DE102008025483A1 - Surfaces treatment device for use in plasma surface treatment plant to treat surface of workpiece, has shielding grid that is arranged between workpiece and nozzle, where workpiece with to-be-treated-surface rests on carrier - Google Patents
Surfaces treatment device for use in plasma surface treatment plant to treat surface of workpiece, has shielding grid that is arranged between workpiece and nozzle, where workpiece with to-be-treated-surface rests on carrier Download PDFInfo
- Publication number
- DE102008025483A1 DE102008025483A1 DE102008025483A DE102008025483A DE102008025483A1 DE 102008025483 A1 DE102008025483 A1 DE 102008025483A1 DE 102008025483 A DE102008025483 A DE 102008025483A DE 102008025483 A DE102008025483 A DE 102008025483A DE 102008025483 A1 DE102008025483 A1 DE 102008025483A1
- Authority
- DE
- Germany
- Prior art keywords
- workpiece
- nozzle
- plasma
- treated
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/32—Plasma torches using an arc
- H05H1/34—Details, e.g. electrodes, nozzles
- H05H1/3457—Nozzle protection devices
Abstract
Description
Die Erfindung betrifft eine Plasmaoberflächenbehandlungsanlage nach dem Oberbegriff des Anspruchs 1.The The invention relates to a plasma surface treatment plant according to the preamble of claim 1.
Bekannt sind Plasmaoberflächenbehandlungsanlagen, die im Wesentlichen aus einer Zuleitung für das Prozessgas, einem Entladungsraum und einer Düse bestehen, wobei durch die Düse der Plasmastrahl auf die zu behandelnde Probe fällt.Known are plasma surface treatment plants, essentially from a supply line for the process gas, a discharge space and a nozzle exist, passing through the nozzle the plasma jet falls on the sample to be treated.
In modernen Fertigungslinien werden die Oberflächen von Werkstücken, Folien, Elektronikbaugruppen, usw. für spätere Bearbeitungsprozesse (Beschichtungen, Kleben usw.) oder zum Reinigen mit Plasma-Strahl behandelt. Dabei wird ein Prozessgas, z. B. Luft, bei Atmosphärendruck, mit hoher Geschwindigkeit durch eine Lichtbogenstrecke geleitet. Das stark ionisierte und heiße Gas verlässt den Lichtbogenraum durch eine geerdete Düsenbohrung als ein ca. 2 cm langer Strahl und wird auf die zu behandelnde Oberfläche gerichtet. Dort reagiert es mit der Oberfläche des Werkstückes in der gewünschten Art.In modern production lines become the surfaces of workpieces, foils, Electronic assemblies, etc. for latter Machining processes (coatings, gluing etc.) or for cleaning with Plasma beam treated. In this case, a process gas, eg. Air, at atmospheric pressure, passed through an arc at high speed. The highly ionized and hot Gas leaves the arcing space through a grounded nozzle bore as a 2 cm long beam and is aimed at the surface to be treated. There it reacts with the surface of the workpiece in the desired manner.
Da der Lichtbogen auch im Bereich des Düsenaustritts brennt, soll durch die Erdung der Düse ein weiterer Austritt des Lichtbogens verhindert werden. Dennoch ist es nicht auszuschließen, dass der Lichtbogen auf die Oberfläche des Werkstücks überspringt und dort spannungsempfindliche Bauteile wie beispielsweise CMOS-Schaltkreise, beschädigt und/oder eine lokale Überhitzung der Oberfläche verursacht. Bei Beschichtungen von Folien verursachen diese Lichtbögen Inhomogenitäten in der Schicht.There the arc also burns in the area of the nozzle outlet, should through the earthing of the nozzle further escape of the arc can be prevented. Nevertheless, it is it can not be ruled out that the arc jumps to the surface of the workpiece and there voltage-sensitive components such as CMOS circuits, damaged and / or a local overheating the surface caused. In film coatings, these arcs cause inhomogeneities in the film Layer.
Nachteilig an den bekannten Vorrichtungen zur Behandlung von Oberflächen mittels Plasma oder kurz „Plasmaoberflächenbehandlungsanlagen” genannt, ist, dass unter Umständen ein Überspringen von Lichtbögen aus dem Plasma-Generator-Raum auf die zu behandelnde Oberfläche vorkommt.adversely in the known devices for the treatment of surfaces by means Plasma or "plasma surface treatment plants" for short, is that under circumstances a skip of arcs from the plasma generator room on the surface to be treated occurs.
Aufgabe der vorliegenden Erfindung ist daher, eine Vorrichtung zur Behandlung von Oberflächen mittels Plasma zu schaffen, mit der ein Überspringen von Lichtbögen oder Überspannung von dem Plasmagenerator auf die zu behandelnde Oberfläche (vermindert oder gar) vermieden wird, während der ionisierte Gasstrahl (Plasmastrahl) die Werkstückoberfläche möglichst ungehindert erreicht.task The present invention is therefore an apparatus for treatment of surfaces by means of plasma, with the skipping of arcs or overvoltage from the plasma generator to the surface to be treated (diminished or even) is avoided while the ionized gas jet (plasma jet) the workpiece surface as possible reached unhindered.
Lösung der
Aufgabe und Gegenstand der Erfindung ist eine Vorrichtung zur Behandlung
von Oberflächen
mittels Plasma, folgende Teile zumindest umfassend:
Eine Zuleitung
für ein
Prozessgas zu einem zentral positionierten Entladungsraum mit einem
Plasmagenerator, der über
eine Düse
verfügt,
durch die der Plasmastrahl austritt, wobei die Düse auf einen Träger gerichtet
ist, auf dem das Werkstück
mit der zu behandelnden Oberfläche
liegt, dadurch gekennzeichnet, dass zwischen dem Werkstück und der Düse ein Abschirmgitter
angeordnet ist.Solution to the problem and object of the invention is a device for the treatment of surfaces by means of plasma, comprising at least the following parts:
A supply line for a process gas to a centrally positioned discharge space with a plasma generator having a nozzle through which the plasma jet emerges, wherein the nozzle is directed to a support on which the workpiece lies with the surface to be treated, characterized in that a shielding grid is arranged between the workpiece and the nozzle.
Nach einer vorteilhaften Ausführungsform der Erfindung ist das Abschirmgitter geerdet.To an advantageous embodiment of the Invention, the shield grid is grounded.
Nach einer weiteren vorteilhaften Ausführungsform der Erfindung liegt das Abschirmgitter auf einem erdnahen Potential.To a further advantageous embodiment of the invention lies the shielding grid on a near-earth potential.
Nach einer weiteren vorteilhaften Ausführungsform der Erfindung ist das Abschirmgitter bauteilnah positioniert.To a further advantageous embodiment of the invention the shielding grid positioned close to the component.
Nach einer weiteren vorteilhaften Ausführungsform besteht das Abschirmgitter aus dem gleichen Material wie die Plasmadüse.To According to a further advantageous embodiment, the screening grid made of the same material as the plasma nozzle.
Nach einer weiteren vorteilhaften Ausführungsform besteht das Abschirmgitter aus Stahl bevorzugt aus V2A-Stahl.To According to a further advantageous embodiment, the screening grid made of steel, preferably made of V2A steel.
Im
Weiteren wird die Erfindung noch anhand einer Figur näher erläutert:
Die
Figur zeigt eine Vorrichtung zur Behandlung von Oberflächen mittels
Plasma, folgende Teile sind schematisch wiedergegeben:
Zu erkennen
ist die Prozessgaszuleitung
The figure shows a device for the treatment of surfaces by means of plasma, the following parts are shown schematically:
The process gas supply can be seen
Zwischen
das zu behandelnden Werkstück
Die Erfindung betrifft eine Plasmaoberflächenbehandlungsanlage, die im Wesentlichen aus einer Zuleitung für das Prozessgas, einem Entladungsraum und einer Düse bestehen, wobei durch die Düse der Plasmastrahl auf die zu behandelnde Probe fällt. Dabei wird, um ein Überspringen von Lichtbögen aus dem Entladungsraum auf die zu behandelnde Oberfläche zu verhindern, erfindungsgemäß ein Abschirmgitter zwischen die zu behandelnde Oberfläche und die Plasmadüse eingebaut.The invention relates to a plasma surface treatment system, which consists essentially of a supply line for the process gas, a Entla tion space and a nozzle, with the plasma jet falling through the nozzle onto the sample to be treated. In this case, in order to prevent skipping of arcs from the discharge space to the surface to be treated, according to the invention a shielding grid between the surface to be treated and the plasma nozzle installed.
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008025483A DE102008025483A1 (en) | 2008-05-28 | 2008-05-28 | Surfaces treatment device for use in plasma surface treatment plant to treat surface of workpiece, has shielding grid that is arranged between workpiece and nozzle, where workpiece with to-be-treated-surface rests on carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008025483A DE102008025483A1 (en) | 2008-05-28 | 2008-05-28 | Surfaces treatment device for use in plasma surface treatment plant to treat surface of workpiece, has shielding grid that is arranged between workpiece and nozzle, where workpiece with to-be-treated-surface rests on carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102008025483A1 true DE102008025483A1 (en) | 2009-12-10 |
Family
ID=41268601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102008025483A Withdrawn DE102008025483A1 (en) | 2008-05-28 | 2008-05-28 | Surfaces treatment device for use in plasma surface treatment plant to treat surface of workpiece, has shielding grid that is arranged between workpiece and nozzle, where workpiece with to-be-treated-surface rests on carrier |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102008025483A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2077300A (en) * | 1980-04-10 | 1981-12-16 | Asu Composants Sa | Cermet coatings containing noble metals |
DE4232998A1 (en) * | 1992-10-01 | 1994-04-07 | Basf Ag | Process for the surface treatment of plastic parts |
US6331701B1 (en) * | 1998-05-20 | 2001-12-18 | Lee Chen | RF-grounded sub-Debye neutralizer grid |
WO2002078407A2 (en) * | 2001-03-26 | 2002-10-03 | Ebara Corporation | Neutral particle beam processing apparatus |
DE102006019664A1 (en) * | 2006-04-27 | 2007-10-31 | Institut für Niedertemperatur-Plasmaphysik e.V. an der Ernst-Moritz-Arndt-Universität Greifswald | Plasma tool for production of cold plasma stream including hollow body for feeding process gas, frequency generator and voltage coil useful for treating inner and outer surfaces of components avoids use of air dielectric capacitors |
-
2008
- 2008-05-28 DE DE102008025483A patent/DE102008025483A1/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2077300A (en) * | 1980-04-10 | 1981-12-16 | Asu Composants Sa | Cermet coatings containing noble metals |
DE4232998A1 (en) * | 1992-10-01 | 1994-04-07 | Basf Ag | Process for the surface treatment of plastic parts |
US6331701B1 (en) * | 1998-05-20 | 2001-12-18 | Lee Chen | RF-grounded sub-Debye neutralizer grid |
WO2002078407A2 (en) * | 2001-03-26 | 2002-10-03 | Ebara Corporation | Neutral particle beam processing apparatus |
DE102006019664A1 (en) * | 2006-04-27 | 2007-10-31 | Institut für Niedertemperatur-Plasmaphysik e.V. an der Ernst-Moritz-Arndt-Universität Greifswald | Plasma tool for production of cold plasma stream including hollow body for feeding process gas, frequency generator and voltage coil useful for treating inner and outer surfaces of components avoids use of air dielectric capacitors |
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Legal Events
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OP8 | Request for examination as to paragraph 44 patent law | ||
8139 | Disposal/non-payment of the annual fee |