DE3687208D1 - Montage eines hybriden schaltkreises auf einer leiterplatte. - Google Patents

Montage eines hybriden schaltkreises auf einer leiterplatte.

Info

Publication number
DE3687208D1
DE3687208D1 DE8686304915T DE3687208T DE3687208D1 DE 3687208 D1 DE3687208 D1 DE 3687208D1 DE 8686304915 T DE8686304915 T DE 8686304915T DE 3687208 T DE3687208 T DE 3687208T DE 3687208 D1 DE3687208 D1 DE 3687208D1
Authority
DE
Germany
Prior art keywords
pcb
assembly
hybrid circuit
hybrid
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686304915T
Other languages
English (en)
Other versions
DE3687208T2 (de
Inventor
William E Berg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tektronix Inc
Original Assignee
Tektronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tektronix Inc filed Critical Tektronix Inc
Publication of DE3687208D1 publication Critical patent/DE3687208D1/de
Application granted granted Critical
Publication of DE3687208T2 publication Critical patent/DE3687208T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
DE8686304915T 1985-09-09 1986-06-25 Montage eines hybriden schaltkreises auf einer leiterplatte. Expired - Fee Related DE3687208T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/773,756 US4658330A (en) 1985-09-09 1985-09-09 Mounting a hybrid circuit to a circuit board

Publications (2)

Publication Number Publication Date
DE3687208D1 true DE3687208D1 (de) 1993-01-14
DE3687208T2 DE3687208T2 (de) 1993-07-01

Family

ID=25099219

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686304915T Expired - Fee Related DE3687208T2 (de) 1985-09-09 1986-06-25 Montage eines hybriden schaltkreises auf einer leiterplatte.

Country Status (4)

Country Link
US (1) US4658330A (de)
EP (1) EP0216447B1 (de)
JP (1) JPS6261338A (de)
DE (1) DE3687208T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4760335A (en) * 1985-07-30 1988-07-26 Westinghouse Electric Corp. Large scale integrated circuit test system
US4744008A (en) * 1986-11-18 1988-05-10 International Business Machines Corporation Flexible film chip carrier with decoupling capacitors
US4758927A (en) * 1987-01-21 1988-07-19 Tektronix, Inc. Method of mounting a substrate structure to a circuit board
US4950981A (en) * 1989-04-14 1990-08-21 Tektronix, Inc. Apparatus for testing a circuit board
DE4102265A1 (de) * 1991-01-26 1992-07-30 Telefunken Electronic Gmbh Gehaeuse kfz-elektronik
DE4417586A1 (de) * 1993-08-03 1995-02-09 Hewlett Packard Co Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern
US6008991A (en) * 1993-12-20 1999-12-28 Lsi Logic Corporation Electronic system including packaged integrated circuits with heat spreading standoff support members
US5410451A (en) * 1993-12-20 1995-04-25 Lsi Logic Corporation Location and standoff pins for chip on tape
US5923538A (en) * 1994-10-17 1999-07-13 Lsi Logic Corporation Support member for mounting a microelectronic circuit package
US5731542A (en) * 1996-05-23 1998-03-24 Motorola, Inc. Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
US10206288B2 (en) * 2015-08-13 2019-02-12 Palo Alto Research Center Incorporated Bare die integration with printed components on flexible substrate
US10165677B2 (en) 2015-12-10 2018-12-25 Palo Alto Research Center Incorporated Bare die integration with printed components on flexible substrate without laser cut
US10847384B2 (en) 2017-05-31 2020-11-24 Palo Alto Research Center Incorporated Method and fixture for chip attachment to physical objects

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4042861A (en) * 1973-11-08 1977-08-16 Citizen Watch Company Limited Mounting arrangement for an integrated circuit unit in an electronic digital watch
US4255003A (en) * 1975-11-13 1981-03-10 Tektronix, Inc. Electrical connector
US4251852A (en) * 1979-06-18 1981-02-17 International Business Machines Corporation Integrated circuit package
BE893780A (nl) * 1982-07-07 1983-01-07 Bell Telephone Mfg Samenstel van elektronische componenten
DE3378870D1 (en) * 1982-09-09 1989-02-09 Siemens Ag Cooling device for a plurality of integrated components assembled as a flat structure
EP0123676A4 (de) * 1982-11-09 1987-02-19 Silicon Connection Inc Verbindungszusammenbau und verfahren eines chips mit einem elektronischen schaltkreis.
WO1985000467A1 (en) * 1983-07-11 1985-01-31 Silicon Connection, Inc. Electronic circuit chip connection assembly and method

Also Published As

Publication number Publication date
EP0216447A3 (en) 1989-07-19
JPS6261338A (ja) 1987-03-18
JPH0453101B2 (de) 1992-08-25
DE3687208T2 (de) 1993-07-01
EP0216447B1 (de) 1992-12-02
US4658330A (en) 1987-04-14
EP0216447A2 (de) 1987-04-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee