DE1198532T1 - Dielektrisches material enthaltend einen teilchenförmigen füllstoff - Google Patents

Dielektrisches material enthaltend einen teilchenförmigen füllstoff

Info

Publication number
DE1198532T1
DE1198532T1 DE1198532T DE00928757T DE1198532T1 DE 1198532 T1 DE1198532 T1 DE 1198532T1 DE 1198532 T DE1198532 T DE 1198532T DE 00928757 T DE00928757 T DE 00928757T DE 1198532 T1 DE1198532 T1 DE 1198532T1
Authority
DE
Germany
Prior art keywords
dielectric material
material containing
particulate filler
particulate
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE1198532T
Other languages
English (en)
Inventor
William F Hartman
Kirk M Slenes
Kristen J Law
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TPL Inc
Original Assignee
TPL Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/305,253 external-priority patent/US6616794B2/en
Application filed by TPL Inc filed Critical TPL Inc
Publication of DE1198532T1 publication Critical patent/DE1198532T1/de
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/18—Titanium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/16—Capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
DE1198532T 1999-05-04 2000-05-03 Dielektrisches material enthaltend einen teilchenförmigen füllstoff Pending DE1198532T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/305,253 US6616794B2 (en) 1998-05-04 1999-05-04 Integral capacitance for printed circuit board using dielectric nanopowders
US09/458,363 US6608760B2 (en) 1998-05-04 1999-12-09 Dielectric material including particulate filler
PCT/US2000/012002 WO2000066674A1 (en) 1999-05-04 2000-05-03 Dielectric material including particulate filler

Publications (1)

Publication Number Publication Date
DE1198532T1 true DE1198532T1 (de) 2003-08-14

Family

ID=26974508

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1198532T Pending DE1198532T1 (de) 1999-05-04 2000-05-03 Dielektrisches material enthaltend einen teilchenförmigen füllstoff

Country Status (8)

Country Link
US (1) US6608760B2 (de)
EP (1) EP1198532A4 (de)
AU (1) AU4694400A (de)
CA (1) CA2373172A1 (de)
DE (1) DE1198532T1 (de)
ES (1) ES2184657T1 (de)
TW (1) TW487932B (de)
WO (1) WO2000066674A1 (de)

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US20040109298A1 (en) * 1998-05-04 2004-06-10 Hartman William F. Dielectric material including particulate filler
US6847527B2 (en) * 2001-08-24 2005-01-25 3M Innovative Properties Company Interconnect module with reduced power distribution impedance
EP1755161A3 (de) * 2001-08-24 2007-05-02 3M Innovative Properties Company Verdrahtungsmodul mit reduzierter Versorgungsverteilungsimpedanz
SG107103A1 (en) * 2002-05-24 2004-11-29 Ntu Ventures Private Ltd Process for producing nanocrystalline composites
US6737364B2 (en) * 2002-10-07 2004-05-18 International Business Machines Corporation Method for fabricating crystalline-dielectric thin films and devices formed using same
JP4700332B2 (ja) 2003-12-05 2011-06-15 イビデン株式会社 多層プリント配線板
US20060074164A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Structured composite dielectrics
US20080128961A1 (en) * 2003-12-19 2008-06-05 Tpl, Inc. Moldable high dielectric constant nano-composites
US20060074166A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Title And Interest In An Application Moldable high dielectric constant nano-composites
EP1578179A3 (de) 2004-03-16 2006-05-03 E.I. du Pont de Nemours and Company Dickfilmdielektrikum und leitfähige Zusammensetzungen
KR100586963B1 (ko) * 2004-05-04 2006-06-08 삼성전기주식회사 유전체 형성용 조성물, 이로 제조된 캐패시터층 및 이를포함하는 인쇄회로기판
US7495887B2 (en) * 2004-12-21 2009-02-24 E.I. Du Pont De Nemours And Company Capacitive devices, organic dielectric laminates, and printed wiring boards incorporating such devices, and methods of making thereof
US20070004844A1 (en) * 2005-06-30 2007-01-04 Clough Robert S Dielectric material
KR100665261B1 (ko) * 2005-10-13 2007-01-09 삼성전기주식회사 온도변화에 따른 정전용량변화가 작은 복합 유전체 조성물및 이를 이용한 시그널 매칭용 임베디드 캐패시터
CN101375644A (zh) * 2005-11-14 2009-02-25 劳伦斯利弗莫尔国家安全有限公司 铸造的电介质复合材料线性加速器
US20090168391A1 (en) * 2007-12-27 2009-07-02 Kouichi Saitou Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same
TWI447155B (zh) * 2007-12-28 2014-08-01 Ind Tech Res Inst 撓曲性、低介電損失組成物及其製造方法
US10176162B2 (en) * 2009-02-27 2019-01-08 Blackberry Limited System and method for improved address entry
EP2425691A4 (de) * 2009-05-01 2013-09-04 3M Innovative Properties Co Passiver elektrischer artikel
WO2012145122A1 (en) 2011-03-23 2012-10-26 The Curators Of The University Of Missouri High dielectric constant composite materials and methods of manufacture
CN102757229A (zh) * 2012-07-03 2012-10-31 深圳光启创新技术有限公司 一种共形陶瓷超材料及其制备方法
GB2590874B (en) 2015-08-19 2021-11-10 Halliburton Energy Services Inc High-power fuse-protected capacitor for downhole electrocrushing drilling
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法

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Also Published As

Publication number Publication date
ES2184657T1 (es) 2003-04-16
CA2373172A1 (en) 2000-11-09
US20010036052A1 (en) 2001-11-01
US6608760B2 (en) 2003-08-19
TW487932B (en) 2002-05-21
AU4694400A (en) 2000-11-17
WO2000066674A1 (en) 2000-11-09
EP1198532A1 (de) 2002-04-24
EP1198532A4 (de) 2003-04-02

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