DE20114544U1 - Wafersonde - Google Patents

Wafersonde

Info

Publication number
DE20114544U1
DE20114544U1 DE20114544U DE20114544U DE20114544U1 DE 20114544 U1 DE20114544 U1 DE 20114544U1 DE 20114544 U DE20114544 U DE 20114544U DE 20114544 U DE20114544 U DE 20114544U DE 20114544 U1 DE20114544 U1 DE 20114544U1
Authority
DE
Germany
Prior art keywords
contact fingers
probe
contact
support
probe according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20114544U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Beaverton Inc
Original Assignee
Cascade Microtech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cascade Microtech Inc filed Critical Cascade Microtech Inc
Publication of DE20114544U1 publication Critical patent/DE20114544U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt

Claims (11)

1. Sonde (10), welche umfaßt:
  • a) eine im wesentlichen steife Auflage; und
  • b) eine Vielzahl von Kontaktfingern (16), welche von dieser Auflage gestützt werden und sich von dieser weg erstrecken, wobei die Kontaktfinger (16) so angeordnet sind, daß sie einen einheitlichen Aufbau bilden, so daß die Vielzahl von Kontaktfingern (16) einer vorbestimmten Anordnung gehalten werden, wenn sie mit dieser Auflage verbunden werden.
2. Sonde nach Anspruch 1, wobei eine Vielzahl von Kontaktfingern (16) in einer radial nach außen erstreckenden Richtung von der Auflage weg stehen.
3. Sonde nach Anspruch 2, wobei die Anordnung der Kontaktfinger an die Geometrie der Kontakterhebungen einer zu testenden Vorrichtung angepaßt sind.
4. Sonde nach Anspruch 1, wobei die Auflage ein Widerstands-Kapazitäts-Netzwerk (20) umfaßt, welches mit den Kontaktfingern (16) verbunden ist.
5. Sonde nach Anspruch 1, wobei die Auflage eine ebene Leiterplatte (14) ist.
6. Sonde nach Anspruch 1, wobei der einheitliche Aufbau ein Trägerelement (26) in der Nähe der Enden der Vielzahl der Kontaktfinger (16) umfaßt, welches die Kontaktfinger (16) in der vorbestimmten Anordnung hält.
7. Sonde nach Anspruch 6, wobei das Trägerelement (26) entfernt worden ist, bevor mit den Kontaktfingern (16) gemessen wird.
8. Sonde nach Anspruch 1, wobei die Auflage jeweils eine Leiterbahn für einen jeden der Kontaktfinger (16) umfaßt.
9. Sonde nach Anspruch 8, wobei die jeweiligen Leiterbahnen elektrisch verbunden sind mit einem Stecker, welcher dazu geeignet ist, mit einer Testvorrichtung verbunden zu werden.
10. Sonde nach Anspruch 7, wobei das Entfernen des Befestigungselements (26) dazu führt, daß die Enden eines jeden Kontaktfingers (16) aus der Anzahl der Kontaktfinger (16) in einer vorbestimmten Position bleiben.
11. Sonde nach Anspruch 1, wobei die Vielzahl der Kontaktfinger (16) größer als drei ist.
DE20114544U 2000-12-04 2001-09-04 Wafersonde Expired - Lifetime DE20114544U1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25118600P 2000-12-04 2000-12-04

Publications (1)

Publication Number Publication Date
DE20114544U1 true DE20114544U1 (de) 2002-02-21

Family

ID=22950846

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10143173A Withdrawn DE10143173A1 (de) 2000-12-04 2001-09-04 Wafersonde
DE20114544U Expired - Lifetime DE20114544U1 (de) 2000-12-04 2001-09-04 Wafersonde

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10143173A Withdrawn DE10143173A1 (de) 2000-12-04 2001-09-04 Wafersonde

Country Status (4)

Country Link
US (6) US7233160B2 (de)
JP (2) JP2002243761A (de)
KR (1) KR100795127B1 (de)
DE (2) DE10143173A1 (de)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
EP2237052A1 (de) * 2009-03-31 2010-10-06 Capres A/S Automatisierte Mehrpunktsondenmanipulation

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DE10143173A1 (de) * 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
US6815963B2 (en) * 2002-05-23 2004-11-09 Cascade Microtech, Inc. Probe for testing a device under test
US6724205B1 (en) * 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7057404B2 (en) * 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
JP4199629B2 (ja) * 2003-09-18 2008-12-17 株式会社日立ハイテクノロジーズ 内部構造観察方法とその装置
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US7466021B2 (en) * 2003-11-17 2008-12-16 Interconnect Portfolio, Llp Memory packages having stair step interconnection layers
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
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DE202004019636U1 (de) * 2004-12-20 2005-03-03 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Meßspitze für HF-Messung
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) * 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
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US9435855B2 (en) 2013-11-19 2016-09-06 Teradyne, Inc. Interconnect for transmitting signals between a device and a tester
US9594114B2 (en) 2014-06-26 2017-03-14 Teradyne, Inc. Structure for transmitting signals in an application space between a device under test and test electronics
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US10060963B2 (en) * 2016-04-01 2018-08-28 Formfactor Beaverton, Inc. Probe systems, storage media, and methods for wafer-level testing over extended temperature ranges
US9977052B2 (en) 2016-10-04 2018-05-22 Teradyne, Inc. Test fixture
US10481041B2 (en) * 2017-05-23 2019-11-19 Fluke Corporation Measuring optical array polarity, power, and loss using a position sensing detector and photodetector-equipped optical testing device
US10677815B2 (en) 2018-06-08 2020-06-09 Teradyne, Inc. Test system having distributed resources
US11119148B2 (en) 2018-10-18 2021-09-14 International Business Machines Corporation Test probe assembly with fiber optic leads and photodetectors for testing semiconductor wafers
US11125780B2 (en) 2018-10-18 2021-09-21 International Business Machines Corporation Test probe assembly with fiber optic leads and photodetectors
PH12020050134A1 (en) * 2019-06-12 2021-09-01 Jf Microtechnology Sdn Bhd Wedged contact fingers for integrated circuit testing apparatus
US11363746B2 (en) 2019-09-06 2022-06-14 Teradyne, Inc. EMI shielding for a signal trace
US11862901B2 (en) 2020-12-15 2024-01-02 Teradyne, Inc. Interposer
JP2022185454A (ja) * 2021-06-02 2022-12-14 株式会社日本マイクロニクス プローブユニット

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WO2010115771A1 (en) * 2009-03-31 2010-10-14 Capres A/S Automated multi-point probe manipulation
CN103869110A (zh) * 2009-03-31 2014-06-18 卡普雷斯股份有限公司 自动化多点探针操作
US8836358B2 (en) 2009-03-31 2014-09-16 Capres A/S Automated multi-point probe manipulation

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