DE1464515A1 - Semiconductor rectifier block - Google Patents

Semiconductor rectifier block

Info

Publication number
DE1464515A1
DE1464515A1 DE19631464515 DE1464515A DE1464515A1 DE 1464515 A1 DE1464515 A1 DE 1464515A1 DE 19631464515 DE19631464515 DE 19631464515 DE 1464515 A DE1464515 A DE 1464515A DE 1464515 A1 DE1464515 A1 DE 1464515A1
Authority
DE
Germany
Prior art keywords
valves
semiconductor
inserts
coolers
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19631464515
Other languages
German (de)
Other versions
DE1464515B2 (en
Inventor
Jindrich Kratina
Lubomir Safar
Otto Valcik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CKD Praha DIZ AS
Original Assignee
CKD Praha DIZ AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CKD Praha DIZ AS filed Critical CKD Praha DIZ AS
Publication of DE1464515A1 publication Critical patent/DE1464515A1/en
Publication of DE1464515B2 publication Critical patent/DE1464515B2/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/073—Apertured devices mounted on one or more rods passed through the apertures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

Halbleiter-GleichrichterbloekSemiconductor rectifier block

Die Erfindung betrifft die Anordnung von KKhT ern und einzelnen Halbleiterventilen in kompakten Einheiten, die dann den Gleichrichter bzw. einen Teil desselben bilden.The invention relates to the arrangement of KKhT and individual Semiconductor valves in compact units, which then have the rectifier or form part of the same.

Die bekannten Gleichrichter sind aus einzelnen Ventilen mit einseitigen Kühlern zusammengestellt» Sie werden mit Hilfe von Kabeln oder Bändern zu einem Gleichrichter verbunden. Die Herstellung von Gleichrichtern mit solchen Ventilen ist kompliziert und kostspielig.The known rectifiers are made up of individual valves with one-sided Coolers put together »They are connected to a rectifier with the help of cables or straps. The production of rectifiers with such valves is complicated and expensive.

Alle angeführten Nachteile werden erfin&ungsgemäss durch eine Ventilanordnung beseitigt, die dadurch gekennzeichnet ist, dass einzelne monokristallische Halbleiterventile in einer Säule angeordnet sind und die Säule von Kühlern durchdrungen ist, wobei die Ventile und die Kuhler durch Bolzen und kegelförmige abgefederte Zwiseheneinlagen, die sich an End-S timplatt en abstützen, zusaamengeklemmt sind.According to the invention, all the disadvantages listed are eliminated by a Valve arrangement eliminated, which is characterized in that individual monocrystallic semiconductor valves are arranged in a column and the column is penetrated by coolers, the valves and the cooler being cushioned by bolts and cone-shaped Intermediate inserts, which are supported on end timing plates, are clamped together.

Durch eine derartige Ausführung des Gleichrichters bzw. Gleichrichterteiles wird der Aufbau wesentlich vereinfacht und zugleich eine ein- oder doppelseitige Ventilkühlung ermöglicht. Ein weiterer Vorteil ist die leichte Kontage und Austauschbarkeit der Bestandteile, die in minimaler Anzahl vorliegen. SchliesslichBy such a design of the rectifier or rectifier part the structure is significantly simplified and at the same time single or double-sided valve cooling is possible. Another The advantage is the easy contouring and interchangeability of the components, which are available in a minimal number. In the end

8 0 9 810/10338 0 9 810/1033

werden durch diese Anordnung praktisch unbegrenzte elektrische Schaltungsmögliehkeiten gegeben. Die Verbindung der' einzelnen Ventile mittender Kühler ermöglicht den Wärmeübergang von einem Ventil zum anderen und trägt so zu einer Warmestabilisierung bei, was hinsichtlich der optimalen Ausnutzung sehr vorteilhaft ist.This arrangement gives practically unlimited electrical circuit possibilities. The connection of the 'individual Valves centered cooler allows heat transfer from one Valve to the other and thus contributes to heat stabilization, which is very advantageous in terms of optimal utilization.

In der Zeichnung ist ein praktisches Ausführungsbeispiel des Erfindungsgegenstandes dargestellt. Es zeigen:In the drawing is a practical embodiment of the Subject of the invention shown. Show it:

Fig. 1 einen Grundriss eines aus zwei beidseitig gekühlten Ventilen zusammengesetzten Gleichrichterblocks,1 shows a plan view of a rectifier block composed of two valves cooled on both sides,

Pig. 2 "einen Seitenriss im Schnitt undPig. 2 "a side elevation in section and

Pig. 3 einen Aufriss im Schnitt durch den Block der Pig. 1,Pig. 3 is a sectional elevation through the block of the pig. 1,

Fig. 4 das Schaltbild und4 shows the circuit diagram and

Fig. 5 die schematische Anordnung eines aus sechs beidseitig gekühlten Ventilen bestehenden Gleichrichterblockes, der als eine Brehstrombrücke geschaltet ist·5 shows the schematic arrangement of a rectifier block consisting of six valves cooled on both sides, which is connected as a three-phase bridge

Der Gleichrichterteil nach Fig. 1 ist derart aufgebaut, dass die Ventile 1 Je durch einen oder zwei Kühler 2 gekühlt werden und derart zu einem Block zusammengestellt sind, dass der gegenseitige S ehalt anschluss entweder direkt durch die Kühler 2 oder durch Einlagen 6 erfolgt. Sie geeignete Polarität der Ventile 1 und das Einschalten der Einlagen 6 (leitfähige oder Isoliereinlagen) gibt die Möglichkeit, äen Block in jede beliebige Schaltungsart einzureihen. Als Beispiel für diese Anordnung ist in Fig. 4 und 5 der gesamte Gleichrichter in Verbindung mit einer Drehstrombrücke schenatisch dargestellt.The rectifier part according to FIG. 1 is constructed in such a way that the valves 1 are each cooled by one or two coolers 2 and are combined to form a block in such a way that the mutual maintenance connection takes place either directly through the cooler 2 or through inserts 6. The appropriate polarity of the valves 1 and the switching on of the inserts 6 (conductive or insulating inserts) gives the possibility of adding a block to any type of circuit. As an example of this arrangement, the entire rectifier is shown schematically in connection with a three-phase bridge in FIGS.

Der Zusammenhalt des ganzen Blockes, wobei eine vollkommene Berührung der gesamten. Berührungsflächen der Ventile 1 und derThe cohesion of the whole block, with a perfect touch the whole. Contact surfaces of the valves 1 and the

809810/103 3809810/103 3

Kühler 2 gewährleistet ist, wird durch Zusajmaeiöäsffimen mittels zweier Bolzen 3 und kegelförmiger abgefederter Zwischeneinlagen 5 erzielt, die sich an Snd-Stirnplatten 4 abstützen. Diese Ausführung gewährleistet zugleich einen konstanten, spezifischen Druck an den gesamten Berührungsflächen zwischen den Kühlern und des Ventilen 1 sowie den Ausgleich der Längen-Wärmeausdehnung einseiner Teile des Blockes· Das Zentrieren der Ventile 1, der End-Zwischeneinlagen 5 und der Einlagen 6 wird sit Hilfe von Längsnuten 7 in den Kühlern 2 und den beiden Bolzen 3 erreicht.Cooler 2 is guaranteed, is by means of Zusajmaeiöäsffimen two bolts 3 and conical spring-loaded intermediate inserts 5, which are supported on Snd end plates 4. This execution at the same time guarantees a constant, specific Pressure on the entire contact surfaces between the coolers and the valve 1 as well as the compensation of the linear thermal expansion one of its parts of the block · The centering of the valves 1, the End intermediate inserts 5 and the inserts 6 will sit help from Longitudinal grooves 7 in the coolers 2 and the two bolts 3 reached.

Diese Ausführung ermöglicht es ferner, sämtliche bekannteaArten elektrischer Schaltungen auf die einfachste Art durchzuführen (Reihenschaltung, Parallelschaltung und die Schaltung eines feiles bzw. des ganzen Gleichrichters).This design also makes it possible to use all known types electrical circuits to be carried out in the simplest way (series connection, parallel connection and the connection of a feiles or the whole rectifier).

Ein weiterer Vorteil der erfindungsgemässen Anordnung ist der, dass hiermit auch gute Wärmeeigenschaften erzielt werden, da entlang der Blockachse die.Wärme gut verteilt wird, was sich auf die Ausnützung der Ventile günstig auswirkt. Dies ist besonders vorteilhaft im Falle einer Parallelschaltung, von Ventilen« da die Gefahr ihrer Zerstörung infolge ungleichförmiger Verteilung des Stromes und dadurch auch der !Temperaturen wesentlich herabgesetzt wird.Another advantage of the arrangement according to the invention is that that this also achieves good thermal properties, since The heat is well distributed along the block axis, which has a positive effect on the utilization of the valves. This is special advantageous in the case of a parallel connection of valves «since there is a risk of their destruction as a result of non-uniform Distribution of the current and therefore also of the temperatures is essential is reduced.

Andere Vorteile der erfindungsgemässen Ausführung liegen in der einwandfreien Berührung der Kühler- und Ventilflächen· Dadurch wird auch eine gute Abführung der Verlustwärme in das Kühlmedium erreicht. Des weiteren wird ein verlässlicher und störungsfreier Betrieb dadurch erzielt, dass der erfindungsgemässe Block gegen Wärmeänderungen und Vibrationen, die beim Betrieb von Halbleitergleichrichtern auftreten, widerstandsfähig ist.Other advantages of the design according to the invention are the perfect contact between the cooler and valve surfaces good dissipation of the heat loss into the cooling medium is also achieved. It also becomes more reliable and trouble-free Operation achieved in that the block according to the invention is resistant to heat changes and vibrations that occur during the operation of semiconductor rectifiers.

809810/1033809810/1033

Claims (3)

PatentansprücheClaims 1. Halbleiter-@leiehrichterblook, dadurch gekennzeichnet, das« einzelne monokriatallische Halbleiterventile (1) in einer Säule angeordnet sind und die Säule von Kühlern (2) durchdrungen ist, wobei die Ventile (1) und die Kühler (2) durch Bolzen (3) und kegelförmige abgefederte Zwieeheneinlagen (5), die sich an End-Stimplatten (4) abstützen, zusamengeklenmt sind«1. Semiconductor @ leiehrichterblook, characterized in that the « individual monocrystallic semiconductor valves (1) are arranged in a column and the column is penetrated by coolers (2), the valves (1) and the cooler (2) by bolts (3) and cone-shaped spring-loaded second inserts (5), which are support on end face plates (4), are clipped together « 2. Halbleiter-Sleiehrichterblook nach Anspruch. 1, dadurch gekennzeichnet, dass ein beidseitig gekühltes Ventil (1) mit einem weiteren Ventil (1) unter Zwischenlage einer.elektrisch leitenden oder nicht-leitenden Einlage (6) verbunden ist.2. Semiconductor sleiehrichterblook according to claim. 1, characterized in that that a valve (1) cooled on both sides with a further valve (1) with the interposition of an electrically conductive or non-conductive insert (6) is connected. 3. Halbleiter-GKLeichrichterblock nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die axiale Anordnung der Ventile (1) der kegeligen Zwischeneinlagen (5) und der Einlagen (6) mit Hilfe einer Längenut (7) in den Kühlern (2) und zweier Bolzen (3) bewirkt wird.3. Semiconductor GK rectifier block according to claim 1 or 2, characterized characterized in that the axial arrangement of the valves (1) of the conical intermediate inserts (5) and the inserts (6) with the help a length groove (7) in the coolers (2) and two bolts (3) is effected. 80 98 10/103380 98 10/1033
DE19631464515 1962-09-06 1963-09-04 SEMICONDUCTOR RECTIFIER BLOCK Pending DE1464515B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS514762 1962-09-06

Publications (2)

Publication Number Publication Date
DE1464515A1 true DE1464515A1 (en) 1968-11-28
DE1464515B2 DE1464515B2 (en) 1973-05-03

Family

ID=5395800

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19631464515 Pending DE1464515B2 (en) 1962-09-06 1963-09-04 SEMICONDUCTOR RECTIFIER BLOCK

Country Status (4)

Country Link
AT (1) AT245681B (en)
CH (1) CH423969A (en)
DE (1) DE1464515B2 (en)
GB (1) GB992442A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2739520A1 (en) * 1977-08-16 1979-02-22 Bbc Brown Boveri & Cie SEMI-CONDUCTIVE VALVE COOLER WITH CONDUCTOR ELEMENTS FOR A COOLANT FLOW AND SEMICONDUCTOR VALVE COLUMN WITH SEMI-CONDUCTIVE VALVE COOLERS
US4628219A (en) * 1985-09-13 1986-12-09 Sundstrand Corporation Rectifier assembly for mounting in a rotor
EP3018709A1 (en) * 2014-11-04 2016-05-11 SEMIKRON Elektronik GmbH & Co. KG Power converter

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1913546C3 (en) * 1969-03-18 1975-08-28 Siemens Ag, 1000 Berlin Und 8000 Muenchen module
US3715632A (en) * 1971-01-08 1973-02-06 Gen Electric Liquid cooled semiconductor device clamping assembly
DE2950073A1 (en) * 1977-12-13 1981-06-19 Robert Bosch Gmbh, 7000 Stuttgart Rectifier module for battery charger in motor vehicle - has Zener diode protecting load supplied from rectifier
DE2812699A1 (en) * 1978-03-23 1979-09-27 Bbc Brown Boveri & Cie ARRANGEMENT OF DISC THYRISTORS IN THERMAL AND ELECTRICAL CONTACT ON HEAT SINK
US4570094A (en) * 1984-01-23 1986-02-11 Sundstrand Corporation Rotating rectifier assembly
DE4025885C2 (en) * 1990-08-16 1994-09-08 Gewerk Auguste Victoria Semiconductor column

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2739520A1 (en) * 1977-08-16 1979-02-22 Bbc Brown Boveri & Cie SEMI-CONDUCTIVE VALVE COOLER WITH CONDUCTOR ELEMENTS FOR A COOLANT FLOW AND SEMICONDUCTOR VALVE COLUMN WITH SEMI-CONDUCTIVE VALVE COOLERS
US4628219A (en) * 1985-09-13 1986-12-09 Sundstrand Corporation Rectifier assembly for mounting in a rotor
EP3018709A1 (en) * 2014-11-04 2016-05-11 SEMIKRON Elektronik GmbH & Co. KG Power converter

Also Published As

Publication number Publication date
DE1464515B2 (en) 1973-05-03
AT245681B (en) 1966-03-10
GB992442A (en) 1965-05-19
CH423969A (en) 1966-11-15

Similar Documents

Publication Publication Date Title
EP0142678B1 (en) Semiconductor rectifier
DE1231730B (en) Cooling device, especially a refrigerator with two electrothermal cooling devices
DE1464515A1 (en) Semiconductor rectifier block
DE2348207A1 (en) THYRISTOR COLUMN
DE2160302A1 (en) COOLER FOR INSTALLATION IN DISC CELL STACKS
DE1564694C3 (en)
DE2417031A1 (en) THYRISTOR COLUMN
DE1614640B1 (en) RECTIFIER ARRANGEMENT
DE2203032C3 (en) Cooled semiconductor device
DE2218612A1 (en) Rectifier arrangement with cooled power supply
DE2515046C3 (en) Thyristor column
DE4420564C2 (en) Clamping assembly of a converter for liquid cooling of electrical components
DE2103982C3 (en) Power converter cooled with insulating liquid
DE854552C (en) Device for connecting a water-cooled inductor for inductive heating of workpieces
DE3311712C2 (en)
DE1789139C3 (en) Stackable semiconductor device. Elimination from: 1439160
DE2756005A1 (en) Clamping device for power semiconductor and heat sink - has insulated clamping bolts, each coupled to insulator between heat sink plates
DE1614437C3 (en) Rectifier arrangement
DE2163683A1 (en) SEMICONDUCTOR UNIT AND METHOD OF MANUFACTURING THE SAME
DE1489690C3 (en) Cooling arrangement for semiconductor components with different electrical potentials
CH651994A5 (en) LIQUID-COOLED ELECTRICAL ASSEMBLY AND METHOD FOR THE PRODUCTION THEREOF.
DE1275670B (en) Switching connection between two consecutive conductor bars in liquid-cooled windings of electrical machines
DE1464356A1 (en) Electric coil which can be compressed in its longitudinal direction and which consists of disc windings
DE2711931A1 (en) Semiconductor component with two liq. cooled pressure plates - has heat sink with coolant flow channel in closure compression contact with plates
DE522588C (en) Power converter

Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971