DE3582531D1 - Verfahren zur behandlung von metalloberflaechen. - Google Patents

Verfahren zur behandlung von metalloberflaechen.

Info

Publication number
DE3582531D1
DE3582531D1 DE8585304636T DE3582531T DE3582531D1 DE 3582531 D1 DE3582531 D1 DE 3582531D1 DE 8585304636 T DE8585304636 T DE 8585304636T DE 3582531 T DE3582531 T DE 3582531T DE 3582531 D1 DE3582531 D1 DE 3582531D1
Authority
DE
Germany
Prior art keywords
metal surfaces
treating metal
treating
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585304636T
Other languages
English (en)
Inventor
Akishi Nakaso
Youichi Kaneko
Toshiro Okamura
Kiyoshi Yamanoi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59135562A external-priority patent/JPS6115981A/ja
Priority claimed from JP59135561A external-priority patent/JPS6115980A/ja
Priority claimed from JP60015807A external-priority patent/JPS61173932A/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE3582531D1 publication Critical patent/DE3582531D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
DE8585304636T 1984-06-29 1985-06-28 Verfahren zur behandlung von metalloberflaechen. Expired - Lifetime DE3582531D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59135562A JPS6115981A (ja) 1984-06-29 1984-06-29 銅の表面処理法
JP59135561A JPS6115980A (ja) 1984-06-29 1984-06-29 銅の表面処理法
JP60015807A JPS61173932A (ja) 1985-01-30 1985-01-30 金属と樹脂層との積層体の製造法

Publications (1)

Publication Number Publication Date
DE3582531D1 true DE3582531D1 (de) 1991-05-23

Family

ID=27281148

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585304636T Expired - Lifetime DE3582531D1 (de) 1984-06-29 1985-06-28 Verfahren zur behandlung von metalloberflaechen.

Country Status (4)

Country Link
US (1) US4643793A (de)
EP (1) EP0170414B1 (de)
KR (1) KR890004583B1 (de)
DE (1) DE3582531D1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3530617A1 (de) * 1985-08-23 1987-02-26 Schering Ag Konditionierungsmittel fuer die behandlung von basismaterialien
US4818286A (en) * 1988-03-08 1989-04-04 International Business Machines Corporation Electroless copper plating bath
JPH0634448B2 (ja) * 1988-07-25 1994-05-02 株式会社日立製作所 多層プリント配線板及びその製造方法
EP0364132A1 (de) * 1988-09-29 1990-04-18 Shikoku Chemicals Corporation Verfahren zur Herstellung eines Konversionsüberzuges auf Oberflächen aus Kupfer oder Kupferlegierungen
US5059243A (en) * 1989-04-28 1991-10-22 International Business Machines Corporation Tetra aza ligand systems as complexing agents for electroless deposition of copper
EP0469470B1 (de) * 1990-07-30 1996-10-09 Mitsubishi Gas Chemical Company, Inc. Verfahren zur Herstellung von Mehrschichtplatinen
US5106454A (en) * 1990-11-01 1992-04-21 Shipley Company Inc. Process for multilayer printed circuit board manufacture
US5261154A (en) * 1991-07-22 1993-11-16 Macdermid, Incorporated Process for fabricating multilayer printed circuits
US5279651A (en) * 1992-12-18 1994-01-18 Exxon Research & Engineering Company Inorganic/organic inhibitor for corrosion of iron containing materials in sulfur environment
US5358825A (en) * 1993-03-24 1994-10-25 Amp-Akzo Corporation Manufacture of printed circuit conductors by a partially additive process
JPH07254550A (ja) * 1994-03-16 1995-10-03 Fujitsu Ltd アクリル系レジストの形成方法
US5711996A (en) * 1995-09-28 1998-01-27 Man-Gill Chemical Company Aqueous coating compositions and coated metal surfaces
US5554211A (en) * 1995-11-15 1996-09-10 Mcgean-Rohco, Inc. Aqueous electroless plating solutions
WO1997039610A1 (en) * 1996-04-18 1997-10-23 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
JP3909920B2 (ja) * 1997-07-24 2007-04-25 メック株式会社 銅および銅合金の表面処理法
JP3404286B2 (ja) * 1998-04-16 2003-05-06 日本パーカライジング株式会社 金属の表面処理方法、および該表面処理方法により得られた表面を有する金属部材
MY144503A (en) * 1998-09-14 2011-09-30 Ibiden Co Ltd Printed circuit board and method for its production
JP2001107258A (ja) * 1999-10-06 2001-04-17 Hitachi Ltd 無電解銅めっき方法とめっき装置および多層配線基板
US6645557B2 (en) 2001-10-17 2003-11-11 Atotech Deutschland Gmbh Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
KR101088568B1 (ko) * 2005-04-19 2011-12-05 아반토르 퍼포먼스 머티리얼스, 인크. 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼
WO2009047584A1 (en) * 2007-10-11 2009-04-16 Hatchtech Pty. Ltd. Combination compositions and methods of use of the same for controlling infestation
CN101851431B (zh) * 2009-03-31 2011-10-12 比亚迪股份有限公司 一种塑料组合物及塑料表面金属化方法
US20120061710A1 (en) * 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
US8632628B2 (en) * 2010-10-29 2014-01-21 Lam Research Corporation Solutions and methods for metal deposition
KR20130007124A (ko) * 2011-06-29 2013-01-18 삼성전자주식회사 유기 보호막을 갖는 조인트 구조
KR102124324B1 (ko) * 2018-11-14 2020-06-18 와이엠티 주식회사 도금 적층체 및 인쇄회로기판

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1301618A (fr) * 1961-02-13 1962-08-17 Clevite Corp Feuille de cuivre laminée, son procédé de fabrication et circuits imprimés munis de cette feuille
US3793038A (en) * 1973-01-02 1974-02-19 Crown City Plating Co Process for electroless plating
US4313995A (en) * 1976-11-08 1982-02-02 Fortin Laminating Corporation Circuit board and method for producing same
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution
US4388136A (en) * 1980-09-26 1983-06-14 Sperry Corporation Method of making a polyimide/glass hybrid printed circuit board
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution

Also Published As

Publication number Publication date
EP0170414B1 (de) 1991-04-17
EP0170414A3 (en) 1986-12-30
EP0170414A2 (de) 1986-02-05
KR860000411A (ko) 1986-01-28
US4643793A (en) 1987-02-17
KR890004583B1 (ko) 1989-11-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee