DE3689406D1 - Verfahren zur Plazierung eines oberflächenmontierten Teiles und eine Vorrichtung dazu. - Google Patents

Verfahren zur Plazierung eines oberflächenmontierten Teiles und eine Vorrichtung dazu.

Info

Publication number
DE3689406D1
DE3689406D1 DE86110922T DE3689406T DE3689406D1 DE 3689406 D1 DE3689406 D1 DE 3689406D1 DE 86110922 T DE86110922 T DE 86110922T DE 3689406 T DE3689406 T DE 3689406T DE 3689406 D1 DE3689406 D1 DE 3689406D1
Authority
DE
Germany
Prior art keywords
placing
device therefor
mounted part
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE86110922T
Other languages
English (en)
Other versions
DE3689406T2 (de
Inventor
Kenji Suzuki
Seiji Hata
Yoshie Nishida
Kyoichi Kawasaki
Kenjiro Fujii
Yasunori Shimura
Shigenori Takeyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Ltd
Hitachi Keiyo Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60224852A external-priority patent/JPH0815240B2/ja
Priority claimed from JP61113586A external-priority patent/JPH0680954B2/ja
Application filed by Hitachi Ltd, Hitachi Keiyo Engineering Co Ltd filed Critical Hitachi Ltd
Publication of DE3689406D1 publication Critical patent/DE3689406D1/de
Application granted granted Critical
Publication of DE3689406T2 publication Critical patent/DE3689406T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
DE3689406T 1985-10-11 1986-08-07 Verfahren zur Plazierung eines oberflächenmontierten Teiles und eine Vorrichtung dazu. Expired - Fee Related DE3689406T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60224852A JPH0815240B2 (ja) 1985-10-11 1985-10-11 位置ずれ補正方法と面付け部品自動搭載方法
JP61113586A JPH0680954B2 (ja) 1986-05-20 1986-05-20 Ｉｃのプリント基板への搭載装置

Publications (2)

Publication Number Publication Date
DE3689406D1 true DE3689406D1 (de) 1994-01-27
DE3689406T2 DE3689406T2 (de) 1994-06-16

Family

ID=26452531

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3689406T Expired - Fee Related DE3689406T2 (de) 1985-10-11 1986-08-07 Verfahren zur Plazierung eines oberflächenmontierten Teiles und eine Vorrichtung dazu.

Country Status (3)

Country Link
US (1) US4737845A (de)
EP (1) EP0222072B1 (de)
DE (1) DE3689406T2 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4969199A (en) * 1986-02-28 1990-11-06 Kabushiki Kaisha Toshiba Apparatus for inspecting the molded case of an IC device
US4851902A (en) * 1986-10-29 1989-07-25 Electroplating Engineers Of Japan, Limited Auatomatic inspection system for IC lead frames and visual inspection method thereof
US4738025A (en) * 1986-12-23 1988-04-19 Northern Telecom Limited Automated apparatus and method for positioning multicontact component
US5490084A (en) * 1987-06-01 1996-02-06 Hitachi Techno Engineering Co., Ltd. Method and apparatus for detecting bent leads in electronic components
US4924304A (en) * 1987-11-02 1990-05-08 Mpm Corporation Video probe aligning of object to be acted upon
JPH01283993A (ja) * 1988-05-11 1989-11-15 Hitachi Ltd 回路プリント板、その面付け部品位置認識装置、及び面付け部品検査装置
CA1314085C (en) * 1988-05-25 1993-03-02 Andras G. Fule Linear interpolation for a component placement robot
US4914513A (en) * 1988-08-02 1990-04-03 Srtechnologies, Inc. Multi-vision component alignment system
CA1285661C (en) * 1988-08-19 1991-07-02 Randy Tsang Automatic visual measurement of surface mount device placement
US4947474A (en) * 1988-10-24 1990-08-07 Mathias Zirm Mechanism of observation and recording operation on an object
JPH02165699A (ja) * 1988-12-20 1990-06-26 Matsushita Electric Ind Co Ltd 産業用ロボットによるフラットパッケージ型ｉｃの装着方法
JP2710850B2 (ja) * 1989-03-27 1998-02-10 キヤノン株式会社 ワーク把持装置、ワーク及びその収納ケース
EP0425722A1 (de) * 1989-10-31 1991-05-08 Siemens Aktiengesellschaft Anordnung zur Lageerkennung von Anschlussbeinchen
US5157734A (en) * 1989-12-19 1992-10-20 Industrial Technology Research Institute Method and apparatus for picking and placing a surface mounted device with the aid of machine vision
US5033665A (en) * 1990-02-23 1991-07-23 Toddco General Soldering system and method of using same
US5137362A (en) * 1990-03-26 1992-08-11 Motorola, Inc. Automatic package inspection method
JPH0794976B2 (ja) * 1990-05-10 1995-10-11 松下電器産業株式会社 電子部品のリード浮きの検出方法
US5060063A (en) * 1990-07-30 1991-10-22 Mpm Corporation Viewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis
JPH04105341A (ja) * 1990-08-24 1992-04-07 Hitachi Ltd 半導体装置のリード曲がり、浮き検出方法及び検出装置
US5251266A (en) * 1990-08-27 1993-10-05 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly
US5235407A (en) * 1990-08-27 1993-08-10 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices
US5627913A (en) * 1990-08-27 1997-05-06 Sierra Research And Technology, Inc. Placement system using a split imaging system coaxially coupled to a component pickup means
US5317803A (en) * 1991-05-30 1994-06-07 Sierra Research And Technology, Inc. Method of soldering an integrated circuit
DE4119401C2 (de) * 1991-06-10 1998-07-23 Finetech Ges Fuer Elektronik T Vorrichtung zum Bestücken eines Schaltungsträgers mit elektronischen Bauelementen
US5489843A (en) * 1991-07-23 1996-02-06 Vlsi Technology, Inc. Apparatus and method for testing the calibration of electronic package lead inspection system
JPH0628473A (ja) * 1992-04-13 1994-02-04 Ezel Inc Ｉｃの傾き検出方法
US5298988A (en) * 1992-06-02 1994-03-29 Massachusetts Institute Of Technology Technique for aligning features on opposite surfaces of a substrate
JP2851022B2 (ja) * 1992-06-09 1999-01-27 株式会社鷹山 Ｉｃの傾き検査方法
JP2851023B2 (ja) * 1992-06-29 1999-01-27 株式会社鷹山 Ｉｃの傾き検査方法
US5652805A (en) * 1993-05-24 1997-07-29 Kabushiki Kaisha Komatsu Seisakusho Bending angle detector and straight line extracting device for use therewith and bending angle detecting position setting device
JP3295529B2 (ja) * 1994-05-06 2002-06-24 松下電器産業株式会社 Ｉｃ部品実装方法及び装置
KR100283851B1 (ko) * 1994-07-11 2001-04-02 기리야마 겐지 모니터 장치 및 모니터 방법
JPH08222898A (ja) * 1995-02-15 1996-08-30 Japan Tobacco Inc 部品装着順序決定方法
US5794329A (en) * 1995-02-27 1998-08-18 Mpm Corporation Support apparatus for circuit board
WO1996036921A1 (en) * 1995-05-19 1996-11-21 3Com Corporation Method and apparatus for linking computer aided design databases with a numerical control machine database
JP3215351B2 (ja) * 1997-04-30 2001-10-02 富士通株式会社 配置方式
US6084397A (en) * 1997-12-22 2000-07-04 Emc Corporation Verification gauge for an electronic package lead inspection apparatus
US6633663B1 (en) 1998-05-05 2003-10-14 International Business Machines Corporation Method and system for determining component dimensional information
AUPP924099A0 (en) * 1999-03-16 1999-04-15 Proteome Systems Ltd Method and apparatus for manipulating arrays
US20030021886A1 (en) * 2000-02-23 2003-01-30 Baele Stephen James Method of printing and printing machine
US6449531B1 (en) * 2000-08-25 2002-09-10 Advanced Micro Devices, Inc. System for batching integrated circuits in trays
DE10197043T1 (de) 2000-12-15 2003-11-13 Cyberoptics Corp Kamera mit verbessertem Illuminator
WO2002049410A2 (en) 2000-12-15 2002-06-20 Cyberoptics Corporation Board align image acquisition device with improved interface
JP2002204041A (ja) * 2000-12-27 2002-07-19 Alps Electric Co Ltd 電気部品の取付位置検出構造
US6546173B2 (en) * 2001-02-20 2003-04-08 Avanti Optics Corporation Optical module
US20040212802A1 (en) * 2001-02-20 2004-10-28 Case Steven K. Optical device with alignment compensation
US20020168147A1 (en) * 2001-02-20 2002-11-14 Case Steven K. Optical circuit pick and place machine
US6956999B2 (en) 2001-02-20 2005-10-18 Cyberoptics Corporation Optical device
US6546172B2 (en) * 2001-02-20 2003-04-08 Avanti Optics Corporation Optical device
JP4616514B2 (ja) * 2001-06-07 2011-01-19 富士機械製造株式会社 電気部品装着システムおよびそれにおける位置誤差検出方法
US7474781B2 (en) 2001-09-20 2009-01-06 International Business Machines Corporation Image based bar-code reading and robotic registration apparatus for use in automated tape library systems
US7269284B2 (en) 2001-09-20 2007-09-11 International Business Machines Corporation Method and apparatus using dual bounding boxes as dynamic templates for cartridge rack identification and tracking
US6980692B2 (en) * 2001-09-20 2005-12-27 International Business Machines Corporation Method and apparatus for dynamic thresholding of grayscale images to delineate image attributes
GB2408111A (en) * 2002-08-20 2005-05-18 Cyberoptics Corp Optical alignment mount with height adjustment
JP3966189B2 (ja) * 2003-02-27 2007-08-29 オムロン株式会社 基板検査方法およびこの方法を用いた基板検査装置
JP2005315767A (ja) * 2004-04-30 2005-11-10 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテープ用絶縁フィルムの検査方法、検査装置、該フィルムの打ち抜き加工装置及び該加工装置の制御方法
US9117107B2 (en) * 2004-08-12 2015-08-25 Bioscrypt, Inc. Device for biometrically controlling a face surface
CA2615316C (en) * 2004-08-12 2013-02-12 A4 Vision S.A. Device for contactlessly controlling the surface profile of objects
US7344273B2 (en) 2005-03-22 2008-03-18 Binary Works, Inc. Ring light with user manipulable control
US10763236B2 (en) * 2018-01-09 2020-09-01 Kulicke And Soffa Industries, Inc. Systems and methods of operating wire bonding machines including clamping systems

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56124001A (en) * 1980-03-05 1981-09-29 Hitachi Ltd Measuring method for position of tip of lead wire of electronic component
JPS5870110A (ja) * 1981-08-03 1983-04-26 マイクロコンポ−ネント　テクノロジ−　インコ−ポレ−テツド リ−ド整列状態検査装置
JPS6015780A (ja) * 1983-07-08 1985-01-26 Hitachi Ltd ロボット制御装置
DE3372673D1 (en) * 1983-09-23 1987-08-27 Ibm Deutschland Process and device for mutually aligning objects
US4628464A (en) * 1983-10-07 1986-12-09 Westinghouse Electric Corp. Robotic system for mounting electrical components
US4604648A (en) * 1984-10-12 1986-08-05 Kley Victor B Electronic viewing system for integrated circuit packages

Also Published As

Publication number Publication date
EP0222072B1 (de) 1993-12-15
US4737845A (en) 1988-04-12
DE3689406T2 (de) 1994-06-16
EP0222072A2 (de) 1987-05-20
EP0222072A3 (en) 1989-03-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HITACHI TECHNO ENGINEERING CO., LTD., TOKIO/TOKYO,

8339 Ceased/non-payment of the annual fee