DE3379187D1 - Method and apparatus for forming a subsequent metallization pattern on a ceramic substrate - Google Patents

Method and apparatus for forming a subsequent metallization pattern on a ceramic substrate

Info

Publication number
DE3379187D1
DE3379187D1 DE8383103812T DE3379187T DE3379187D1 DE 3379187 D1 DE3379187 D1 DE 3379187D1 DE 8383103812 T DE8383103812 T DE 8383103812T DE 3379187 T DE3379187 T DE 3379187T DE 3379187 D1 DE3379187 D1 DE 3379187D1
Authority
DE
Germany
Prior art keywords
forming
ceramic substrate
metallization pattern
subsequent metallization
subsequent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383103812T
Other languages
English (en)
Inventor
Albert Amendola
Richard Gilbert Christensen
John Gerald Yereance
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3379187D1 publication Critical patent/DE3379187D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly
DE8383103812T 1982-09-07 1983-04-20 Method and apparatus for forming a subsequent metallization pattern on a ceramic substrate Expired DE3379187D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/415,051 US4474465A (en) 1982-09-07 1982-09-07 Method and apparatus for making a mask conforming to a ceramic substrate metallization pattern

Publications (1)

Publication Number Publication Date
DE3379187D1 true DE3379187D1 (en) 1989-03-16

Family

ID=23644162

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383103812T Expired DE3379187D1 (en) 1982-09-07 1983-04-20 Method and apparatus for forming a subsequent metallization pattern on a ceramic substrate

Country Status (4)

Country Link
US (1) US4474465A (de)
EP (1) EP0103671B1 (de)
JP (1) JPS5965849A (de)
DE (1) DE3379187D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4526859A (en) * 1983-12-12 1985-07-02 International Business Machines Corporation Metallization of a ceramic substrate
US4665468A (en) * 1984-07-10 1987-05-12 Nec Corporation Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the same
US4797714A (en) * 1988-01-07 1989-01-10 Olin Hunt Specialty Products, Inc. Master and master transport assembly registration system
US20150004308A1 (en) * 2013-06-27 2015-01-01 Gary B. Merrill Method for creating a textured bond coat surface
CN112552079B (zh) * 2019-09-26 2023-09-12 航天特种材料及工艺技术研究所 一种金属化陶瓷基复合材料及曲面金属化的方法
CN115635440B (zh) * 2022-12-26 2023-04-18 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种生瓷片带框孔壁金属化定位机构

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3264105A (en) * 1962-05-31 1966-08-02 Western Electric Co Method of using a master art drawing to produce a two-sided printed circuit board
US3192844A (en) * 1963-03-05 1965-07-06 Kulicke And Soffa Mfg Company Mask alignment fixture
US3558222A (en) * 1968-02-06 1971-01-26 Bell Telephone Labor Inc Photolithography apparatus and method
US3591284A (en) * 1968-05-27 1971-07-06 Solomon Liebman Printed circuit layout means
US3685117A (en) * 1970-05-12 1972-08-22 Jade Corp Alignment fixture
US3740225A (en) * 1970-08-31 1973-06-19 L Fiderer Method of making printed circuit boards
JPS498460A (de) * 1972-05-23 1974-01-25
US3945827A (en) * 1974-08-02 1976-03-23 Barry David Brown Methods of making printed circuit boards utilizing an image transparency mode with Herschel-effect film
US4004044A (en) * 1975-05-09 1977-01-18 International Business Machines Corporation Method for forming patterned films utilizing a transparent lift-off mask
JPS53159702U (de) * 1977-05-20 1978-12-14
US4206254A (en) * 1979-02-28 1980-06-03 International Business Machines Corporation Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern
US4251318A (en) * 1979-06-29 1981-02-17 Hutchinson Industrial Corporation Method of making fully etched type-carrier elements
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4346987A (en) * 1980-07-18 1982-08-31 Xerox Corporation Printed circuit board projection imaging system
US4388386A (en) * 1982-06-07 1983-06-14 International Business Machines Corporation Mask set mismatch

Also Published As

Publication number Publication date
EP0103671A2 (de) 1984-03-28
EP0103671B1 (de) 1989-02-08
EP0103671A3 (en) 1986-08-20
JPS5965849A (ja) 1984-04-14
US4474465A (en) 1984-10-02
JPH0369103B2 (de) 1991-10-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee