DE19882930T1 - Werkstück-Spanneinrichtung - Google Patents

Werkstück-Spanneinrichtung

Info

Publication number
DE19882930T1
DE19882930T1 DE19882930T DE19882930T DE19882930T1 DE 19882930 T1 DE19882930 T1 DE 19882930T1 DE 19882930 T DE19882930 T DE 19882930T DE 19882930 T DE19882930 T DE 19882930T DE 19882930 T1 DE19882930 T1 DE 19882930T1
Authority
DE
Germany
Prior art keywords
clamping device
workpiece clamping
workpiece
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19882930T
Other languages
English (en)
Inventor
Paul A Getchel
Kenneth M Cole
Henry A Lyden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Temptronic Corp
Original Assignee
Temptronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temptronic Corp filed Critical Temptronic Corp
Publication of DE19882930T1 publication Critical patent/DE19882930T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum
DE19882930T 1997-12-31 1998-11-09 Werkstück-Spanneinrichtung Withdrawn DE19882930T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/001,893 US6073681A (en) 1997-12-31 1997-12-31 Workpiece chuck
PCT/US1998/023727 WO1999034412A2 (en) 1997-12-31 1998-11-09 Workpiece chuck

Publications (1)

Publication Number Publication Date
DE19882930T1 true DE19882930T1 (de) 2001-03-22

Family

ID=21698322

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19882930T Withdrawn DE19882930T1 (de) 1997-12-31 1998-11-09 Werkstück-Spanneinrichtung

Country Status (4)

Country Link
US (2) US6073681A (de)
JP (1) JP2002500438A (de)
DE (1) DE19882930T1 (de)
WO (1) WO1999034412A2 (de)

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US6073681A (en) * 1997-12-31 2000-06-13 Temptronic Corporation Workpiece chuck
US6328096B1 (en) 1997-12-31 2001-12-11 Temptronic Corporation Workpiece chuck
US6866094B2 (en) * 1997-12-31 2005-03-15 Temptronic Corporation Temperature-controlled chuck with recovery of circulating temperature control fluid
US6415858B1 (en) 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US7244677B2 (en) * 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
FR2780792B1 (fr) * 1998-07-03 2000-09-22 St Microelectronics Sa Appareillage de test de puces electroniques
US6277671B1 (en) * 1998-10-20 2001-08-21 Micron Technology, Inc. Methods of forming integrated circuit packages
US6945151B1 (en) * 1998-10-20 2005-09-20 Micron Technology, Inc. Integrated circuit package separators
US6322626B1 (en) 1999-06-08 2001-11-27 Micron Technology, Inc. Apparatus for controlling a temperature of a microelectronics substrate
US6920915B1 (en) * 1999-10-02 2005-07-26 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for cooling a semiconductor substrate
US6780374B2 (en) * 2000-12-08 2004-08-24 Semitool, Inc. Method and apparatus for processing a microelectronic workpiece at an elevated temperature
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US7661315B2 (en) * 2004-05-24 2010-02-16 Sonix, Inc. Method and apparatus for ultrasonic scanning of a fabrication wafer
US7703823B2 (en) * 2004-07-12 2010-04-27 Rudolph Technologies, Inc. Wafer holding mechanism
CN100383948C (zh) * 2005-08-19 2008-04-23 力晶半导体股份有限公司 晶片检测夹具
JP3859682B1 (ja) * 2005-09-08 2006-12-20 東京応化工業株式会社 基板の薄板化方法及び回路素子の製造方法
JP4525571B2 (ja) * 2005-11-24 2010-08-18 住友電気工業株式会社 ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ
EP2004366A2 (de) * 2006-01-27 2008-12-24 Camtek Ltd. Adapter für zerteilten wafer und verfahren zur übertragung eines zerteilten wafers
JP4950688B2 (ja) * 2006-03-13 2012-06-13 東京エレクトロン株式会社 載置装置
US7917317B2 (en) 2006-07-07 2011-03-29 Sonix, Inc. Ultrasonic inspection using acoustic modeling
WO2008075340A1 (en) * 2006-12-18 2008-06-26 Camtek Ltd. A chuck and a method for supporting an object
US8222574B2 (en) * 2007-01-15 2012-07-17 Applied Materials, Inc. Temperature measurement and control of wafer support in thermal processing chamber
TWM321831U (en) * 2007-01-17 2007-11-11 Yung-Tsai Shen Vacuum absorbing device for a workbench
US8760621B2 (en) * 2007-03-12 2014-06-24 Asml Netherlands B.V. Lithographic apparatus and method
JP4996958B2 (ja) * 2007-03-29 2012-08-08 富士フイルム株式会社 マイクロ流体デバイス
CN101959640A (zh) * 2008-02-29 2011-01-26 Thk株式会社 具备冷却结构的旋转工作台装置、具备冷却结构的旋转轴承
US7989729B1 (en) * 2008-03-11 2011-08-02 Kla-Tencor Corporation Detecting and repairing defects of photovoltaic devices
JP5036614B2 (ja) * 2008-04-08 2012-09-26 東京応化工業株式会社 基板用ステージ
DE102009018434B4 (de) * 2009-04-22 2023-11-30 Ev Group Gmbh Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten
JP2011138877A (ja) * 2009-12-28 2011-07-14 Seiko Epson Corp 非接触保持体及び非接触保持ハンド
EP2383771B1 (de) * 2010-04-29 2020-04-22 EV Group GmbH Vorrichtung und Verfahren zum Lösen einer Polymerschicht von einer Oberfläche eines Substrats
US9130002B2 (en) * 2010-05-07 2015-09-08 Lam Research Ag Device for holding wafer shaped articles
JP5620574B2 (ja) 2010-06-07 2014-11-05 カスケード マイクロテックインコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ プローブステーション用高電圧チャック
JP2012028541A (ja) * 2010-07-23 2012-02-09 Disco Abrasive Syst Ltd 粘着シート脱着用保持テーブル
JP5889581B2 (ja) 2010-09-13 2016-03-22 東京エレクトロン株式会社 ウエハ検査装置
JP5675239B2 (ja) * 2010-09-15 2015-02-25 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
KR20130031945A (ko) * 2011-09-22 2013-04-01 삼성전자주식회사 로딩용 척의 온도 제어 설비 및 온도 제어 방법
US9335080B2 (en) 2011-10-17 2016-05-10 Temptronic Corporation Temperature system having an impurity filter
US9244107B2 (en) * 2012-11-12 2016-01-26 Marvell World Trade Ltd. Heat sink blade pack for device under test testing
JP6013250B2 (ja) * 2013-03-27 2016-10-25 東京エレクトロン株式会社 プローブ装置
DE102014100351B4 (de) * 2014-01-14 2022-10-06 Johannes Herrmann e. K. Luftgelagertes Auflageelement insbesondere für Kraftfahrzeuge
JP6510461B2 (ja) * 2016-05-25 2019-05-08 日本特殊陶業株式会社 基板保持装置
JP7308288B2 (ja) 2019-11-27 2023-07-13 京セラ株式会社 回路基板、プローブカード用基板およびプローブカード

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Also Published As

Publication number Publication date
JP2002500438A (ja) 2002-01-08
US20020036077A1 (en) 2002-03-28
US6073681A (en) 2000-06-13
WO1999034412A2 (en) 1999-07-08
WO1999034412A3 (en) 1999-12-29
US6540014B2 (en) 2003-04-01

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Legal Events

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8110 Request for examination paragraph 44
8139 Disposal/non-payment of the annual fee