実施する高さ検査装置
US5912984A (en) 1996-12-19 1999-06-15 Cognex Corporation Method and apparatus for in-line solder paste inspection
US5982927A (en) * 1996-12-19 1999-11-09 Cognex Corporation Methods and apparatuses for in-line solder paste inspection
US5991461A (en) 1996-12-20 1999-11-23 Veeco Corporation Selection process for sequentially combining multiple sets of overlapping surface-profile interferometric data to produce a continuous composite map
US5862973A (en) 1997-01-30 1999-01-26 Teradyne, Inc. Method for inspecting solder paste in printed circuit board manufacture
US6118524A (en) * 1997-02-26 2000-09-12 Acuity Imaging, Llc Arc illumination apparatus and method
US6201892B1 (en) * 1997-02-26 2001-03-13 Acuity Imaging, Llc System and method for arithmetic operations for electronic package inspection
US5926557A (en) * 1997-02-26 1999-07-20 Acuity Imaging, Llc Inspection method
US5917927A (en) * 1997-03-21 1999-06-29 Satake Corporation Grain inspection and analysis apparatus and method
US5878152A (en) 1997-05-21 1999-03-02 Cognex Corporation Depth from focal gradient analysis using object texture removal by albedo normalization
WO1998055826A2 (en) 1997-06-05 1998-12-10 Electronic Packaging Services, Ltd. Co. Measuring surface flatness using shadow moire technology and phase-stepping image processing
US6608647B1 (en) 1997-06-24 2003-08-19 Cognex Corporation Methods and apparatus for charge coupled device image acquisition with independent integration and readout
US5995232A (en) 1997-07-14 1999-11-30 U.S. Philips Corporation Method of and device for inspecting a PCB
US6219461B1 (en) * 1997-07-29 2001-04-17 Cognex Corporation Determining a depth
US6335757B1 (en) * 1997-09-02 2002-01-01 Bojko Vodanovic CCD imaging device for high speed profiling
JP3831089B2 (ja) * 1997-09-10 2006-10-11 シチズン時計株式会社 格子パターン投影法を用いた3次元形状測定装置
US6573998B2 (en) 1997-11-06 2003-06-03 Cynovad, Inc. Optoelectronic system using spatiochromatic triangulation
US6061476A (en) * 1997-11-24 2000-05-09 Cognex Corporation Method and apparatus using image subtraction and dynamic thresholding
JPH11188914A (ja) 1997-12-25 1999-07-13 Hitachi Cable Ltd 発光ダイオードアレイ装置
US6028673A (en) 1998-03-31 2000-02-22 Ngk Spark Plug Co., Ltd. Inspection of solder bumps of bump-attached circuit board
WO2000003198A1 (en) * 1998-07-08 2000-01-20 Ppt Vision, Inc. Machine vision and semiconductor handling
US6180935B1 (en) * 1999-01-25 2001-01-30 Lockheed Martin Corporation Dynamic range extension of CCD imagers
US6084712A (en) 1998-11-03 2000-07-04 Dynamic Measurement And Inspection,Llc Three dimensional imaging using a refractive optic design
US6303916B1 (en) * 1998-12-24 2001-10-16 Mitutoyo Corporation Systems and methods for generating reproducible illumination
SE514859C2 (sv) 1999-01-18 2001-05-07 Mydata Automation Ab Förfarande och anordning för undersökning av objekt på ett substrat genom att ta bilder av substratet och analysera dessa
CA2277855A1 (fr) 1999-07-14 2001-01-14 Solvision Methode et systeme de mesure de la hauteur des billes de soudure d'un circuit imprime
US6268923B1 (en) * 1999-10-07 2001-07-31 Integral Vision, Inc. Optical method and system for measuring three-dimensional surface topography of an object having a surface contour
CA2296143A1 (fr) 2000-01-18 2001-07-18 9071 9410 Quebec Inc. Systeme d'inspection optique
US6760471B1 (en) 2000-06-23 2004-07-06 Teradyne, Inc. Compensation system and related techniques for use in a printed circuit board inspection system
US6850637B1 (en) 2000-06-28 2005-02-01 Teradyne, Inc. Lighting arrangement for automated optical inspection system

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KR20020067603A (ko) 2002-08-22
US6549647B1 (en) 2003-04-15
US20020191834A1 (en) 2002-12-19
KR100795761B1 (ko) 2008-01-21
JP2003524158A (ja) 2003-08-12
GB2374233B (en) 2004-08-25
GB2374233A (en) 2002-10-09
GB0215886D0 (en) 2002-08-14
US7027639B2 (en) 2006-04-11

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