DE112005001051T5 - Wärmerohr-Wärmeverteiler mit durchragenden Befestigungsöffnungen für eine integrierte Schaltung - Google Patents
Wärmerohr-Wärmeverteiler mit durchragenden Befestigungsöffnungen für eine integrierte Schaltung Download PDFInfo
- Publication number
- DE112005001051T5 DE112005001051T5 DE112005001051T DE112005001051T DE112005001051T5 DE 112005001051 T5 DE112005001051 T5 DE 112005001051T5 DE 112005001051 T DE112005001051 T DE 112005001051T DE 112005001051 T DE112005001051 T DE 112005001051T DE 112005001051 T5 DE112005001051 T5 DE 112005001051T5
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- mounting holes
- protruding mounting
- heat pipe
- heat spreader
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/04—Fastening; Joining by brazing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/841,784 US6896039B2 (en) | 1999-05-12 | 2004-05-07 | Integrated circuit heat pipe heat spreader with through mounting holes |
PCT/US2005/006370 WO2005114084A1 (en) | 2004-05-07 | 2005-02-28 | Integrated circuit heat pipe heat spreader with through mounting holes |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112005001051T5 true DE112005001051T5 (de) | 2007-05-16 |
Family
ID=35428471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112005001051T Withdrawn DE112005001051T5 (de) | 2004-05-07 | 2005-02-28 | Wärmerohr-Wärmeverteiler mit durchragenden Befestigungsöffnungen für eine integrierte Schaltung |
Country Status (4)
Country | Link |
---|---|
US (3) | US6896039B2 (de) |
CN (1) | CN1957221A (de) |
DE (1) | DE112005001051T5 (de) |
WO (1) | WO2005114084A1 (de) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6896039B2 (en) * | 1999-05-12 | 2005-05-24 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US20020084061A1 (en) * | 2001-01-03 | 2002-07-04 | Rosenfeld John H. | Chemically compatible, lightweight heat pipe |
US7575043B2 (en) * | 2002-04-29 | 2009-08-18 | Kauppila Richard W | Cooling arrangement for conveyors and other applications |
US7615005B2 (en) * | 2003-05-16 | 2009-11-10 | Ethicon Endo-Surgery, Inc. | Medical apparatus for use with an endoscope |
US6987317B2 (en) | 2003-09-30 | 2006-01-17 | Intel Corporation | Power delivery using an integrated heat spreader |
CA2574200A1 (en) * | 2004-07-21 | 2006-01-26 | Xiao Huang | Hybrid wicking materials for use in high performance heat pipes |
TW200637017A (en) * | 2005-04-14 | 2006-10-16 | Chipmos Technologies Inc | Image sensor module package |
JP4617209B2 (ja) * | 2005-07-07 | 2011-01-19 | 株式会社豊田自動織機 | 放熱装置 |
TWI317414B (en) * | 2005-10-21 | 2009-11-21 | Foxconn Tech Co Ltd | Sintered heat pipe and method for manufacturing the same |
US7360581B2 (en) * | 2005-11-07 | 2008-04-22 | 3M Innovative Properties Company | Structured thermal transfer article |
US7695808B2 (en) * | 2005-11-07 | 2010-04-13 | 3M Innovative Properties Company | Thermal transfer coating |
FR2896443B1 (fr) * | 2006-01-25 | 2008-02-29 | Alcatel Sa | Procede de fabrication de panneaux a caloducs et/ou inserts integres maintenus par des languettes |
US7518868B2 (en) | 2006-02-28 | 2009-04-14 | International Business Machines Corporation | Apparatus, system, and method for efficient heat dissipation |
US20080035313A1 (en) * | 2006-08-09 | 2008-02-14 | Hul-Chun Hsu | Heat-Conducting Base and Isothermal Plate having the same |
KR20080053556A (ko) * | 2006-12-11 | 2008-06-16 | 현대자동차주식회사 | 하이브리드 전기자동차의 인버터 및 ldc용 냉각장치 |
CN200994225Y (zh) * | 2006-12-29 | 2007-12-19 | 帛汉股份有限公司 | 电路基板结构 |
KR100809587B1 (ko) | 2007-02-02 | 2008-03-04 | 이용덕 | 판형 열전달장치 |
TWM318115U (en) * | 2007-04-09 | 2007-09-01 | Tai Sol Electronics Co Ltd | Flat heat pipe |
US7957134B2 (en) * | 2007-04-10 | 2011-06-07 | Hewlett-Packard Development Company, L.P. | System and method having evaporative cooling for memory |
DE202007007568U1 (de) * | 2007-05-25 | 2007-09-20 | Boston Cool Tec Corporation, Wilmington | Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden |
US20090260785A1 (en) * | 2008-04-17 | 2009-10-22 | Wang Cheng-Tu | Heat plate with capillary supporting structure and manufacturing method thereof |
US20090314472A1 (en) * | 2008-06-18 | 2009-12-24 | Chul Ju Kim | Evaporator For Loop Heat Pipe System |
DE102008054233A1 (de) * | 2008-10-31 | 2010-05-06 | Osram Opto Semiconductors Gmbh | Leuchtmodul |
CN101782342B (zh) * | 2009-01-16 | 2013-03-20 | 富瑞精密组件(昆山)有限公司 | 热管及其毛细结构的制作方法 |
US9163883B2 (en) | 2009-03-06 | 2015-10-20 | Kevlin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
JP5407749B2 (ja) * | 2009-10-26 | 2014-02-05 | 日本電気株式会社 | インサーキットテストフィクスチャの冷却構造 |
US20120000530A1 (en) * | 2010-07-02 | 2012-01-05 | Miles Mark W | Device for harnessing solar energy with integrated heat transfer core, regenerator, and condenser |
US9546826B1 (en) | 2010-01-21 | 2017-01-17 | Hrl Laboratories, Llc | Microtruss based thermal heat spreading structures |
US8921702B1 (en) * | 2010-01-21 | 2014-12-30 | Hrl Laboratories, Llc | Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments |
EP2395309A1 (de) * | 2010-06-08 | 2011-12-14 | Thermal Corp. | Wärmerohr |
KR20120085397A (ko) * | 2011-01-24 | 2012-08-01 | 삼성전자주식회사 | 백라이트 어셈블리 |
TWI484890B (zh) * | 2011-08-17 | 2015-05-11 | Asia Vital Components Co Ltd | 散熱單元之固定結構 |
TWI479302B (zh) * | 2011-08-17 | 2015-04-01 | Asia Vital Components Co Ltd | 散熱裝置之固定結構 |
TWI524046B (zh) * | 2011-08-17 | 2016-03-01 | 奇鋐科技股份有限公司 | 散熱元件之固定結構 |
CN102958318B (zh) * | 2011-08-17 | 2015-06-24 | 奇鋐科技股份有限公司 | 散热元件的固定结构 |
CN102297395A (zh) * | 2011-09-07 | 2011-12-28 | 福建蓝蓝高科技发展有限公司 | Led灯具高散热装置 |
US20130098592A1 (en) | 2011-10-25 | 2013-04-25 | Asia Vital Components Co., Ltd. | Heat dissipation device and manufacturing method thereof |
DE102011119174A1 (de) | 2011-11-23 | 2013-05-23 | Inheco Industrial Heating And Cooling Gmbh | Vapor Chamber |
US20130168052A1 (en) * | 2011-12-30 | 2013-07-04 | Celsia Technologies Taiwan, Inc. | Heat pipe and composition of capillary wick thereof |
US20130168057A1 (en) * | 2011-12-30 | 2013-07-04 | Teledyne Scientific & Imaging, Llc | Modular heat shield and heat spreader |
US9417015B2 (en) | 2012-02-22 | 2016-08-16 | Thermal Corp. | Heat exchanger backing plate and method of assembling same |
US9599408B1 (en) * | 2012-03-03 | 2017-03-21 | Advanced Cooling Technologies, Inc. | Loop heat pipe evaporator including a second heat pipe |
JP6191137B2 (ja) * | 2012-05-14 | 2017-09-06 | 富士通株式会社 | 冷却装置 |
CN102818467B (zh) * | 2012-09-12 | 2014-06-18 | 锘威科技(深圳)有限公司 | 平板热管及其制作方法 |
US9405067B2 (en) | 2013-03-13 | 2016-08-02 | Hrl Laboratories, Llc | Micro-truss materials having in-plane material property variations |
US20150173243A1 (en) * | 2013-12-13 | 2015-06-18 | General Electric Company | Integrated heat exchange assembly and an associated method thereof |
US9498858B2 (en) | 2014-08-08 | 2016-11-22 | SEAKR Engineering, Inc. | System and method for dissipating thermal energy |
US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
WO2016114840A2 (en) * | 2014-10-28 | 2016-07-21 | Kelvin Thermal Technologies, Inc. | Polymer-based microfabricated thermal ground plane |
US20170010048A1 (en) * | 2015-07-09 | 2017-01-12 | Chaun-Choung Technology Corp. | Thin vapor chamber and manufacturing method thereof |
CN105658032B (zh) * | 2016-01-22 | 2019-06-04 | 白鹏飞 | 一种超薄均热板及其制作方法 |
CN106052435A (zh) * | 2016-06-02 | 2016-10-26 | 吴本刚 | 蜗杆式饲料供给装置 |
US20180156545A1 (en) * | 2016-12-05 | 2018-06-07 | Microsoft Technology Licensing, Llc | Vapor chamber with three-dimensional printed spanning structure |
WO2018198375A1 (ja) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | ベーパーチャンバー |
US10211125B2 (en) | 2017-07-19 | 2019-02-19 | Heatscape.Com, Inc. | Configurable mounting hole structure for flush mount integration with vapor chamber forming plates |
WO2019018943A1 (en) * | 2017-07-28 | 2019-01-31 | Dana Canada Corporation | ULTRA-THIN HEAT EXCHANGERS FOR HEAT MANAGEMENT |
CN107660102A (zh) * | 2017-09-14 | 2018-02-02 | 南京理工大学 | 槽道‑纳米花复合毛细芯结构及其制备方法 |
US10458718B2 (en) * | 2017-11-29 | 2019-10-29 | Asia Vital Components Co., Ltd. | Airtight penetration structure for heat dissipation device |
TWI707118B (zh) * | 2018-01-23 | 2020-10-11 | 訊凱國際股份有限公司 | 均溫板 |
US20200024763A1 (en) * | 2018-07-23 | 2020-01-23 | Microsoft Technology Licensing, Llc | Electroform vapor chamber integrated thermal module into pcb layout design |
US11076510B2 (en) * | 2018-08-13 | 2021-07-27 | Facebook Technologies, Llc | Heat management device and method of manufacture |
JP7146524B2 (ja) * | 2018-08-13 | 2022-10-04 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
CN109152298B (zh) * | 2018-09-30 | 2020-05-08 | 航天特种材料及工艺技术研究所 | 一种轻质温控装置及其制造方法 |
CN110336902B (zh) * | 2019-06-28 | 2021-03-12 | Oppo广东移动通信有限公司 | 电子设备的后壳、其制备方法、壳体组件以及电子设备 |
US11680753B2 (en) * | 2019-11-14 | 2023-06-20 | Rolls-Royce Corporation | Fused filament fabrication of heat pipe |
US11745264B2 (en) | 2019-11-14 | 2023-09-05 | Rolls-Royce Corporation | Fused filament fabrication of thermal management article |
US11707788B2 (en) | 2019-11-14 | 2023-07-25 | Rolls-Royce Corporation | Fused filament fabrication of vacuum insulator |
US20210364238A1 (en) * | 2020-05-21 | 2021-11-25 | Acer Incorporated | Vapor chamber structure |
WO2021258028A1 (en) | 2020-06-19 | 2021-12-23 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
CN114543569A (zh) * | 2020-11-24 | 2022-05-27 | 亚浩电子五金塑胶(惠州)有限公司 | 立体传热装置 |
CN115548523B (zh) * | 2022-09-30 | 2024-01-23 | 厦门海辰储能科技股份有限公司 | 电芯、电池模组、电池包及储能设备 |
Family Cites Families (136)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3209062A (en) * | 1963-01-25 | 1965-09-28 | Westinghouse Electric Corp | Mounting and coolant system for semiconductor heat generating devices |
DE1284506B (de) | 1964-10-24 | 1968-12-05 | Linde Ag | Traegerblech fuer temperaturempfindliche elektrische Schaltungsteile |
US3490718A (en) * | 1967-02-01 | 1970-01-20 | Nasa | Capillary radiator |
US3543841A (en) | 1967-10-19 | 1970-12-01 | Rca Corp | Heat exchanger for high voltage electronic devices |
US3519067A (en) * | 1967-12-28 | 1970-07-07 | Honeywell Inc | Variable thermal conductance devices |
US3519063A (en) * | 1968-07-18 | 1970-07-07 | United Aircraft Corp | Shell mold construction with chill plate having uniform roughness |
US3613778A (en) * | 1969-03-03 | 1971-10-19 | Northrop Corp | Flat plate heat pipe with structural wicks |
US3537514A (en) | 1969-03-12 | 1970-11-03 | Teledyne Inc | Heat pipe for low thermal conductivity working fluids |
BE757262A (fr) * | 1969-10-10 | 1971-04-08 | Union Carbide Corp | Couche metallique poreuse et procede pour la former |
US3681843A (en) * | 1970-03-06 | 1972-08-08 | Westinghouse Electric Corp | Heat pipe wick fabrication |
US3675711A (en) * | 1970-04-08 | 1972-07-11 | Singer Co | Thermal shield |
US3680189A (en) * | 1970-12-09 | 1972-08-01 | Noren Products Inc | Method of forming a heat pipe |
US3834457A (en) * | 1971-01-18 | 1974-09-10 | Bendix Corp | Laminated heat pipe and method of manufacture |
US3788388A (en) * | 1971-02-19 | 1974-01-29 | Q Dot Corp | Heat exchange system |
DE2120475A1 (de) * | 1971-04-27 | 1972-11-02 | Brown, Boveri & Cie Ag, 6800 Mannheim | Wärmerohr |
DE2120477C3 (de) * | 1971-04-27 | 1980-07-31 | Brown, Boveri & Cie Ag, 6800 Mannheim | Elektrisch isolierende Wärmerohranordnung für hohe Wärmestromdichte |
US3934643A (en) * | 1971-07-26 | 1976-01-27 | Nikolaus Laing | Controllable heat pipe |
US3762011A (en) * | 1971-12-16 | 1973-10-02 | Trw Inc | Method of fabricating a capillary heat pipe wick |
SU407160A1 (ru) | 1972-02-07 | 1973-11-21 | Плоская тепловая труба | |
DE2235792A1 (de) | 1972-07-21 | 1974-01-31 | Dornier System Gmbh | Vorrichtung zur uebertragung von waermeenergie |
DE2502138C3 (de) * | 1975-01-21 | 1978-10-12 | Rowenta-Werke Gmbh, 6050 Offenbach | Gasfeuerzeugbrenner |
GB1484831A (en) * | 1975-03-17 | 1977-09-08 | Hughes Aircraft Co | Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components |
US4046190A (en) * | 1975-05-22 | 1977-09-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flat-plate heat pipe |
US4047198A (en) * | 1976-04-19 | 1977-09-06 | Hughes Aircraft Company | Transistor cooling by heat pipes having a wick of dielectric powder |
SU589531A1 (ru) | 1976-05-20 | 1978-01-25 | Предприятие П/Я А-1665 | Теплообменное устройство |
US4101691A (en) * | 1976-09-09 | 1978-07-18 | Union Carbide Corporation | Enhanced heat transfer device manufacture |
FR2371633A1 (fr) | 1976-11-19 | 1978-06-16 | Dupont S T | Appareil a gaz liquefie, notamment briquet a gaz pour fumeurs |
US4145708A (en) * | 1977-06-13 | 1979-03-20 | General Electric Company | Power module with isolated substrates cooled by integral heat-energy-removal means |
US4231423A (en) | 1977-12-09 | 1980-11-04 | Grumman Aerospace Corporation | Heat pipe panel and method of fabrication |
JPS54154277A (en) | 1978-05-25 | 1979-12-05 | Sharp Corp | Heat radiation device |
US4274479A (en) * | 1978-09-21 | 1981-06-23 | Thermacore, Inc. | Sintered grooved wicks |
DE2854298C3 (de) | 1978-12-15 | 1981-06-04 | Anschuetz & Co Gmbh, 2300 Kiel | Schmierstoffkreislauf für das Lager einer umlaufenden Welle |
US4327752A (en) * | 1979-12-05 | 1982-05-04 | Braun, Aktiengesellschaft | Rotary ignition system for a catalytically heated curling device |
US4279479A (en) * | 1980-05-29 | 1981-07-21 | Melvin Schrier | Vision screening kit |
DE3072058D1 (en) * | 1980-09-30 | 1988-01-21 | Braun Ag | Hair curling apparatus |
US4366526A (en) | 1980-10-03 | 1982-12-28 | Grumman Aerospace Corporation | Heat-pipe cooled electronic circuit card |
US4382448A (en) * | 1981-07-10 | 1983-05-10 | Braun Aktiengesellschaft | Electrical ignition system for a catalytically heated curling device |
US4641404A (en) * | 1981-10-05 | 1987-02-10 | Seydel Scott O | Porous warp sizing apparatus |
SU987357A2 (ru) | 1981-12-16 | 1983-01-07 | Предприятие П/Я Г-4371 | Плоска теплова труба |
US4489777A (en) | 1982-01-21 | 1984-12-25 | Del Bagno Anthony C | Heat pipe having multiple integral wick structures |
US4461343A (en) * | 1982-01-28 | 1984-07-24 | Mcdonnell Douglas Corporation | Plated heat pipe |
US4503483A (en) * | 1982-05-03 | 1985-03-05 | Hughes Aircraft Company | Heat pipe cooling module for high power circuit boards |
JPS5924538A (ja) * | 1982-07-30 | 1984-02-08 | Japan Radio Co Ltd | ヒ−トパイプおよびその製造方法 |
US5148440A (en) * | 1983-11-25 | 1992-09-15 | The United States Of America As Represented By The United States Department Of Energy | Wick for metal vapor laser |
US4616699A (en) * | 1984-01-05 | 1986-10-14 | Mcdonnell Douglas Corporation | Wick-fin heat pipe |
SU1261029A1 (ru) | 1984-04-02 | 1986-09-30 | Ордена Трудового Красного Знамени Институт Тепло- И Массообмена Им.А.В.Лыкова | Устройство дл охлаждени силовых полупроводниковых приборов |
US4557413A (en) | 1984-04-11 | 1985-12-10 | Mcdonnell Douglas | Heat pipe fabrication |
FR2579371B1 (fr) | 1985-03-19 | 1987-09-11 | Contardo Spa | Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase |
US4777561A (en) * | 1985-03-26 | 1988-10-11 | Hughes Aircraft Company | Electronic module with self-activated heat pipe |
US4865729A (en) * | 1985-11-04 | 1989-09-12 | Sepragen Corporation | Radial thin layer chromatography |
FR2595052B1 (fr) * | 1986-03-03 | 1990-06-01 | Armines | Procede et dispositif de vaporisation rapide d'un liquide |
US4697205A (en) * | 1986-03-13 | 1987-09-29 | Thermacore, Inc. | Heat pipe |
US4765396A (en) * | 1986-12-16 | 1988-08-23 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polymeric heat pipe wick |
US4960202A (en) * | 1987-01-14 | 1990-10-02 | Ingersoll-Rand Company | Friction control for bearing surface of roller |
US4819719A (en) * | 1987-01-20 | 1989-04-11 | Mcdonnell Douglas Corporation | Enhanced evaporator surface |
US4912548A (en) * | 1987-01-28 | 1990-03-27 | National Semiconductor Corporation | Use of a heat pipe integrated with the IC package for improving thermal performance |
DE3862511D1 (de) * | 1987-04-28 | 1991-05-29 | Sig Schweiz Industrieges | Siegelbacke fuer verpackungsmaschinen. |
JPH063354B2 (ja) * | 1987-06-23 | 1994-01-12 | アクトロニクス株式会社 | ル−プ型細管ヒ−トパイプ |
US4830097A (en) * | 1987-07-15 | 1989-05-16 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Space vehicle thermal rejection system |
SU1476297A2 (ru) | 1987-09-28 | 1989-04-30 | Институт Физико-Технических Проблем Энергетики Ан Литсср | Теплова труба |
US4807697A (en) * | 1988-02-18 | 1989-02-28 | Thermacore, Inc. | External artery heat pipe |
USH971H (en) * | 1988-10-24 | 1991-10-01 | The United States Of America As Represented By The Secretary Of The Air Force | Regidized porous material and method |
US4885129A (en) | 1988-10-24 | 1989-12-05 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks |
US4929414A (en) * | 1988-10-24 | 1990-05-29 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks and arteries |
US5101560A (en) * | 1988-10-24 | 1992-04-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making an anisotropic heat pipe and wick |
US4931905A (en) * | 1989-01-17 | 1990-06-05 | Grumman Aerospace Corporation | Heat pipe cooled electronic circuit card |
US4883116A (en) | 1989-01-31 | 1989-11-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ceramic heat pipe wick |
US4880052A (en) | 1989-02-27 | 1989-11-14 | Thermacore, Inc. | Heat pipe cooling plate |
US5059496A (en) | 1989-03-23 | 1991-10-22 | Globe-Union Inc. | Nickel-hydrogen battery with oxygen and electrolyte management features |
DE69016119T2 (de) * | 1989-07-19 | 1995-08-31 | Showa Aluminum Corp | Wärmerohr. |
US5052472A (en) * | 1989-07-19 | 1991-10-01 | Hitachi, Ltd. | LSI temperature control system |
BR9106048A (pt) * | 1990-02-20 | 1993-07-06 | Procter & Gamble | Estrutura e folha polimericas de canais capilares,tecido,processo e matriz de extrusao |
US5242644A (en) * | 1990-02-20 | 1993-09-07 | The Procter & Gamble Company | Process for making capillary channel structures and extrusion die for use therein |
US5160252A (en) | 1990-06-07 | 1992-11-03 | Edwards Thomas C | Rotary vane machines with anti-friction positive bi-axial vane motion controls |
US5711816A (en) * | 1990-07-06 | 1998-01-27 | Advanced Technolgy Materials, Inc. | Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same |
US5000256A (en) * | 1990-07-20 | 1991-03-19 | Minnesota Mining And Manufacturing Company | Heat transfer bag with thermal via |
US5219020A (en) * | 1990-11-22 | 1993-06-15 | Actronics Kabushiki Kaisha | Structure of micro-heat pipe |
US5076352A (en) | 1991-02-08 | 1991-12-31 | Thermacore, Inc. | High permeability heat pipe wick structure |
US5333470A (en) * | 1991-05-09 | 1994-08-02 | Heat Pipe Technology, Inc. | Booster heat pipe for air-conditioning systems |
US5103897A (en) * | 1991-06-05 | 1992-04-14 | Martin Marietta Corporation | Flowrate controller for hybrid capillary/mechanical two-phase thermal loops |
EP0529837B1 (de) | 1991-08-26 | 1996-05-29 | Sun Microsystems, Inc. | Verfahren und Apparat zum Kühlen von Mehrchip-Moduln durch die vollständige Wärmerohr-Technologie |
JPH0563385A (ja) * | 1991-08-30 | 1993-03-12 | Hitachi Ltd | ヒートパイプ付き電子機器及び計算機 |
US5386143A (en) * | 1991-10-25 | 1995-01-31 | Digital Equipment Corporation | High performance substrate, electronic package and integrated circuit cooling process |
US5253702A (en) * | 1992-01-14 | 1993-10-19 | Sun Microsystems, Inc. | Integral heat pipe, heat exchanger, and clamping plate |
JPH0629683A (ja) * | 1992-03-31 | 1994-02-04 | Furukawa Electric Co Ltd:The | 電子機器用ヒートパイプ式放熱ユニット |
US5283715A (en) * | 1992-09-29 | 1994-02-01 | International Business Machines, Inc. | Integrated heat pipe and circuit board structure |
US5305185A (en) * | 1992-09-30 | 1994-04-19 | Samarov Victor M | Coplanar heatsink and electronics assembly |
US5323292A (en) * | 1992-10-06 | 1994-06-21 | Hewlett-Packard Company | Integrated multi-chip module having a conformal chip/heat exchanger interface |
US5305184A (en) * | 1992-12-16 | 1994-04-19 | Ibm Corporation | Method and apparatus for immersion cooling or an electronic board |
US5427174A (en) * | 1993-04-30 | 1995-06-27 | Heat Transfer Devices, Inc. | Method and apparatus for a self contained heat exchanger |
US5408128A (en) * | 1993-09-15 | 1995-04-18 | International Rectifier Corporation | High power semiconductor device module with low thermal resistance and simplified manufacturing |
JPH07227631A (ja) * | 1993-12-21 | 1995-08-29 | Zexel Corp | 積層型熱交換器の熱交換用導管及びその製造方法 |
US5522455A (en) * | 1994-05-05 | 1996-06-04 | Northrop Grumman Corporation | Heat pipe manifold with screen-lined insert |
US5509496A (en) * | 1994-06-07 | 1996-04-23 | Murray, Inc. | Lawn and garden tractor hydrostatic foot control system |
US5465782A (en) | 1994-06-13 | 1995-11-14 | Industrial Technology Research Institute | High-efficiency isothermal heat pipe |
US5390077A (en) * | 1994-07-14 | 1995-02-14 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal baffle |
US5784256A (en) * | 1994-09-14 | 1998-07-21 | Kabushiki Kaisha Toshiba | Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board |
US5549394A (en) * | 1994-11-10 | 1996-08-27 | Hycomp, Inc. | Bearing arrangement having a polyimide graphite-fiber reinforced composite embedded therein |
US5513070A (en) * | 1994-12-16 | 1996-04-30 | Intel Corporation | Dissipation of heat through keyboard using a heat pipe |
TW307837B (de) | 1995-05-30 | 1997-06-11 | Fujikura Kk | |
JP3164518B2 (ja) * | 1995-12-21 | 2001-05-08 | 古河電気工業株式会社 | 平面型ヒートパイプ |
US5769154A (en) * | 1996-01-29 | 1998-06-23 | Sandia Corporation | Heat pipe with embedded wick structure |
US6056044A (en) * | 1996-01-29 | 2000-05-02 | Sandia Corporation | Heat pipe with improved wick structures |
US5754401A (en) * | 1996-02-16 | 1998-05-19 | Sun Microsystems, Inc. | Pressure compliantly protected heatsink for an electronic device |
US5642776A (en) * | 1996-02-27 | 1997-07-01 | Thermacore, Inc. | Electrically insulated envelope heat pipe |
JP2806357B2 (ja) * | 1996-04-18 | 1998-09-30 | 日本電気株式会社 | スタックモジュール |
US5757621A (en) * | 1996-06-06 | 1998-05-26 | Lucent Technologies Inc. | Heat sink assembly employing spring-loaded standoffs |
US6041211A (en) * | 1996-06-06 | 2000-03-21 | W. L. Gore & Associates, Inc. | Cleaning assembly for critical image surfaces in printer devices and method of using same |
US6167948B1 (en) * | 1996-11-18 | 2001-01-02 | Novel Concepts, Inc. | Thin, planar heat spreader |
US6269866B1 (en) * | 1997-02-13 | 2001-08-07 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
DE19805930A1 (de) * | 1997-02-13 | 1998-08-20 | Furukawa Electric Co Ltd | Kühlvorrichtung |
US5826645A (en) * | 1997-04-23 | 1998-10-27 | Thermal Corp. | Integrated circuit heat sink with rotatable heat pipe |
US5880524A (en) * | 1997-05-05 | 1999-03-09 | Intel Corporation | Heat pipe lid for electronic packages |
US5847925A (en) | 1997-08-12 | 1998-12-08 | Compaq Computer Corporation | System and method for transferring heat between movable portions of a computer |
US5950710A (en) * | 1997-11-21 | 1999-09-14 | Continocean Tech Inc. | Overheat regulating system for vehicle passenger compartment |
US6055157A (en) * | 1998-04-06 | 2000-04-25 | Cray Research, Inc. | Large area, multi-device heat pipe for stacked MCM-based systems |
US6263959B1 (en) * | 1998-04-13 | 2001-07-24 | Furukawa Electric Co. Ltd. | Plate type heat pipe and cooling structure using it |
US6148906A (en) | 1998-04-15 | 2000-11-21 | Scientech Corporation | Flat plate heat pipe cooling system for electronic equipment enclosure |
US6230407B1 (en) * | 1998-07-02 | 2001-05-15 | Showa Aluminum Corporation | Method of checking whether noncondensable gases remain in heat pipe and process for producing heat pipe |
US6239350B1 (en) * | 1998-09-28 | 2001-05-29 | Advanced Modular Power Systems | Internal self heat piping AMTEC cell |
JP2000124374A (ja) * | 1998-10-21 | 2000-04-28 | Furukawa Electric Co Ltd:The | 板型ヒートパイプとそれを用いた冷却構造 |
US6154364A (en) | 1998-11-19 | 2000-11-28 | Delco Electronics Corp. | Circuit board assembly with IC device mounted thereto |
US6085831A (en) * | 1999-03-03 | 2000-07-11 | International Business Machines Corporation | Direct chip-cooling through liquid vaporization heat exchange |
US6169852B1 (en) * | 1999-04-20 | 2001-01-02 | The Hong Kong University Of Science & Technology | Rapid vapor generator |
US6302192B1 (en) * | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US6896039B2 (en) * | 1999-05-12 | 2005-05-24 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US6356448B1 (en) * | 1999-11-02 | 2002-03-12 | Inceptechnologies, Inc. | Inter-circuit encapsulated packaging for power delivery |
US6293333B1 (en) * | 1999-09-02 | 2001-09-25 | The United States Of America As Represented By The Secretary Of The Air Force | Micro channel heat pipe having wire cloth wick and method of fabrication |
US6212074B1 (en) * | 2000-01-31 | 2001-04-03 | Sun Microsystems, Inc. | Apparatus for dissipating heat from a circuit board having a multilevel surface |
US6418017B1 (en) * | 2000-03-30 | 2002-07-09 | Hewlett-Packard Company | Heat dissipating chassis member |
US6382309B1 (en) * | 2000-05-16 | 2002-05-07 | Swales Aerospace | Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction |
US6317322B1 (en) * | 2000-08-15 | 2001-11-13 | The Furukawa Electric Co., Ltd. | Plate type heat pipe and a cooling system using same |
US6535386B2 (en) * | 2000-12-05 | 2003-03-18 | Intel Corporation | Electronic assembly having a heat pipe that conducts heat from a semiconductor die |
US6388882B1 (en) * | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
TW551612U (en) * | 2002-07-26 | 2003-09-01 | Tai Sol Electronics Co Ltd | Piercing type IC heat dissipating device |
US6994152B2 (en) * | 2003-06-26 | 2006-02-07 | Thermal Corp. | Brazed wick for a heat transfer device |
-
2004
- 2004-05-07 US US10/841,784 patent/US6896039B2/en not_active Expired - Lifetime
-
2005
- 2005-02-28 CN CNA2005800169432A patent/CN1957221A/zh active Pending
- 2005-02-28 DE DE112005001051T patent/DE112005001051T5/de not_active Withdrawn
- 2005-02-28 WO PCT/US2005/006370 patent/WO2005114084A1/en active Application Filing
- 2005-03-01 US US11/069,260 patent/US7028760B2/en not_active Expired - Lifetime
- 2005-05-13 US US11/128,453 patent/US20050217826A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN1957221A (zh) | 2007-05-02 |
US20040244951A1 (en) | 2004-12-09 |
US20050217826A1 (en) | 2005-10-06 |
US7028760B2 (en) | 2006-04-18 |
US20050145374A1 (en) | 2005-07-07 |
WO2005114084A1 (en) | 2005-12-01 |
US6896039B2 (en) | 2005-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE112005001051T5 (de) | Wärmerohr-Wärmeverteiler mit durchragenden Befestigungsöffnungen für eine integrierte Schaltung | |
DE602005017139D1 (de) | Elektrodenanordnung mit Elektrodenkühlkörper für ein elektrochirurgisches Gerät | |
DE602004023200D1 (de) | Halbleiterbauelement mit supergitter | |
DE602005025951D1 (de) | Integrierter Halbleiterschaltkreis | |
NO20065010L (no) | Elektronisk termometer med elastisk kretslokalisering | |
FI20040592A (fi) | Lämmön johtaminen upotetusta komponentista | |
DE502006000019D1 (de) | Integrieter Schaltkreis | |
DE602006019129D1 (de) | Motorkühlmittelzirkulationsvorrichtung | |
DE60326587D1 (de) | Halbleitergehäuse mit Wärmeverteiler | |
IL180063A0 (en) | Local cooling hole pattern | |
DE602005005430D1 (de) | Integrierte Halbleiterschaltungsanordnung | |
ATE498181T1 (de) | Monoblock kühleinrichtungskomponente | |
SE0501654L (sv) | Kylanordning | |
DE502005009645D1 (de) | Chip mit versorgungseinrichtung | |
DE502006009008D1 (de) | Kühlmittelkreislauf | |
DE602005015465D1 (de) | Mit integriertem wärmeverteiler ausgestattete elektronische einrichtung | |
DE602006011224D1 (de) | Elektronisches Gerät | |
DE502006004416D1 (de) | Kühlkreislauf mit einer hydrodynamischen Bremse | |
DE602005017857D1 (de) | Bauteil mit Kühlanordnung | |
ES1061730Y (es) | Radiador seca-toallas | |
DE602006019177D1 (de) | Ausklappbarer Kühlkörper | |
DE602004027762D1 (de) | Kondensator für kühlvorrichtung | |
DE602005003544D1 (de) | Luftgekühltes thermisches Aktivierungsgerät | |
DE602006016949D1 (de) | Halbleiterbauelement | |
DK1773726T3 (da) | Halsringkøling |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8139 | Disposal/non-payment of the annual fee |