DE10197124T1 - Mehrstufiger Array-Kondensator und dafür geeignetes Herstellungsverfahren - Google Patents

Mehrstufiger Array-Kondensator und dafür geeignetes Herstellungsverfahren

Info

Publication number
DE10197124T1
DE10197124T1 DE10197124T DE10197124T DE10197124T1 DE 10197124 T1 DE10197124 T1 DE 10197124T1 DE 10197124 T DE10197124 T DE 10197124T DE 10197124 T DE10197124 T DE 10197124T DE 10197124 T1 DE10197124 T1 DE 10197124T1
Authority
DE
Germany
Prior art keywords
manufacturing process
suitable manufacturing
stage array
array capacitor
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10197124T
Other languages
English (en)
Other versions
DE10197124B4 (de
Inventor
Larry E Mosley
Huong Do
David G Figueroa
Kenneth M Brown
Kishore K Chakravorty
Jorge P Rodriguez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of DE10197124T1 publication Critical patent/DE10197124T1/de
Application granted granted Critical
Publication of DE10197124B4 publication Critical patent/DE10197124B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
DE10197124T 2000-12-29 2001-11-28 Mehrstufiger elektrischer Kondensator und dafür geeignetes Herstellungsverfahren Expired - Fee Related DE10197124B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/751,612 US6532143B2 (en) 2000-12-29 2000-12-29 Multiple tier array capacitor
US09/751,612 2000-12-29
PCT/US2001/044878 WO2002054421A2 (en) 2000-12-29 2001-11-28 Multiple tier array capacitor and methods of fabrication therefor

Publications (2)

Publication Number Publication Date
DE10197124T1 true DE10197124T1 (de) 2003-11-13
DE10197124B4 DE10197124B4 (de) 2006-10-26

Family

ID=25022769

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10197124T Expired - Fee Related DE10197124B4 (de) 2000-12-29 2001-11-28 Mehrstufiger elektrischer Kondensator und dafür geeignetes Herstellungsverfahren

Country Status (10)

Country Link
US (1) US6532143B2 (de)
EP (1) EP1384237A2 (de)
JP (1) JP3995596B2 (de)
KR (1) KR100550480B1 (de)
CN (1) CN1316524C (de)
AU (1) AU2002219953A1 (de)
DE (1) DE10197124B4 (de)
GB (1) GB2384912B (de)
MY (1) MY128533A (de)
WO (1) WO2002054421A2 (de)

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Also Published As

Publication number Publication date
EP1384237A2 (de) 2004-01-28
GB2384912A (en) 2003-08-06
GB2384912B (en) 2004-12-22
KR100550480B1 (ko) 2006-02-09
US20020085334A1 (en) 2002-07-04
JP3995596B2 (ja) 2007-10-24
MY128533A (en) 2007-02-28
WO2002054421A3 (en) 2003-11-06
WO2002054421A2 (en) 2002-07-11
US6532143B2 (en) 2003-03-11
CN1316524C (zh) 2007-05-16
CN1484840A (zh) 2004-03-24
AU2002219953A1 (en) 2002-07-16
GB0311850D0 (en) 2003-06-25
JP2004534376A (ja) 2004-11-11
KR20030064887A (ko) 2003-08-02
DE10197124B4 (de) 2006-10-26

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