DE29719716U1 - Divider - Google Patents

Divider

Info

Publication number
DE29719716U1
DE29719716U1 DE29719716U DE29719716U DE29719716U1 DE 29719716 U1 DE29719716 U1 DE 29719716U1 DE 29719716 U DE29719716 U DE 29719716U DE 29719716 U DE29719716 U DE 29719716U DE 29719716 U1 DE29719716 U1 DE 29719716U1
Authority
DE
Germany
Prior art keywords
divider
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29719716U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PICARD FA CARL AUG
Original Assignee
PICARD FA CARL AUG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PICARD FA CARL AUG filed Critical PICARD FA CARL AUG
Priority to DE29719716U priority Critical patent/DE29719716U1/en
Publication of DE29719716U1 publication Critical patent/DE29719716U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
DE29719716U 1997-11-06 1997-11-06 Divider Expired - Lifetime DE29719716U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29719716U DE29719716U1 (en) 1997-11-06 1997-11-06 Divider

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29719716U DE29719716U1 (en) 1997-11-06 1997-11-06 Divider

Publications (1)

Publication Number Publication Date
DE29719716U1 true DE29719716U1 (en) 1997-12-11

Family

ID=8048262

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29719716U Expired - Lifetime DE29719716U1 (en) 1997-11-06 1997-11-06 Divider

Country Status (1)

Country Link
DE (1) DE29719716U1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999053737A1 (en) * 1998-04-10 1999-10-21 R.E. Service Company, Inc. Steel alloy separator sheets and copper/steel laminated sheets for use in manufacturing printed circuit boards
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
DE10131887A1 (en) * 2001-07-04 2003-01-23 Dieter Backhaus Divider or method for producing a divider for a multilayer press package
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
DE102005034499A1 (en) * 2005-07-20 2007-02-01 Backhaus, Monika Tool for pressing a multilayer pressing package, in particular for arrangement in a press or package structure for pressing multilayers or press for pressing or production of multilayers
EP2676993A1 (en) 2012-06-20 2013-12-25 Siemens Aktiengesellschaft Component with a coating that reduces adhesion and method for producing same
DE102013212474A1 (en) 2013-06-27 2014-12-31 Siemens Aktiengesellschaft Powder-containing component with a adhesion-reducing layer and process for its preparation
WO2015032654A1 (en) * 2013-09-05 2015-03-12 Siemens Aktiengesellschaft Method for producing a layer by chemical or electrochemical coating
DE102017119341B4 (en) 2017-08-24 2022-05-25 Ksg Austria Gmbh Process and device for the treatment of pressed sheets in printed circuit board lamination

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG101922A1 (en) * 1998-04-10 2004-02-27 R E Sevice Company Inc Steel alloy separator sheets and copper/steel laminated sheets for use in manufacturing printed circuit boards
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
WO1999053737A1 (en) * 1998-04-10 1999-10-21 R.E. Service Company, Inc. Steel alloy separator sheets and copper/steel laminated sheets for use in manufacturing printed circuit boards
US6130000A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper and steel components for use in manufacturing printed circuit boards
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6235404B1 (en) 1998-04-10 2001-05-22 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
DE10131887A1 (en) * 2001-07-04 2003-01-23 Dieter Backhaus Divider or method for producing a divider for a multilayer press package
US6986950B2 (en) 2001-07-04 2006-01-17 Monika Backhaus Partition or method for producing a partition for a multilayer pressed packet
DE102005034499A1 (en) * 2005-07-20 2007-02-01 Backhaus, Monika Tool for pressing a multilayer pressing package, in particular for arrangement in a press or package structure for pressing multilayers or press for pressing or production of multilayers
DE102005034499B4 (en) * 2005-07-20 2011-03-31 Wickeder Westfalenstahl Gmbh Press package construction for pressing multilayers or press for pressing or production of multilayers
EP2676993A1 (en) 2012-06-20 2013-12-25 Siemens Aktiengesellschaft Component with a coating that reduces adhesion and method for producing same
DE102013212474A1 (en) 2013-06-27 2014-12-31 Siemens Aktiengesellschaft Powder-containing component with a adhesion-reducing layer and process for its preparation
WO2014206705A1 (en) * 2013-06-27 2014-12-31 Siemens Aktiengesellschaft Powder-carrying component having an adhesion-reducing layer and method for production thereof
WO2015032654A1 (en) * 2013-09-05 2015-03-12 Siemens Aktiengesellschaft Method for producing a layer by chemical or electrochemical coating
DE102017119341B4 (en) 2017-08-24 2022-05-25 Ksg Austria Gmbh Process and device for the treatment of pressed sheets in printed circuit board lamination

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19980129

R156 Lapse of ip right after 3 years

Effective date: 20010801