DE3277756D1 - Electronic package - Google Patents

Electronic package

Info

Publication number
DE3277756D1
DE3277756D1 DE8282101551T DE3277756T DE3277756D1 DE 3277756 D1 DE3277756 D1 DE 3277756D1 DE 8282101551 T DE8282101551 T DE 8282101551T DE 3277756 T DE3277756 T DE 3277756T DE 3277756 D1 DE3277756 D1 DE 3277756D1
Authority
DE
Germany
Prior art keywords
electronic package
package
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282101551T
Other languages
English (en)
Inventor
Lewis D Lipschutz
Ralph Ernst Meagher
Frank Patrick Presti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3277756D1 publication Critical patent/DE3277756D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
DE8282101551T 1981-03-30 1982-03-01 Electronic package Expired DE3277756D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/249,262 US4442450A (en) 1981-03-30 1981-03-30 Cooling element for solder bonded semiconductor devices

Publications (1)

Publication Number Publication Date
DE3277756D1 true DE3277756D1 (en) 1988-01-07

Family

ID=22942702

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282101551T Expired DE3277756D1 (en) 1981-03-30 1982-03-01 Electronic package

Country Status (4)

Country Link
US (1) US4442450A (de)
EP (1) EP0061592B1 (de)
JP (1) JPS57166055A (de)
DE (1) DE3277756D1 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4415025A (en) * 1981-08-10 1983-11-15 International Business Machines Corporation Thermal conduction element for semiconductor devices
US4612601A (en) * 1983-11-30 1986-09-16 Nec Corporation Heat dissipative integrated circuit chip package
US4736236A (en) * 1984-03-08 1988-04-05 Olin Corporation Tape bonding material and structure for electronic circuit fabrication
US4688150A (en) * 1984-06-15 1987-08-18 Texas Instruments Incorporated High pin count chip carrier package
US4924353A (en) * 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
GB2214719B (en) * 1988-01-26 1991-07-24 Gen Electric Co Plc Housing for electronic device
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
US4962416A (en) * 1988-04-18 1990-10-09 International Business Machines Corporation Electronic package with a device positioned above a substrate by suction force between the device and heat sink
US4825337A (en) * 1988-05-17 1989-04-25 Prime Computer, Inc. Circuit board thermal contact device
US4970579A (en) * 1988-09-21 1990-11-13 International Business Machines Corp. Integrated circuit package with improved cooling means
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US4933747A (en) * 1989-03-27 1990-06-12 Motorola Inc. Interconnect and cooling system for a semiconductor device
US5175613A (en) * 1991-01-18 1992-12-29 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5202943A (en) * 1991-10-04 1993-04-13 International Business Machines Corporation Optoelectronic assembly with alignment member
US5289337A (en) * 1992-02-21 1994-02-22 Intel Corporation Heatspreader for cavity down multi-chip module with flip chip
US5159531A (en) * 1992-02-28 1992-10-27 International Business Machines Corporation Multiple radial finger contact cooling device
SE505163C2 (sv) * 1996-02-21 1997-07-07 Ericsson Telefon Ab L M Värmeledande anordning
US6226184B1 (en) * 1999-10-22 2001-05-01 Sun Microsystems, Inc. Enclosure mounted heat sink
DE10064194B4 (de) * 2000-12-22 2006-12-07 Infineon Technologies Ag Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls
US6870246B1 (en) * 2001-08-31 2005-03-22 Rambus Inc. Method and apparatus for providing an integrated circuit cover
US20040159935A1 (en) * 2003-02-14 2004-08-19 Prosenjit Ghosh Thermally optimized conductive block
JP4272169B2 (ja) * 2003-04-16 2009-06-03 富士通株式会社 電子部品パッケージ組立体およびプリント基板ユニット
TWI234257B (en) * 2003-06-30 2005-06-11 Advanced Semiconductor Eng Heat sink structure and chip package structure thereof
TWI268526B (en) * 2003-12-05 2006-12-11 Au Optronics Corp Plasma display
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
US7361985B2 (en) * 2004-10-27 2008-04-22 Freescale Semiconductor, Inc. Thermally enhanced molded package for semiconductors
WO2007065455A1 (en) * 2005-12-06 2007-06-14 Pirelli & C. S.P.A. Passive phase control in an external cavity laser
US20080073778A1 (en) * 2006-09-27 2008-03-27 Texas Instruments Incorporated Two-way heat extraction from packaged semiconductor chips
US7589971B2 (en) * 2006-10-10 2009-09-15 Deere & Company Reconfigurable heat sink assembly
US8259765B2 (en) * 2006-12-06 2012-09-04 Google Inc. Passive phase control in an external cavity laser
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
EP1990830A1 (de) 2007-04-12 2008-11-12 Siemens Aktiengesellschaft Halbleitermodul
JP2010199204A (ja) * 2009-02-24 2010-09-09 Sony Corp 発光装置およびその製造方法
US8053284B2 (en) * 2009-08-13 2011-11-08 International Business Machines Corporation Method and package for circuit chip packaging
US8537552B2 (en) * 2009-09-25 2013-09-17 Raytheon Company Heat sink interface having three-dimensional tolerance compensation
FR2995172B1 (fr) * 2012-09-06 2015-11-20 Sagemcom Broadband Sas Equipement electronique a refroidissement par air et dispositif de refroidissement d'un composant electronique
US9271427B2 (en) 2012-11-28 2016-02-23 Hamilton Sundstrand Corporation Flexible thermal transfer strips
US9939210B2 (en) * 2014-09-29 2018-04-10 International Business Machines Corporation Pin fin compliant heat sink with enhanced flexibility
US9668380B2 (en) * 2015-09-29 2017-05-30 Te Connectivity Corporation Conformable thermal bridge
US9823718B2 (en) * 2016-01-13 2017-11-21 Microsoft Technology Licensing, Llc Device cooling
US10631438B2 (en) * 2017-12-23 2020-04-21 International Business Machines Corporation Mechanically flexible cold plates for low power components
US11486661B2 (en) * 2020-05-28 2022-11-01 Te Connectivity Solutions Gmbh Thermal bridge for an electrical component

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL275274A (de) * 1961-11-21
US3896544A (en) * 1973-01-15 1975-07-29 Essex International Inc Method of making resilient electrical contact assembly for semiconductor devices
JPS5241146B2 (de) * 1974-01-30 1977-10-17
US4093971A (en) * 1976-12-10 1978-06-06 Burroughs Corporation D-I-P On island
US4203646A (en) * 1978-05-17 1980-05-20 Amp Incorporated Clip for electrically connecting planar elements, such as solar cells, and the like, in series
US4234666A (en) * 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4263965A (en) * 1980-01-21 1981-04-28 International Business Machines Corporation Leaved thermal cooling module

Also Published As

Publication number Publication date
EP0061592B1 (de) 1987-11-25
US4442450A (en) 1984-04-10
EP0061592A2 (de) 1982-10-06
JPH0231499B2 (de) 1990-07-13
JPS57166055A (en) 1982-10-13
EP0061592A3 (en) 1984-09-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee