DE102004026990A1 - Waferebenenhäusen von optoelektronischen Bauelementen - Google Patents

Waferebenenhäusen von optoelektronischen Bauelementen Download PDF

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Publication number
DE102004026990A1
DE102004026990A1 DE102004026990A DE102004026990A DE102004026990A1 DE 102004026990 A1 DE102004026990 A1 DE 102004026990A1 DE 102004026990 A DE102004026990 A DE 102004026990A DE 102004026990 A DE102004026990 A DE 102004026990A DE 102004026990 A1 DE102004026990 A1 DE 102004026990A1
Authority
DE
Germany
Prior art keywords
wafer
wafer level
optoelectronic components
housings
level housings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102004026990A
Other languages
English (en)
Inventor
Kendra J Gallup
Frank S Geefay
Ronald Shane Fazzio
Martha Johnson
Carrie Ann Guthrie
Tanya Jegeris Snyder
Richard C Ruby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of DE102004026990A1 publication Critical patent/DE102004026990A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches

Abstract

Ein Waferebenengehäuse umfasst einen ersten Wafer, der eine Verbindungsanschlussfläche aufweist, ein optoelektronisches Bauelement auf dem ersten Wafer und einen zweiten Wafer, der eine Dichtung aufweist. Der zweite Wafer ist durch eine Verbindung zwischen der Dichtung und der Verbindungsanschlussfläche an dem ersten Wafer befestigt.
DE102004026990A 2003-09-19 2004-06-03 Waferebenenhäusen von optoelektronischen Bauelementen Withdrawn DE102004026990A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/666,363 US6953990B2 (en) 2003-09-19 2003-09-19 Wafer-level packaging of optoelectronic devices

Publications (1)

Publication Number Publication Date
DE102004026990A1 true DE102004026990A1 (de) 2005-04-21

Family

ID=34313093

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004026990A Withdrawn DE102004026990A1 (de) 2003-09-19 2004-06-03 Waferebenenhäusen von optoelektronischen Bauelementen

Country Status (4)

Country Link
US (2) US6953990B2 (de)
JP (1) JP4889932B2 (de)
CN (1) CN1607682A (de)
DE (1) DE102004026990A1 (de)

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US20050062122A1 (en) 2005-03-24
JP2005094019A (ja) 2005-04-07
US6953990B2 (en) 2005-10-11
JP4889932B2 (ja) 2012-03-07
US20050142692A1 (en) 2005-06-30
US7422929B2 (en) 2008-09-09

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