DE112005001051T5 - Wärmerohr-Wärmeverteiler mit durchragenden Befestigungsöffnungen für eine integrierte Schaltung - Google Patents

Wärmerohr-Wärmeverteiler mit durchragenden Befestigungsöffnungen für eine integrierte Schaltung Download PDF

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Publication number
DE112005001051T5
DE112005001051T5 DE112005001051T DE112005001051T DE112005001051T5 DE 112005001051 T5 DE112005001051 T5 DE 112005001051T5 DE 112005001051 T DE112005001051 T DE 112005001051T DE 112005001051 T DE112005001051 T DE 112005001051T DE 112005001051 T5 DE112005001051 T5 DE 112005001051T5
Authority
DE
Germany
Prior art keywords
integrated circuit
mounting holes
protruding mounting
heat pipe
heat spreader
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112005001051T
Other languages
English (en)
Inventor
Peter M Dussinger
Thomas L Myers
John H Rosenfeld
Kenneth G Minnerly
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermal Corp
Original Assignee
Thermal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermal Corp filed Critical Thermal Corp
Publication of DE112005001051T5 publication Critical patent/DE112005001051T5/de
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • B22F3/11Making porous workpieces or articles
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/04Fastening; Joining by brazing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE112005001051T 2004-05-07 2005-02-28 Wärmerohr-Wärmeverteiler mit durchragenden Befestigungsöffnungen für eine integrierte Schaltung Withdrawn DE112005001051T5 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/841,784 US6896039B2 (en) 1999-05-12 2004-05-07 Integrated circuit heat pipe heat spreader with through mounting holes
PCT/US2005/006370 WO2005114084A1 (en) 2004-05-07 2005-02-28 Integrated circuit heat pipe heat spreader with through mounting holes

Publications (1)

Publication Number Publication Date
DE112005001051T5 true DE112005001051T5 (de) 2007-05-16

Family

ID=35428471

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112005001051T Withdrawn DE112005001051T5 (de) 2004-05-07 2005-02-28 Wärmerohr-Wärmeverteiler mit durchragenden Befestigungsöffnungen für eine integrierte Schaltung

Country Status (4)

Country Link
US (3) US6896039B2 (de)
CN (1) CN1957221A (de)
DE (1) DE112005001051T5 (de)
WO (1) WO2005114084A1 (de)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US20020084061A1 (en) * 2001-01-03 2002-07-04 Rosenfeld John H. Chemically compatible, lightweight heat pipe
US7575043B2 (en) * 2002-04-29 2009-08-18 Kauppila Richard W Cooling arrangement for conveyors and other applications
US7615005B2 (en) * 2003-05-16 2009-11-10 Ethicon Endo-Surgery, Inc. Medical apparatus for use with an endoscope
US6987317B2 (en) 2003-09-30 2006-01-17 Intel Corporation Power delivery using an integrated heat spreader
CA2574200A1 (en) * 2004-07-21 2006-01-26 Xiao Huang Hybrid wicking materials for use in high performance heat pipes
TW200637017A (en) * 2005-04-14 2006-10-16 Chipmos Technologies Inc Image sensor module package
JP4617209B2 (ja) * 2005-07-07 2011-01-19 株式会社豊田自動織機 放熱装置
TWI317414B (en) * 2005-10-21 2009-11-21 Foxconn Tech Co Ltd Sintered heat pipe and method for manufacturing the same
US7360581B2 (en) * 2005-11-07 2008-04-22 3M Innovative Properties Company Structured thermal transfer article
US7695808B2 (en) * 2005-11-07 2010-04-13 3M Innovative Properties Company Thermal transfer coating
FR2896443B1 (fr) * 2006-01-25 2008-02-29 Alcatel Sa Procede de fabrication de panneaux a caloducs et/ou inserts integres maintenus par des languettes
US7518868B2 (en) 2006-02-28 2009-04-14 International Business Machines Corporation Apparatus, system, and method for efficient heat dissipation
US20080035313A1 (en) * 2006-08-09 2008-02-14 Hul-Chun Hsu Heat-Conducting Base and Isothermal Plate having the same
KR20080053556A (ko) * 2006-12-11 2008-06-16 현대자동차주식회사 하이브리드 전기자동차의 인버터 및 ldc용 냉각장치
CN200994225Y (zh) * 2006-12-29 2007-12-19 帛汉股份有限公司 电路基板结构
KR100809587B1 (ko) 2007-02-02 2008-03-04 이용덕 판형 열전달장치
TWM318115U (en) * 2007-04-09 2007-09-01 Tai Sol Electronics Co Ltd Flat heat pipe
US7957134B2 (en) * 2007-04-10 2011-06-07 Hewlett-Packard Development Company, L.P. System and method having evaporative cooling for memory
DE202007007568U1 (de) * 2007-05-25 2007-09-20 Boston Cool Tec Corporation, Wilmington Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden
US20090260785A1 (en) * 2008-04-17 2009-10-22 Wang Cheng-Tu Heat plate with capillary supporting structure and manufacturing method thereof
US20090314472A1 (en) * 2008-06-18 2009-12-24 Chul Ju Kim Evaporator For Loop Heat Pipe System
DE102008054233A1 (de) * 2008-10-31 2010-05-06 Osram Opto Semiconductors Gmbh Leuchtmodul
CN101782342B (zh) * 2009-01-16 2013-03-20 富瑞精密组件(昆山)有限公司 热管及其毛细结构的制作方法
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
JP5407749B2 (ja) * 2009-10-26 2014-02-05 日本電気株式会社 インサーキットテストフィクスチャの冷却構造
US20120000530A1 (en) * 2010-07-02 2012-01-05 Miles Mark W Device for harnessing solar energy with integrated heat transfer core, regenerator, and condenser
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US8921702B1 (en) * 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
EP2395309A1 (de) * 2010-06-08 2011-12-14 Thermal Corp. Wärmerohr
KR20120085397A (ko) * 2011-01-24 2012-08-01 삼성전자주식회사 백라이트 어셈블리
TWI484890B (zh) * 2011-08-17 2015-05-11 Asia Vital Components Co Ltd 散熱單元之固定結構
TWI479302B (zh) * 2011-08-17 2015-04-01 Asia Vital Components Co Ltd 散熱裝置之固定結構
TWI524046B (zh) * 2011-08-17 2016-03-01 奇鋐科技股份有限公司 散熱元件之固定結構
CN102958318B (zh) * 2011-08-17 2015-06-24 奇鋐科技股份有限公司 散热元件的固定结构
CN102297395A (zh) * 2011-09-07 2011-12-28 福建蓝蓝高科技发展有限公司 Led灯具高散热装置
US20130098592A1 (en) 2011-10-25 2013-04-25 Asia Vital Components Co., Ltd. Heat dissipation device and manufacturing method thereof
DE102011119174A1 (de) 2011-11-23 2013-05-23 Inheco Industrial Heating And Cooling Gmbh Vapor Chamber
US20130168052A1 (en) * 2011-12-30 2013-07-04 Celsia Technologies Taiwan, Inc. Heat pipe and composition of capillary wick thereof
US20130168057A1 (en) * 2011-12-30 2013-07-04 Teledyne Scientific & Imaging, Llc Modular heat shield and heat spreader
US9417015B2 (en) 2012-02-22 2016-08-16 Thermal Corp. Heat exchanger backing plate and method of assembling same
US9599408B1 (en) * 2012-03-03 2017-03-21 Advanced Cooling Technologies, Inc. Loop heat pipe evaporator including a second heat pipe
JP6191137B2 (ja) * 2012-05-14 2017-09-06 富士通株式会社 冷却装置
CN102818467B (zh) * 2012-09-12 2014-06-18 锘威科技(深圳)有限公司 平板热管及其制作方法
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
US20150173243A1 (en) * 2013-12-13 2015-06-18 General Electric Company Integrated heat exchange assembly and an associated method thereof
US9498858B2 (en) 2014-08-08 2016-11-22 SEAKR Engineering, Inc. System and method for dissipating thermal energy
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
WO2016114840A2 (en) * 2014-10-28 2016-07-21 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
US20170010048A1 (en) * 2015-07-09 2017-01-12 Chaun-Choung Technology Corp. Thin vapor chamber and manufacturing method thereof
CN105658032B (zh) * 2016-01-22 2019-06-04 白鹏飞 一种超薄均热板及其制作方法
CN106052435A (zh) * 2016-06-02 2016-10-26 吴本刚 蜗杆式饲料供给装置
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
WO2018198375A1 (ja) * 2017-04-28 2018-11-01 株式会社村田製作所 ベーパーチャンバー
US10211125B2 (en) 2017-07-19 2019-02-19 Heatscape.Com, Inc. Configurable mounting hole structure for flush mount integration with vapor chamber forming plates
WO2019018943A1 (en) * 2017-07-28 2019-01-31 Dana Canada Corporation ULTRA-THIN HEAT EXCHANGERS FOR HEAT MANAGEMENT
CN107660102A (zh) * 2017-09-14 2018-02-02 南京理工大学 槽道‑纳米花复合毛细芯结构及其制备方法
US10458718B2 (en) * 2017-11-29 2019-10-29 Asia Vital Components Co., Ltd. Airtight penetration structure for heat dissipation device
TWI707118B (zh) * 2018-01-23 2020-10-11 訊凱國際股份有限公司 均溫板
US20200024763A1 (en) * 2018-07-23 2020-01-23 Microsoft Technology Licensing, Llc Electroform vapor chamber integrated thermal module into pcb layout design
US11076510B2 (en) * 2018-08-13 2021-07-27 Facebook Technologies, Llc Heat management device and method of manufacture
JP7146524B2 (ja) * 2018-08-13 2022-10-04 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
CN109152298B (zh) * 2018-09-30 2020-05-08 航天特种材料及工艺技术研究所 一种轻质温控装置及其制造方法
CN110336902B (zh) * 2019-06-28 2021-03-12 Oppo广东移动通信有限公司 电子设备的后壳、其制备方法、壳体组件以及电子设备
US11680753B2 (en) * 2019-11-14 2023-06-20 Rolls-Royce Corporation Fused filament fabrication of heat pipe
US11745264B2 (en) 2019-11-14 2023-09-05 Rolls-Royce Corporation Fused filament fabrication of thermal management article
US11707788B2 (en) 2019-11-14 2023-07-25 Rolls-Royce Corporation Fused filament fabrication of vacuum insulator
US20210364238A1 (en) * 2020-05-21 2021-11-25 Acer Incorporated Vapor chamber structure
WO2021258028A1 (en) 2020-06-19 2021-12-23 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
CN114543569A (zh) * 2020-11-24 2022-05-27 亚浩电子五金塑胶(惠州)有限公司 立体传热装置
CN115548523B (zh) * 2022-09-30 2024-01-23 厦门海辰储能科技股份有限公司 电芯、电池模组、电池包及储能设备

Family Cites Families (136)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3209062A (en) * 1963-01-25 1965-09-28 Westinghouse Electric Corp Mounting and coolant system for semiconductor heat generating devices
DE1284506B (de) 1964-10-24 1968-12-05 Linde Ag Traegerblech fuer temperaturempfindliche elektrische Schaltungsteile
US3490718A (en) * 1967-02-01 1970-01-20 Nasa Capillary radiator
US3543841A (en) 1967-10-19 1970-12-01 Rca Corp Heat exchanger for high voltage electronic devices
US3519067A (en) * 1967-12-28 1970-07-07 Honeywell Inc Variable thermal conductance devices
US3519063A (en) * 1968-07-18 1970-07-07 United Aircraft Corp Shell mold construction with chill plate having uniform roughness
US3613778A (en) * 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3537514A (en) 1969-03-12 1970-11-03 Teledyne Inc Heat pipe for low thermal conductivity working fluids
BE757262A (fr) * 1969-10-10 1971-04-08 Union Carbide Corp Couche metallique poreuse et procede pour la former
US3681843A (en) * 1970-03-06 1972-08-08 Westinghouse Electric Corp Heat pipe wick fabrication
US3675711A (en) * 1970-04-08 1972-07-11 Singer Co Thermal shield
US3680189A (en) * 1970-12-09 1972-08-01 Noren Products Inc Method of forming a heat pipe
US3834457A (en) * 1971-01-18 1974-09-10 Bendix Corp Laminated heat pipe and method of manufacture
US3788388A (en) * 1971-02-19 1974-01-29 Q Dot Corp Heat exchange system
DE2120475A1 (de) * 1971-04-27 1972-11-02 Brown, Boveri & Cie Ag, 6800 Mannheim Wärmerohr
DE2120477C3 (de) * 1971-04-27 1980-07-31 Brown, Boveri & Cie Ag, 6800 Mannheim Elektrisch isolierende Wärmerohranordnung für hohe Wärmestromdichte
US3934643A (en) * 1971-07-26 1976-01-27 Nikolaus Laing Controllable heat pipe
US3762011A (en) * 1971-12-16 1973-10-02 Trw Inc Method of fabricating a capillary heat pipe wick
SU407160A1 (ru) 1972-02-07 1973-11-21 Плоская тепловая труба
DE2235792A1 (de) 1972-07-21 1974-01-31 Dornier System Gmbh Vorrichtung zur uebertragung von waermeenergie
DE2502138C3 (de) * 1975-01-21 1978-10-12 Rowenta-Werke Gmbh, 6050 Offenbach Gasfeuerzeugbrenner
GB1484831A (en) * 1975-03-17 1977-09-08 Hughes Aircraft Co Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components
US4046190A (en) * 1975-05-22 1977-09-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Flat-plate heat pipe
US4047198A (en) * 1976-04-19 1977-09-06 Hughes Aircraft Company Transistor cooling by heat pipes having a wick of dielectric powder
SU589531A1 (ru) 1976-05-20 1978-01-25 Предприятие П/Я А-1665 Теплообменное устройство
US4101691A (en) * 1976-09-09 1978-07-18 Union Carbide Corporation Enhanced heat transfer device manufacture
FR2371633A1 (fr) 1976-11-19 1978-06-16 Dupont S T Appareil a gaz liquefie, notamment briquet a gaz pour fumeurs
US4145708A (en) * 1977-06-13 1979-03-20 General Electric Company Power module with isolated substrates cooled by integral heat-energy-removal means
US4231423A (en) 1977-12-09 1980-11-04 Grumman Aerospace Corporation Heat pipe panel and method of fabrication
JPS54154277A (en) 1978-05-25 1979-12-05 Sharp Corp Heat radiation device
US4274479A (en) * 1978-09-21 1981-06-23 Thermacore, Inc. Sintered grooved wicks
DE2854298C3 (de) 1978-12-15 1981-06-04 Anschuetz & Co Gmbh, 2300 Kiel Schmierstoffkreislauf für das Lager einer umlaufenden Welle
US4327752A (en) * 1979-12-05 1982-05-04 Braun, Aktiengesellschaft Rotary ignition system for a catalytically heated curling device
US4279479A (en) * 1980-05-29 1981-07-21 Melvin Schrier Vision screening kit
DE3072058D1 (en) * 1980-09-30 1988-01-21 Braun Ag Hair curling apparatus
US4366526A (en) 1980-10-03 1982-12-28 Grumman Aerospace Corporation Heat-pipe cooled electronic circuit card
US4382448A (en) * 1981-07-10 1983-05-10 Braun Aktiengesellschaft Electrical ignition system for a catalytically heated curling device
US4641404A (en) * 1981-10-05 1987-02-10 Seydel Scott O Porous warp sizing apparatus
SU987357A2 (ru) 1981-12-16 1983-01-07 Предприятие П/Я Г-4371 Плоска теплова труба
US4489777A (en) 1982-01-21 1984-12-25 Del Bagno Anthony C Heat pipe having multiple integral wick structures
US4461343A (en) * 1982-01-28 1984-07-24 Mcdonnell Douglas Corporation Plated heat pipe
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
JPS5924538A (ja) * 1982-07-30 1984-02-08 Japan Radio Co Ltd ヒ−トパイプおよびその製造方法
US5148440A (en) * 1983-11-25 1992-09-15 The United States Of America As Represented By The United States Department Of Energy Wick for metal vapor laser
US4616699A (en) * 1984-01-05 1986-10-14 Mcdonnell Douglas Corporation Wick-fin heat pipe
SU1261029A1 (ru) 1984-04-02 1986-09-30 Ордена Трудового Красного Знамени Институт Тепло- И Массообмена Им.А.В.Лыкова Устройство дл охлаждени силовых полупроводниковых приборов
US4557413A (en) 1984-04-11 1985-12-10 Mcdonnell Douglas Heat pipe fabrication
FR2579371B1 (fr) 1985-03-19 1987-09-11 Contardo Spa Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase
US4777561A (en) * 1985-03-26 1988-10-11 Hughes Aircraft Company Electronic module with self-activated heat pipe
US4865729A (en) * 1985-11-04 1989-09-12 Sepragen Corporation Radial thin layer chromatography
FR2595052B1 (fr) * 1986-03-03 1990-06-01 Armines Procede et dispositif de vaporisation rapide d'un liquide
US4697205A (en) * 1986-03-13 1987-09-29 Thermacore, Inc. Heat pipe
US4765396A (en) * 1986-12-16 1988-08-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polymeric heat pipe wick
US4960202A (en) * 1987-01-14 1990-10-02 Ingersoll-Rand Company Friction control for bearing surface of roller
US4819719A (en) * 1987-01-20 1989-04-11 Mcdonnell Douglas Corporation Enhanced evaporator surface
US4912548A (en) * 1987-01-28 1990-03-27 National Semiconductor Corporation Use of a heat pipe integrated with the IC package for improving thermal performance
DE3862511D1 (de) * 1987-04-28 1991-05-29 Sig Schweiz Industrieges Siegelbacke fuer verpackungsmaschinen.
JPH063354B2 (ja) * 1987-06-23 1994-01-12 アクトロニクス株式会社 ル−プ型細管ヒ−トパイプ
US4830097A (en) * 1987-07-15 1989-05-16 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Space vehicle thermal rejection system
SU1476297A2 (ru) 1987-09-28 1989-04-30 Институт Физико-Технических Проблем Энергетики Ан Литсср Теплова труба
US4807697A (en) * 1988-02-18 1989-02-28 Thermacore, Inc. External artery heat pipe
USH971H (en) * 1988-10-24 1991-10-01 The United States Of America As Represented By The Secretary Of The Air Force Regidized porous material and method
US4885129A (en) 1988-10-24 1989-12-05 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks
US4929414A (en) * 1988-10-24 1990-05-29 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks and arteries
US5101560A (en) * 1988-10-24 1992-04-07 The United States Of America As Represented By The Secretary Of The Air Force Method for making an anisotropic heat pipe and wick
US4931905A (en) * 1989-01-17 1990-06-05 Grumman Aerospace Corporation Heat pipe cooled electronic circuit card
US4883116A (en) 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
US4880052A (en) 1989-02-27 1989-11-14 Thermacore, Inc. Heat pipe cooling plate
US5059496A (en) 1989-03-23 1991-10-22 Globe-Union Inc. Nickel-hydrogen battery with oxygen and electrolyte management features
DE69016119T2 (de) * 1989-07-19 1995-08-31 Showa Aluminum Corp Wärmerohr.
US5052472A (en) * 1989-07-19 1991-10-01 Hitachi, Ltd. LSI temperature control system
BR9106048A (pt) * 1990-02-20 1993-07-06 Procter & Gamble Estrutura e folha polimericas de canais capilares,tecido,processo e matriz de extrusao
US5242644A (en) * 1990-02-20 1993-09-07 The Procter & Gamble Company Process for making capillary channel structures and extrusion die for use therein
US5160252A (en) 1990-06-07 1992-11-03 Edwards Thomas C Rotary vane machines with anti-friction positive bi-axial vane motion controls
US5711816A (en) * 1990-07-06 1998-01-27 Advanced Technolgy Materials, Inc. Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same
US5000256A (en) * 1990-07-20 1991-03-19 Minnesota Mining And Manufacturing Company Heat transfer bag with thermal via
US5219020A (en) * 1990-11-22 1993-06-15 Actronics Kabushiki Kaisha Structure of micro-heat pipe
US5076352A (en) 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
US5333470A (en) * 1991-05-09 1994-08-02 Heat Pipe Technology, Inc. Booster heat pipe for air-conditioning systems
US5103897A (en) * 1991-06-05 1992-04-14 Martin Marietta Corporation Flowrate controller for hybrid capillary/mechanical two-phase thermal loops
EP0529837B1 (de) 1991-08-26 1996-05-29 Sun Microsystems, Inc. Verfahren und Apparat zum Kühlen von Mehrchip-Moduln durch die vollständige Wärmerohr-Technologie
JPH0563385A (ja) * 1991-08-30 1993-03-12 Hitachi Ltd ヒートパイプ付き電子機器及び計算機
US5386143A (en) * 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
US5253702A (en) * 1992-01-14 1993-10-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger, and clamping plate
JPH0629683A (ja) * 1992-03-31 1994-02-04 Furukawa Electric Co Ltd:The 電子機器用ヒートパイプ式放熱ユニット
US5283715A (en) * 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
US5305185A (en) * 1992-09-30 1994-04-19 Samarov Victor M Coplanar heatsink and electronics assembly
US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
US5305184A (en) * 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
US5427174A (en) * 1993-04-30 1995-06-27 Heat Transfer Devices, Inc. Method and apparatus for a self contained heat exchanger
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
JPH07227631A (ja) * 1993-12-21 1995-08-29 Zexel Corp 積層型熱交換器の熱交換用導管及びその製造方法
US5522455A (en) * 1994-05-05 1996-06-04 Northrop Grumman Corporation Heat pipe manifold with screen-lined insert
US5509496A (en) * 1994-06-07 1996-04-23 Murray, Inc. Lawn and garden tractor hydrostatic foot control system
US5465782A (en) 1994-06-13 1995-11-14 Industrial Technology Research Institute High-efficiency isothermal heat pipe
US5390077A (en) * 1994-07-14 1995-02-14 At&T Global Information Solutions Company Integrated circuit cooling device having internal baffle
US5784256A (en) * 1994-09-14 1998-07-21 Kabushiki Kaisha Toshiba Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
US5549394A (en) * 1994-11-10 1996-08-27 Hycomp, Inc. Bearing arrangement having a polyimide graphite-fiber reinforced composite embedded therein
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
TW307837B (de) 1995-05-30 1997-06-11 Fujikura Kk
JP3164518B2 (ja) * 1995-12-21 2001-05-08 古河電気工業株式会社 平面型ヒートパイプ
US5769154A (en) * 1996-01-29 1998-06-23 Sandia Corporation Heat pipe with embedded wick structure
US6056044A (en) * 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
US5754401A (en) * 1996-02-16 1998-05-19 Sun Microsystems, Inc. Pressure compliantly protected heatsink for an electronic device
US5642776A (en) * 1996-02-27 1997-07-01 Thermacore, Inc. Electrically insulated envelope heat pipe
JP2806357B2 (ja) * 1996-04-18 1998-09-30 日本電気株式会社 スタックモジュール
US5757621A (en) * 1996-06-06 1998-05-26 Lucent Technologies Inc. Heat sink assembly employing spring-loaded standoffs
US6041211A (en) * 1996-06-06 2000-03-21 W. L. Gore & Associates, Inc. Cleaning assembly for critical image surfaces in printer devices and method of using same
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
DE19805930A1 (de) * 1997-02-13 1998-08-20 Furukawa Electric Co Ltd Kühlvorrichtung
US5826645A (en) * 1997-04-23 1998-10-27 Thermal Corp. Integrated circuit heat sink with rotatable heat pipe
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
US5847925A (en) 1997-08-12 1998-12-08 Compaq Computer Corporation System and method for transferring heat between movable portions of a computer
US5950710A (en) * 1997-11-21 1999-09-14 Continocean Tech Inc. Overheat regulating system for vehicle passenger compartment
US6055157A (en) * 1998-04-06 2000-04-25 Cray Research, Inc. Large area, multi-device heat pipe for stacked MCM-based systems
US6263959B1 (en) * 1998-04-13 2001-07-24 Furukawa Electric Co. Ltd. Plate type heat pipe and cooling structure using it
US6148906A (en) 1998-04-15 2000-11-21 Scientech Corporation Flat plate heat pipe cooling system for electronic equipment enclosure
US6230407B1 (en) * 1998-07-02 2001-05-15 Showa Aluminum Corporation Method of checking whether noncondensable gases remain in heat pipe and process for producing heat pipe
US6239350B1 (en) * 1998-09-28 2001-05-29 Advanced Modular Power Systems Internal self heat piping AMTEC cell
JP2000124374A (ja) * 1998-10-21 2000-04-28 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた冷却構造
US6154364A (en) 1998-11-19 2000-11-28 Delco Electronics Corp. Circuit board assembly with IC device mounted thereto
US6085831A (en) * 1999-03-03 2000-07-11 International Business Machines Corporation Direct chip-cooling through liquid vaporization heat exchange
US6169852B1 (en) * 1999-04-20 2001-01-02 The Hong Kong University Of Science & Technology Rapid vapor generator
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6356448B1 (en) * 1999-11-02 2002-03-12 Inceptechnologies, Inc. Inter-circuit encapsulated packaging for power delivery
US6293333B1 (en) * 1999-09-02 2001-09-25 The United States Of America As Represented By The Secretary Of The Air Force Micro channel heat pipe having wire cloth wick and method of fabrication
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6382309B1 (en) * 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
US6317322B1 (en) * 2000-08-15 2001-11-13 The Furukawa Electric Co., Ltd. Plate type heat pipe and a cooling system using same
US6535386B2 (en) * 2000-12-05 2003-03-18 Intel Corporation Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US6388882B1 (en) * 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
TW551612U (en) * 2002-07-26 2003-09-01 Tai Sol Electronics Co Ltd Piercing type IC heat dissipating device
US6994152B2 (en) * 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device

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CN1957221A (zh) 2007-05-02
US20040244951A1 (en) 2004-12-09
US20050217826A1 (en) 2005-10-06
US7028760B2 (en) 2006-04-18
US20050145374A1 (en) 2005-07-07
WO2005114084A1 (en) 2005-12-01
US6896039B2 (en) 2005-05-24

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