DE19781818T1 - Verfahren und Vorrichtung für das chemische, mechanische Ebnen elektronischer Einrichtungen - Google Patents
Verfahren und Vorrichtung für das chemische, mechanische Ebnen elektronischer EinrichtungenInfo
- Publication number
- DE19781818T1 DE19781818T1 DE19781818T DE19781818T DE19781818T1 DE 19781818 T1 DE19781818 T1 DE 19781818T1 DE 19781818 T DE19781818 T DE 19781818T DE 19781818 T DE19781818 T DE 19781818T DE 19781818 T1 DE19781818 T1 DE 19781818T1
- Authority
- DE
- Germany
- Prior art keywords
- chemical
- electronic devices
- mechanical leveling
- leveling
- mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/662,678 US5769691A (en) | 1996-06-14 | 1996-06-14 | Methods and apparatus for the chemical mechanical planarization of electronic devices |
PCT/US1997/009901 WO1997047433A1 (en) | 1996-06-14 | 1997-06-06 | Methods and apparatus for the chemical mechanical planarization of electronic devices |
Publications (1)
Publication Number | Publication Date |
---|---|
DE19781818T1 true DE19781818T1 (de) | 1999-09-23 |
Family
ID=24658724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19781818T Withdrawn DE19781818T1 (de) | 1996-06-14 | 1997-06-06 | Verfahren und Vorrichtung für das chemische, mechanische Ebnen elektronischer Einrichtungen |
Country Status (7)
Country | Link |
---|---|
US (2) | US5769691A (de) |
JP (1) | JPH11512978A (de) |
KR (1) | KR20000016516A (de) |
DE (1) | DE19781818T1 (de) |
GB (1) | GB2329601B (de) |
TW (1) | TW431944B (de) |
WO (1) | WO1997047433A1 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6069080A (en) * | 1992-08-19 | 2000-05-30 | Rodel Holdings, Inc. | Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
US6099954A (en) | 1995-04-24 | 2000-08-08 | Rodel Holdings, Inc. | Polishing material and method of polishing a surface |
US5769691A (en) * | 1996-06-14 | 1998-06-23 | Speedfam Corp | Methods and apparatus for the chemical mechanical planarization of electronic devices |
US6139402A (en) | 1997-12-30 | 2000-10-31 | Micron Technology, Inc. | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
US6780095B1 (en) | 1997-12-30 | 2004-08-24 | Micron Technology, Inc. | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
US6106662A (en) * | 1998-06-08 | 2000-08-22 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection for chemical mechanical polishing |
US6221775B1 (en) * | 1998-09-24 | 2001-04-24 | International Business Machines Corp. | Combined chemical mechanical polishing and reactive ion etching process |
US6294106B1 (en) * | 1998-10-21 | 2001-09-25 | W. R. Grace & Co. -Conn. | Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles |
TWI235115B (en) * | 1998-10-26 | 2005-07-01 | Scapa Group Plc | Seamless, composite belts |
US6390890B1 (en) | 1999-02-06 | 2002-05-21 | Charles J Molnar | Finishing semiconductor wafers with a fixed abrasive finishing element |
FR2785614B1 (fr) * | 1998-11-09 | 2001-01-26 | Clariant France Sa | Nouveau procede de polissage mecano-chimique selectif entre une couche d'oxyde de silicium et une couche de nitrure de silicium |
US6641463B1 (en) | 1999-02-06 | 2003-11-04 | Beaver Creek Concepts Inc | Finishing components and elements |
US6322425B1 (en) | 1999-07-30 | 2001-11-27 | Corning Incorporated | Colloidal polishing of fused silica |
EP1272580A2 (de) * | 2000-04-11 | 2003-01-08 | Cabot Microelectronics Corporation | System zur vorzugsweisenden abtrennung von siliziumoxid |
JP2002059356A (ja) * | 2000-08-17 | 2002-02-26 | Shin Etsu Handotai Co Ltd | 半導体ウェーハの研磨方法 |
US6623355B2 (en) | 2000-11-07 | 2003-09-23 | Micell Technologies, Inc. | Methods, apparatus and slurries for chemical mechanical planarization |
US6350692B1 (en) * | 2000-12-14 | 2002-02-26 | Infineon Technologies Ag | Increased polish removal rate of dielectric layers using fixed abrasive pads |
US6863774B2 (en) * | 2001-03-08 | 2005-03-08 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
US6852020B2 (en) * | 2003-01-22 | 2005-02-08 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same |
US7037184B2 (en) * | 2003-01-22 | 2006-05-02 | Raytech Innovation Solutions, Llc | Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
WO2004027840A2 (en) * | 2002-09-18 | 2004-04-01 | Memc Electronic Materials, Inc. | Process for etching silicon wafers |
US7449067B2 (en) * | 2003-11-03 | 2008-11-11 | International Business Machines Corporation | Method and apparatus for filling vias |
WO2017053685A1 (en) | 2015-09-25 | 2017-03-30 | Cabot Microelectronics Corporation | Polyurethane cmp pads having a high modulus ratio |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4048765A (en) * | 1974-05-01 | 1977-09-20 | The Manufacturers Brush Company | Non-cellular polyurethane wheel in a process for finishing a metal workpiece |
US4057939A (en) * | 1975-12-05 | 1977-11-15 | International Business Machines Corporation | Silicon wafer polishing |
DE3624878A1 (de) * | 1985-07-31 | 1987-02-12 | Speedfam Corp | Flachlaeppmaschine |
JPS6362673A (ja) * | 1986-09-01 | 1988-03-18 | Speedfam Co Ltd | 定寸機構付き平面研磨装置 |
JPS6471661A (en) * | 1987-09-09 | 1989-03-16 | Showa Denko Kk | Mirror polishing method for semiconductor wafer |
EP0348757B1 (de) * | 1988-06-28 | 1995-01-04 | Mitsubishi Materials Silicon Corporation | Verfahren zur Polierung eines Halbleiter-Plättchens |
US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
US5069002A (en) * | 1991-04-17 | 1991-12-03 | Micron Technology, Inc. | Apparatus for endpoint detection during mechanical planarization of semiconductor wafers |
US5329732A (en) * | 1992-06-15 | 1994-07-19 | Speedfam Corporation | Wafer polishing method and apparatus |
US5498199A (en) * | 1992-06-15 | 1996-03-12 | Speedfam Corporation | Wafer polishing method and apparatus |
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5435772A (en) * | 1993-04-30 | 1995-07-25 | Motorola, Inc. | Method of polishing a semiconductor substrate |
US5486129A (en) * | 1993-08-25 | 1996-01-23 | Micron Technology, Inc. | System and method for real-time control of semiconductor a wafer polishing, and a polishing head |
US5489233A (en) * | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
US5534106A (en) * | 1994-07-26 | 1996-07-09 | Kabushiki Kaisha Toshiba | Apparatus for processing semiconductor wafers |
US5536202A (en) * | 1994-07-27 | 1996-07-16 | Texas Instruments Incorporated | Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish |
EP0779655A3 (de) * | 1995-12-14 | 1997-07-16 | International Business Machines Corporation | Verfahren zum chemisch-mechanischen Polieren eines Halbleitersubstrats eines elektronischen Bauteils |
JPH1071661A (ja) * | 1996-04-24 | 1998-03-17 | Mitsui Petrochem Ind Ltd | 防水材および防水層の施工方法 |
US5769691A (en) * | 1996-06-14 | 1998-06-23 | Speedfam Corp | Methods and apparatus for the chemical mechanical planarization of electronic devices |
-
1996
- 1996-06-14 US US08/662,678 patent/US5769691A/en not_active Expired - Fee Related
-
1997
- 1997-06-06 KR KR1019980710103A patent/KR20000016516A/ko not_active Application Discontinuation
- 1997-06-06 DE DE19781818T patent/DE19781818T1/de not_active Withdrawn
- 1997-06-06 JP JP10501726A patent/JPH11512978A/ja active Pending
- 1997-06-06 GB GB9827129A patent/GB2329601B/en not_active Expired - Fee Related
- 1997-06-06 WO PCT/US1997/009901 patent/WO1997047433A1/en not_active Application Discontinuation
- 1997-08-06 TW TW086108170A patent/TW431944B/zh not_active IP Right Cessation
-
1998
- 1998-01-16 US US09/008,148 patent/US7083501B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2329601B (en) | 2000-07-12 |
US7083501B1 (en) | 2006-08-01 |
KR20000016516A (ko) | 2000-03-25 |
GB2329601A (en) | 1999-03-31 |
US5769691A (en) | 1998-06-23 |
WO1997047433A1 (en) | 1997-12-18 |
GB9827129D0 (en) | 1999-02-03 |
TW431944B (en) | 2001-05-01 |
JPH11512978A (ja) | 1999-11-09 |
GB2329601A8 (en) | 1999-04-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8127 | New person/name/address of the applicant |
Owner name: SPEEDFAM-IPEC CORP.(N.D.GES.D.STAATES DELAWARE), C |
|
8139 | Disposal/non-payment of the annual fee |