DE19781974T1 - Sputtersystem mit zylindrischem Wagen - Google Patents
Sputtersystem mit zylindrischem WagenInfo
- Publication number
- DE19781974T1 DE19781974T1 DE19781974T DE19781974T DE19781974T1 DE 19781974 T1 DE19781974 T1 DE 19781974T1 DE 19781974 T DE19781974 T DE 19781974T DE 19781974 T DE19781974 T DE 19781974T DE 19781974 T1 DE19781974 T1 DE 19781974T1
- Authority
- DE
- Germany
- Prior art keywords
- sputtering system
- cylindrical carriage
- carriage
- cylindrical
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004544 sputter deposition Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/703,011 US5753092A (en) | 1996-08-26 | 1996-08-26 | Cylindrical carriage sputtering system |
PCT/US1997/015062 WO1998008997A2 (en) | 1996-08-26 | 1997-08-26 | A cylindrical carriage sputtering system |
Publications (1)
Publication Number | Publication Date |
---|---|
DE19781974T1 true DE19781974T1 (de) | 1999-10-14 |
Family
ID=24823580
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19781974T Pending DE19781974T1 (de) | 1996-08-26 | 1997-08-26 | Sputtersystem mit zylindrischem Wagen |
DE19781974A Expired - Fee Related DE19781974C2 (de) | 1996-08-26 | 1997-08-26 | Sputtersystem mit zylindrischem Wagen |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19781974A Expired - Fee Related DE19781974C2 (de) | 1996-08-26 | 1997-08-26 | Sputtersystem mit zylindrischem Wagen |
Country Status (6)
Country | Link |
---|---|
US (1) | US5753092A (de) |
JP (1) | JP2000517378A (de) |
AU (1) | AU4164497A (de) |
DE (2) | DE19781974T1 (de) |
TW (1) | TW495827B (de) |
WO (1) | WO1998008997A2 (de) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6231732B1 (en) * | 1997-08-26 | 2001-05-15 | Scivac | Cylindrical carriage sputtering system |
US6365010B1 (en) | 1998-11-06 | 2002-04-02 | Scivac | Sputtering apparatus and process for high rate coatings |
US6178608B1 (en) * | 1999-03-26 | 2001-01-30 | Bourn & Koch Machine Tool Co. | Rotary transfer machine |
US6402903B1 (en) | 2000-02-04 | 2002-06-11 | Steag Hamatech Ag | Magnetic array for sputtering system |
KR20010087664A (ko) * | 2000-03-08 | 2001-09-21 | 손명호 | 전자파 차폐막 코팅방법 및 그 장치 |
US20020044391A1 (en) | 2000-11-15 | 2002-04-18 | Masayoshi Hiramoto | Magneto-resistive element magnetic head, and magnetic recording and reproduction apparatus |
US20030003767A1 (en) * | 2001-06-29 | 2003-01-02 | Plasmion Corporation | High throughput hybrid deposition system and method using the same |
DE10205167C5 (de) * | 2002-02-07 | 2007-01-18 | Von Ardenne Anlagentechnik Gmbh | In-Line-Vakuumbeschichtungsanlage zur Zwischenbehandlung von Substraten |
PL204742B1 (pl) * | 2002-05-06 | 2010-02-26 | Guardian Industries | Urządzenie powlekające do formowania pierwszej i drugiej powłoki na szklanym substracie |
US20060063680A1 (en) * | 2002-07-26 | 2006-03-23 | Metal Oxide Technologies, Inc. | System and method for joining superconductivity tape |
WO2004013373A2 (en) * | 2002-08-02 | 2004-02-12 | Seagate Technology Llc | Apparatus and method to control bias during sputtering |
US20040045813A1 (en) * | 2002-09-03 | 2004-03-11 | Seiichiro Kanno | Wafer processing apparatus, wafer stage, and wafer processing method |
DE10307454B4 (de) * | 2003-02-21 | 2010-10-28 | Vistec Semiconductor Systems Gmbh | Verfahren zur optischen Inspektion eines Halbleitersubstrats |
US20040262148A1 (en) * | 2003-06-23 | 2004-12-30 | Cheng Yuanda Randy | Sputter cathode assembly for uniform film deposition |
DE10351330A1 (de) * | 2003-10-31 | 2005-05-25 | Sig Technology Ltd. | Verfahren und Vorrichtung zur Versorgung mindestens einer Bearbeitungsstation für ein Werkstück |
US7799180B2 (en) | 2003-11-14 | 2010-09-21 | Micron Technology, Inc. | Silver selenide sputtered films and method and apparatus for controlling defect formation in silver selenide sputtered films |
DE102004008598B4 (de) * | 2004-02-21 | 2006-12-28 | Applied Films Gmbh & Co. Kg | Verfahren für den Betrieb einer Inline-Beschichtungsanlage |
US7645492B2 (en) * | 2004-07-30 | 2010-01-12 | Exatec Llc | Plasma coating system for accommodating substrates of different shapes |
DE112005002056B4 (de) | 2004-08-30 | 2021-09-23 | Ulvac, Inc. | Filmformungsvorrichtung |
ATE415503T1 (de) * | 2005-08-10 | 2008-12-15 | Applied Materials Gmbh & Co Kg | Vakuumbeschichtungsanlage mit motorisch angetriebener drehkathode |
US20070178293A1 (en) * | 2006-01-06 | 2007-08-02 | Yerkes Steven C | Super Lattice Intrinsic Materials |
US8236152B2 (en) * | 2006-11-24 | 2012-08-07 | Ascentool International Ltd. | Deposition system |
WO2009029944A2 (en) * | 2007-08-31 | 2009-03-05 | Geoffrey Green | Improved sputtering assembly |
JP2010001565A (ja) * | 2008-05-20 | 2010-01-07 | Canon Anelva Corp | スパッタリング装置、それを用いた太陽電池及び画像表示装置の製造方法 |
WO2010021613A1 (en) * | 2008-08-20 | 2010-02-25 | Ascentool, Inc. | Deposition system |
KR101028406B1 (ko) * | 2009-08-12 | 2011-04-13 | (주)화백엔지니어링 | 아크 검출장치 및 방법 |
JP5497572B2 (ja) * | 2009-08-18 | 2014-05-21 | キヤノンアネルバ株式会社 | スパッタリング装置及び真空処理装置 |
KR101282959B1 (ko) * | 2009-11-03 | 2013-07-08 | 한국과학기술연구원 | 무기 박막 형성 방법 및 그를 위한 스퍼터링 시스템 |
CN102127740B (zh) * | 2010-01-19 | 2013-12-11 | 鸿富锦精密工业(深圳)有限公司 | 溅镀装置 |
CN102294642B (zh) * | 2010-06-25 | 2014-03-26 | 鸿富锦精密工业(深圳)有限公司 | 抛光装置 |
JP5220147B2 (ja) * | 2010-06-29 | 2013-06-26 | キヤノンアネルバ株式会社 | 冷却装置および加熱装置 |
JP5527894B2 (ja) * | 2010-09-01 | 2014-06-25 | 株式会社アルバック | スパッタ装置 |
DE102010056157A1 (de) * | 2010-12-28 | 2012-06-28 | Oerlikon Trading Ag, Trübbach | Halterung für Bohrkopfbeschichtung |
EP2718959B1 (de) * | 2011-06-07 | 2018-10-31 | Vision Ease LP | Verbesserungen bei der auftragung von beschichtungsmaterialien |
DE102012104475A1 (de) * | 2012-05-24 | 2013-11-28 | Aixtron Se | Carousel-Reactor |
DE102014112723A1 (de) | 2014-09-04 | 2016-03-10 | Eaton Industries Austria Gmbh | Verfahren zur Unterscheidung eines Lichtbogens von einem leuchtenden Gas enthaltend zumindest Metalldampf |
CN111221147B (zh) | 2015-04-15 | 2022-04-12 | 视觉缓解公司 | 具有分等级的显微镜头的眼镜镜片 |
DE102015220162A1 (de) * | 2015-10-16 | 2017-04-20 | Robert Bosch Gmbh | Steuergerät für ein Fahrzeug mit einem Lichtbogensensor |
US10268050B2 (en) | 2015-11-06 | 2019-04-23 | Hoya Lens Thailand Ltd. | Spectacle lens |
JP6588418B2 (ja) * | 2016-12-07 | 2019-10-09 | 株式会社神戸製鋼所 | 成膜装置およびそれを用いた成膜物の製造方法、ならびに冷却パネル |
US10422038B2 (en) * | 2017-03-14 | 2019-09-24 | Eastman Kodak Company | Dual gas bearing substrate positioning system |
US10400332B2 (en) * | 2017-03-14 | 2019-09-03 | Eastman Kodak Company | Deposition system with interlocking deposition heads |
US11397038B1 (en) | 2017-07-18 | 2022-07-26 | Seagate Technology Llc | Coaxially pumped cooling station |
JP7000083B2 (ja) * | 2017-09-07 | 2022-01-19 | 芝浦メカトロニクス株式会社 | 成膜装置 |
JP6511212B1 (ja) * | 2017-11-10 | 2019-05-15 | 株式会社アルバック | 真空装置、吸着装置、導電性薄膜製造方法 |
CN108193189A (zh) * | 2017-12-27 | 2018-06-22 | 深圳市华星光电技术有限公司 | 一种真空溅射设备及其真空大气交换装置 |
US11378818B2 (en) | 2018-03-01 | 2022-07-05 | Essilor International | Lens element |
US11852904B2 (en) | 2018-03-01 | 2023-12-26 | Essilor International | Lens element |
TWI738401B (zh) * | 2020-07-03 | 2021-09-01 | 力鼎精密股份有限公司 | 將載板送入超高真空加熱腔室以及超低溫磁控離子反應式蝕刻腔體中加工之方法 |
CN111972376B (zh) * | 2020-09-07 | 2022-07-08 | 杨庄 | 一种具备蚊香液的灭蚊灯 |
KR20220126847A (ko) * | 2021-03-09 | 2022-09-19 | 삼성디스플레이 주식회사 | 마그넷 조립체 및 이를 포함하는 증착 장치 |
TW202337683A (zh) * | 2021-12-07 | 2023-10-01 | 美商因特瓦克公司 | 硬質耐刮擦低反射率光學塗層 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3294670A (en) * | 1963-10-07 | 1966-12-27 | Western Electric Co | Apparatus for processing materials in a controlled atmosphere |
US4051010A (en) * | 1975-12-18 | 1977-09-27 | Western Electric Company, Inc. | Sputtering apparatus |
US4126530A (en) * | 1977-08-04 | 1978-11-21 | Telic Corporation | Method and apparatus for sputter cleaning and bias sputtering |
US4909314A (en) * | 1979-12-21 | 1990-03-20 | Varian Associates, Inc. | Apparatus for thermal treatment of a wafer in an evacuated environment |
US4500407A (en) * | 1983-07-19 | 1985-02-19 | Varian Associates, Inc. | Disk or wafer handling and coating system |
US4491509A (en) * | 1984-03-09 | 1985-01-01 | At&T Technologies, Inc. | Methods of and apparatus for sputtering material onto a substrate |
US4591418A (en) * | 1984-10-26 | 1986-05-27 | The Parker Pen Company | Microlaminated coating |
DE3503398A1 (de) * | 1985-02-01 | 1986-08-07 | W.C. Heraeus Gmbh, 6450 Hanau | Sputteranlage zum reaktiven beschichten eines substrates mit hartstoffen |
US4749465A (en) * | 1985-05-09 | 1988-06-07 | Seagate Technology | In-line disk sputtering system |
US4894133A (en) * | 1985-11-12 | 1990-01-16 | Virgle L. Hedgcoth | Method and apparatus making magnetic recording disk |
JPS63192865A (ja) * | 1987-02-05 | 1988-08-10 | Tokio Nakada | 多層/多元薄膜形成スパッタリング装置およびその運転方法 |
US4734158A (en) * | 1987-03-16 | 1988-03-29 | Hughes Aircraft Company | Molecular beam etching system and method |
US4860139A (en) * | 1987-06-19 | 1989-08-22 | Censtor Corporation | Planarized read/write head and method |
DE3721373A1 (de) * | 1987-06-29 | 1989-01-12 | Leybold Ag | Beschichtungsvorrichtung |
US4756794A (en) * | 1987-08-31 | 1988-07-12 | The United States Of America As Represented By The Secretary Of The Navy | Atomic layer etching |
JPH01108378A (ja) * | 1987-10-21 | 1989-04-25 | Mitsubishi Electric Corp | スパツタ装置 |
US4851095A (en) * | 1988-02-08 | 1989-07-25 | Optical Coating Laboratory, Inc. | Magnetron sputtering apparatus and process |
US4865708A (en) * | 1988-11-14 | 1989-09-12 | Vac-Tec Systems, Inc. | Magnetron sputtering cathode |
US4964986A (en) * | 1989-02-06 | 1990-10-23 | Baker Hughes Incorporated | Membrane filter plate |
US5041932A (en) * | 1989-11-27 | 1991-08-20 | Censtor Corp. | Integrated magnetic read/write head/flexure/conductor structure |
US5252194A (en) * | 1990-01-26 | 1993-10-12 | Varian Associates, Inc. | Rotating sputtering apparatus for selected erosion |
DE69230493T2 (de) * | 1991-04-04 | 2000-05-04 | Seagate Technology | Verfahren und vorrichtung zum sputtern mit hoher geschwindigkeit |
DE4123589C2 (de) * | 1991-07-17 | 2001-03-29 | Leybold Ag | Vorrichtung zum Messen der Lichtstrahlung eines Plasmas |
US5215420A (en) * | 1991-09-20 | 1993-06-01 | Intevac, Inc. | Substrate handling and processing system |
US5181556A (en) * | 1991-09-20 | 1993-01-26 | Intevac, Inc. | System for substrate cooling in an evacuated environment |
JP2688872B2 (ja) * | 1992-03-30 | 1997-12-10 | アネルバ株式会社 | Pzt薄膜の作製方法及びスパッタリング装置 |
US5262028A (en) * | 1992-06-01 | 1993-11-16 | Sierra Applied Sciences, Inc. | Planar magnetron sputtering magnet assembly |
IT1261227B (it) * | 1993-04-06 | 1996-05-09 | Cetev Cent Tecnolog Vuoto | Impianto di deposizione di film sottili, preferibilmente riferito a tecniche pecvd e "sputtering", e relativi processi. |
US5421979A (en) * | 1993-08-03 | 1995-06-06 | Photran Corporation | Load-lock drum-type coating apparatus |
US5415754A (en) * | 1993-10-22 | 1995-05-16 | Sierra Applied Sciences, Inc. | Method and apparatus for sputtering magnetic target materials |
-
1996
- 1996-08-26 US US08/703,011 patent/US5753092A/en not_active Expired - Fee Related
-
1997
- 1997-08-23 TW TW086112154A patent/TW495827B/zh active
- 1997-08-26 JP JP10511873A patent/JP2000517378A/ja active Pending
- 1997-08-26 WO PCT/US1997/015062 patent/WO1998008997A2/en active Application Filing
- 1997-08-26 DE DE19781974T patent/DE19781974T1/de active Pending
- 1997-08-26 AU AU41644/97A patent/AU4164497A/en not_active Abandoned
- 1997-08-26 DE DE19781974A patent/DE19781974C2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2000517378A (ja) | 2000-12-26 |
WO1998008997A2 (en) | 1998-03-05 |
DE19781974C2 (de) | 2002-01-10 |
WO1998008997A3 (en) | 1998-06-04 |
AU4164497A (en) | 1998-03-19 |
TW495827B (en) | 2002-07-21 |
US5753092A (en) | 1998-05-19 |
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