DE3751502D1 - Elektrische oder elektronische Anordnung mit einer dünnen Schicht aus Polyimid. - Google Patents

Elektrische oder elektronische Anordnung mit einer dünnen Schicht aus Polyimid.

Info

Publication number
DE3751502D1
DE3751502D1 DE3751502T DE3751502T DE3751502D1 DE 3751502 D1 DE3751502 D1 DE 3751502D1 DE 3751502 T DE3751502 T DE 3751502T DE 3751502 T DE3751502 T DE 3751502T DE 3751502 D1 DE3751502 D1 DE 3751502D1
Authority
DE
Germany
Prior art keywords
polyimide
electrical
electronic device
thin layer
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3751502T
Other languages
English (en)
Other versions
DE3751502T2 (de
Inventor
Masakazu Uekita
Hiroshi Awaji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Application granted granted Critical
Publication of DE3751502D1 publication Critical patent/DE3751502D1/de
Publication of DE3751502T2 publication Critical patent/DE3751502T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403Cells and electrode assemblies
    • G01N27/414Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H01L21/02285Langmuir-Blodgett techniques
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • H01L21/28017Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28158Making the insulator
    • H01L21/28167Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/312Organic layers, e.g. photoresist
    • H01L21/3128Organic layers, e.g. photoresist by Langmuir-Blodgett techniques
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/51Insulating materials associated therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/92Capacitors with potential-jump barrier or surface barrier
    • H01L29/94Metal-insulator-semiconductors, e.g. MOS
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
DE3751502T 1986-03-11 1987-03-10 Elektrische oder elektronische Anordnung mit einer dünnen Schicht aus Polyimid. Expired - Fee Related DE3751502T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5408086 1986-03-11

Publications (2)

Publication Number Publication Date
DE3751502D1 true DE3751502D1 (de) 1995-10-12
DE3751502T2 DE3751502T2 (de) 1996-02-15

Family

ID=12960632

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3751502T Expired - Fee Related DE3751502T2 (de) 1986-03-11 1987-03-10 Elektrische oder elektronische Anordnung mit einer dünnen Schicht aus Polyimid.

Country Status (5)

Country Link
US (1) US5072262A (de)
EP (1) EP0237017B1 (de)
JP (2) JPS63124A (de)
CA (1) CA1256591A (de)
DE (1) DE3751502T2 (de)

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* Cited by examiner, † Cited by third party
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CA1256592A (en) * 1986-04-01 1989-06-27 Masakazu Uekita Electric-electronic device including polyimide thin film
CA1294731C (en) * 1986-04-25 1992-01-21 Masakazu Uekita Copolymeric and amphiphilic polyimide precursor, process for preparing the same and thin film
US4783395A (en) * 1987-02-17 1988-11-08 Hoechst Celanese Corporation Desensitizing solution for lithographic printing plates
JPS6418760U (de) * 1987-07-25 1989-01-30
JPH02140653A (ja) * 1988-11-21 1990-05-30 Kurabe:Kk 湿度検知素子
DE4017905A1 (de) * 1990-06-02 1991-12-05 Basf Ag Referenzelektrode fuer chemische sensoren
JP2814024B2 (ja) * 1990-06-07 1998-10-22 キヤノン株式会社 液晶素子
US5329485A (en) * 1990-11-01 1994-07-12 Olympus Optical Co., Ltd. Memory device
JPH05283542A (ja) * 1992-03-31 1993-10-29 Mitsubishi Electric Corp 半導体集積回路装置及びその製造方法
JP2709249B2 (ja) * 1992-12-25 1998-02-04 川崎製鉄株式会社 圧延油供給装置
US5408381A (en) * 1994-04-28 1995-04-18 Johnson Service Company Capacitance humidity sensor
US6372534B1 (en) 1995-06-06 2002-04-16 Lg. Philips Lcd Co., Ltd Method of making a TFT array with photo-imageable insulating layer over address lines
DE19712233C2 (de) * 1996-03-26 2003-12-11 Lg Philips Lcd Co Flüssigkristallanzeige und Herstellungsverfahren dafür
US6224787B1 (en) * 1997-03-10 2001-05-01 Dai Nippon Printing Co., Ltd. Liquid crystalline charge transport material
JPH1173158A (ja) * 1997-08-28 1999-03-16 Seiko Epson Corp 表示素子
US6551399B1 (en) * 2000-01-10 2003-04-22 Genus Inc. Fully integrated process for MIM capacitors using atomic layer deposition
TW507073B (en) * 2000-03-31 2002-10-21 Tdk Corp Humidity sensor and method for making
JP2002243689A (ja) * 2001-02-15 2002-08-28 Denso Corp 容量式湿度センサおよびその製造方法
KR100428002B1 (ko) * 2001-08-23 2004-04-30 (주)그라쎌 유기 고분자 게이트 절연막을 구비하는 유기 반도체트랜지스터의 제조 방법
US6962756B2 (en) * 2001-11-02 2005-11-08 Mitsubishi Gas Chemical Company, Inc. Transparent electrically-conductive film and its use
EP2204861A1 (de) * 2001-12-19 2010-07-07 Merck Patent GmbH Elektronische Geräte
TW544752B (en) * 2002-05-20 2003-08-01 Univ Nat Yunlin Sci & Tech Method for producing SnO2 gate ion sensitive field effect transistor (ISFET), and method and device for measuring the temperature parameters, drift and hysteresis values thereof
US7296458B2 (en) * 2002-10-17 2007-11-20 Advanced Technology Materials, Inc Nickel-coated free-standing silicon carbide structure for sensing fluoro or halogen species in semiconductor processing systems, and processes of making and using same
US7228724B2 (en) * 2002-10-17 2007-06-12 Advanced Technology Materials, Inc. Apparatus and process for sensing target gas species in semiconductor processing systems
US7080545B2 (en) * 2002-10-17 2006-07-25 Advanced Technology Materials, Inc. Apparatus and process for sensing fluoro species in semiconductor processing systems
US20060211253A1 (en) * 2005-03-16 2006-09-21 Ing-Shin Chen Method and apparatus for monitoring plasma conditions in an etching plasma processing facility
TWI306882B (en) * 2006-05-25 2009-03-01 Ind Tech Res Inst Thermoplastic polyimide composition and method of making double-sided flexible copper clad laminate using the same
JP2008072087A (ja) * 2006-08-16 2008-03-27 Kyoto Univ 半導体装置および半導体装置の製造方法、ならびに表示装置
JP4899033B2 (ja) * 2007-04-04 2012-03-21 株式会社やまびこ 送風作業機及び送風機のケーシング
EP2027459B1 (de) * 2007-04-05 2012-12-26 Micronas GmbH Feuchtesensor und verfahren zum messen der feuchte eines gasförmigen mediums
TWI410625B (zh) * 2008-12-31 2013-10-01 Ind Tech Res Inst 氣體感測材料及包含其之氣體感測器
US9134270B2 (en) * 2010-03-25 2015-09-15 Stichting Imec Nederland Amorphous thin film for sensing
US8710615B2 (en) * 2011-08-31 2014-04-29 Infineon Technologies Ag Semiconductor device with an amorphous semi-insulating layer, temperature sensor, and method of manufacturing a semiconductor device
JP6536592B2 (ja) * 2015-02-05 2019-07-03 富士通株式会社 ガスセンサ及びセンサ装置
CN107430086B (zh) 2015-03-10 2020-03-06 富士通株式会社 气体传感器以及传感器装置
DE102016204308A1 (de) * 2016-03-16 2017-09-21 Continental Automotive Gmbh Piezoelektrisches Aktuatorbauelement und Herstellungsverfahren zum Herstellen eines piezoelektrischen Aktuatorbauelementes
JP6770238B2 (ja) * 2017-03-31 2020-10-14 ミツミ電機株式会社 湿度センサ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1572181A (en) * 1975-08-18 1980-07-23 Ici Ltd Device comprising a thin film of organic materila
JPS5952822B2 (ja) * 1978-04-14 1984-12-21 東レ株式会社 耐熱性感光材料
JPS5839437B2 (ja) * 1978-08-24 1983-08-30 岩崎通信機株式会社 ボタン電話装置における本電話機接続方式
JPS60157354A (ja) 1984-01-26 1985-08-17 Matsushita Electric Ind Co Ltd 通信制御装置
JPS60197730A (ja) * 1984-03-21 1985-10-07 Ulvac Corp ポリイミド膜の形成方法
JPS60211836A (ja) * 1984-04-06 1985-10-24 Canon Inc パタ−ン形成方法
US4642665A (en) * 1984-12-19 1987-02-10 Eaton Corporation Vertically layered MOMOM tunnel device
JPS62143929A (ja) * 1985-07-16 1987-06-27 Kanegafuchi Chem Ind Co Ltd ポリイミド前駆体薄膜
CA1256592A (en) * 1986-04-01 1989-06-27 Masakazu Uekita Electric-electronic device including polyimide thin film
US4719281A (en) * 1986-04-21 1988-01-12 Hoechst Celanese Corporation Pendant quinodimethane-containing polymer
CA1302675C (en) * 1986-05-20 1992-06-09 Masakazu Uekita Thin film and device having the same

Also Published As

Publication number Publication date
JPS6312172A (ja) 1988-01-19
JPH0693508B2 (ja) 1994-11-16
EP0237017A3 (en) 1990-03-28
DE3751502T2 (de) 1996-02-15
US5072262A (en) 1991-12-10
JPS63124A (ja) 1988-01-05
EP0237017A2 (de) 1987-09-16
CA1256591A (en) 1989-06-27
EP0237017B1 (de) 1995-09-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee