DE3278193D1 - Method for fabricating multilayer laminated printed circuit boards - Google Patents

Method for fabricating multilayer laminated printed circuit boards

Info

Publication number
DE3278193D1
DE3278193D1 DE8282110815T DE3278193T DE3278193D1 DE 3278193 D1 DE3278193 D1 DE 3278193D1 DE 8282110815 T DE8282110815 T DE 8282110815T DE 3278193 T DE3278193 T DE 3278193T DE 3278193 D1 DE3278193 D1 DE 3278193D1
Authority
DE
Germany
Prior art keywords
printed circuit
circuit boards
multilayer laminated
laminated printed
fabricating multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282110815T
Other languages
English (en)
Inventor
Theron Larue Ellis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3278193D1 publication Critical patent/DE3278193D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
DE8282110815T 1981-11-27 1982-11-23 Method for fabricating multilayer laminated printed circuit boards Expired DE3278193D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/325,614 US4354895A (en) 1981-11-27 1981-11-27 Method for making laminated multilayer circuit boards

Publications (1)

Publication Number Publication Date
DE3278193D1 true DE3278193D1 (en) 1988-04-07

Family

ID=23268632

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282110815T Expired DE3278193D1 (en) 1981-11-27 1982-11-23 Method for fabricating multilayer laminated printed circuit boards

Country Status (4)

Country Link
US (1) US4354895A (de)
EP (1) EP0080689B1 (de)
JP (1) JPS5893399A (de)
DE (1) DE3278193D1 (de)

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US4421608A (en) * 1982-03-01 1983-12-20 International Business Machines Corporation Method for stripping peel apart conductive structures
CA1222574A (en) * 1982-03-04 1987-06-02 Economics Laboratory, Inc. Method and apparatus for manufacturing multi layer printed circuit boards
US4606787A (en) * 1982-03-04 1986-08-19 Etd Technology, Inc. Method and apparatus for manufacturing multi layer printed circuit boards
US4789423A (en) * 1982-03-04 1988-12-06 E. I. Du Pont De Nemours And Company Method for manufacturing multi-layer printed circuit boards
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
US4613313A (en) * 1983-12-27 1986-09-23 General Electric Company Ionization detector
US4613314A (en) * 1983-12-27 1986-09-23 General Electric Company Ionization detector
JPS60147192A (ja) * 1984-01-11 1985-08-03 株式会社日立製作所 プリント配線板の製造方法
US4628598A (en) * 1984-10-02 1986-12-16 The United States Of America As Represented By The Secretary Of The Air Force Mechanical locking between multi-layer printed wiring board conductors and through-hole plating
CA1283591C (en) * 1985-08-26 1991-04-30 Theron L. Ellis Method for making a flush surface laminate for a multilayer circuit board
US4927477A (en) * 1985-08-26 1990-05-22 International Business Machines Corporation Method for making a flush surface laminate for a multilayer circuit board
US4704791A (en) * 1986-03-05 1987-11-10 International Business Machines Corporation Process for providing a landless through-hole connection
US5324536A (en) * 1986-04-28 1994-06-28 Canon Kabushiki Kaisha Method of forming a multilayered structure
JPS63103075A (ja) * 1986-10-14 1988-05-07 エドワ−ド　アドラ− マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品
US4812191A (en) * 1987-06-01 1989-03-14 Digital Equipment Corporation Method of forming a multilevel interconnection device
US4969257A (en) * 1987-09-04 1990-11-13 Shinko Electric Industries, Co., Ltd. Transfer sheet and process for making a circuit substrate
US4954200A (en) * 1987-11-10 1990-09-04 The General Electric Company Method of making drill back-up material for small bore drilling of circuit boards
US4816616A (en) * 1987-12-10 1989-03-28 Microelectronics Center Of North Carolina Structure and method for isolated voltage referenced transmission lines of substrates with isolated reference planes
US4985601A (en) * 1989-05-02 1991-01-15 Hagner George R Circuit boards with recessed traces
US5156716A (en) * 1991-04-26 1992-10-20 Olin Corporation Process for the manufacture of a three layer tape for tape automated bonding
US5234536A (en) * 1991-04-26 1993-08-10 Olin Corporation Process for the manufacture of an interconnect circuit
US5246538A (en) * 1991-09-16 1993-09-21 Phillips Petroleum Company Adhesive bonding of poly(arylene sulfide) surfaces
JP2856240B2 (ja) * 1992-10-30 1999-02-10 インターナショナル・ビジネス・マシーンズ・コーポレイション プリント回路基板を再加工する方法
US5409567A (en) * 1994-04-28 1995-04-25 Motorola, Inc. Method of etching copper layers
EP2287897A3 (de) * 1996-05-27 2011-11-02 Dai Nippon Printing Co., Ltd. Schaltelement für ein Halbleiterbauelement, Halbleiterbauelement damit und Verfahren zur Herstellung dieses Schaltelements und dieses Halbleiterbauelementes
US5822856A (en) * 1996-06-28 1998-10-20 International Business Machines Corporation Manufacturing circuit board assemblies having filled vias
DE19829248A1 (de) * 1998-06-30 2000-01-05 Thomson Brandt Gmbh Verfahren zur Herstellung eines elektrotechnischen Bauteiles
US6946205B2 (en) * 2002-04-25 2005-09-20 Matsushita Electric Industrial Co., Ltd. Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
JP4125644B2 (ja) * 2002-07-05 2008-07-30 松下電器産業株式会社 多層回路基板の形成方法および多層回路基板
WO2004014114A1 (ja) * 2002-07-31 2004-02-12 Sony Corporation 素子内蔵基板の製造方法および素子内蔵基板、ならびに、プリント配線板の製造方法およびプリント配線板
US7282324B2 (en) * 2004-01-05 2007-10-16 Microchem Corp. Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them
KR20060045206A (ko) * 2004-11-12 2006-05-17 삼성테크윈 주식회사 반도체기판 제조방법
KR100733253B1 (ko) 2005-11-18 2007-06-27 삼성전기주식회사 고밀도 인쇄회로기판 및 그 제조방법
JP4697156B2 (ja) * 2007-02-28 2011-06-08 トヨタ自動車株式会社 回路基板の製造方法
TWI338562B (en) * 2007-12-27 2011-03-01 Unimicron Technology Corp Circuit board and process thereof
US20090273907A1 (en) * 2008-04-30 2009-11-05 Unimicron Technology Corp. Circuit board and process thereof
DE102009060480A1 (de) 2009-12-18 2011-06-22 Schweizer Electronic AG, 78713 Leiterstrukturelement und Verfahren zum Herstellen eines Leiterstrukturelements
US9398703B2 (en) 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
KR20160099381A (ko) * 2015-02-12 2016-08-22 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조 방법
JP2016207893A (ja) * 2015-04-24 2016-12-08 イビデン株式会社 プリント配線板およびその製造方法
US9706650B1 (en) 2016-08-18 2017-07-11 Sierra Circuits, Inc. Catalytic laminate apparatus and method
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
US9922951B1 (en) 2016-11-12 2018-03-20 Sierra Circuits, Inc. Integrated circuit wafer integration with catalytic laminate or adhesive
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2666008A (en) * 1950-08-03 1954-01-12 Stromberg Carlson Co Methods and apparatus for making conductive patterns of predetermined configuration
US3042591A (en) * 1957-05-20 1962-07-03 Motorola Inc Process for forming electrical conductors on insulating bases
US3177103A (en) * 1961-09-18 1965-04-06 Sauders Associates Inc Two pass etching for fabricating printed circuitry
GB994852A (en) * 1962-03-05 1965-06-10 Garlock Inc Improvements in or relating to insulated electric circuit assemblies
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
DE1615961A1 (de) * 1967-04-12 1970-06-25 Degussa Verfahren zur Herstellung von gedruckten Schaltungen
US3688396A (en) * 1969-10-13 1972-09-05 Texas Instruments Inc Circuit board process
US3791858A (en) * 1971-12-13 1974-02-12 Ibm Method of forming multi-layer circuit panels
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board

Also Published As

Publication number Publication date
JPS5893399A (ja) 1983-06-03
US4354895A (en) 1982-10-19
EP0080689A3 (en) 1985-11-06
EP0080689B1 (de) 1988-03-02
EP0080689A2 (de) 1983-06-08
JPS6317359B2 (de) 1988-04-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee