DE3782201D1 - Halbleiterphotosensor und verfahren zu dessen herstellung. - Google Patents
Halbleiterphotosensor und verfahren zu dessen herstellung.Info
- Publication number
- DE3782201D1 DE3782201D1 DE8787306304T DE3782201T DE3782201D1 DE 3782201 D1 DE3782201 D1 DE 3782201D1 DE 8787306304 T DE8787306304 T DE 8787306304T DE 3782201 T DE3782201 T DE 3782201T DE 3782201 D1 DE3782201 D1 DE 3782201D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- semiconductor photosensor
- photosensor
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61166895A JPH0719893B2 (ja) | 1986-07-16 | 1986-07-16 | 光半導体装置 |
JP61166896A JPH07112050B2 (ja) | 1986-07-16 | 1986-07-16 | 光半導体装置 |
JP62006899A JP2765832B2 (ja) | 1987-01-14 | 1987-01-14 | 光半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3782201D1 true DE3782201D1 (de) | 1992-11-19 |
DE3782201T2 DE3782201T2 (de) | 1993-04-15 |
Family
ID=27277387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787306304T Expired - Fee Related DE3782201T2 (de) | 1986-07-16 | 1987-07-16 | Halbleiterphotosensor und verfahren zu dessen herstellung. |
Country Status (3)
Country | Link |
---|---|
US (2) | US5583076A (de) |
EP (1) | EP0253664B1 (de) |
DE (1) | DE3782201T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2683390A1 (fr) * | 1991-10-30 | 1993-05-07 | Sodern | Detecteur d'images a lumiere parasite reduite et application a un senseur de terre. |
JP3507251B2 (ja) | 1995-09-01 | 2004-03-15 | キヤノン株式会社 | 光センサicパッケージおよびその組立方法 |
JPH09148620A (ja) * | 1995-09-20 | 1997-06-06 | Sharp Corp | 光反射型検出器及びその製造方法 |
US6611610B1 (en) * | 1997-04-02 | 2003-08-26 | Gentex Corporation | Vehicle lamp control |
JP3173586B2 (ja) * | 1998-03-26 | 2001-06-04 | 日本電気株式会社 | 全モールド型固体撮像装置およびその製造方法 |
AU2170000A (en) * | 1998-12-22 | 2000-07-12 | Intel Corporation | Clearmold photosensor package having diffractive/refractive optical surfaces |
MXPA03001586A (es) * | 2000-08-22 | 2004-03-18 | Exxonmobil Chem Patents Inc | Fibras y telas de polipropileno. |
JP2003198897A (ja) * | 2001-12-27 | 2003-07-11 | Seiko Epson Corp | 光モジュール、回路基板及び電子機器 |
US6900508B2 (en) * | 2002-04-16 | 2005-05-31 | Stmicroelectronics, Inc. | Embedded flat film molding |
JP3934648B2 (ja) | 2002-05-15 | 2007-06-20 | 松下電器産業株式会社 | 光検出器、光ヘッド装置、光情報処理装置および光情報処理方法 |
JP4145612B2 (ja) * | 2002-08-30 | 2008-09-03 | ユーディナデバイス株式会社 | 光学多層膜及びそれを有する光半導体装置 |
US20050009239A1 (en) * | 2003-07-07 | 2005-01-13 | Wolff Larry Lee | Optoelectronic packaging with embedded window |
JP2005055327A (ja) * | 2003-08-05 | 2005-03-03 | Sony Corp | 指紋照合装置 |
WO2005031879A1 (de) * | 2003-09-26 | 2005-04-07 | Siemens Aktiengesellschaft | Optisches modul und optisches system |
US6943423B2 (en) * | 2003-10-01 | 2005-09-13 | Optopac, Inc. | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
US6864116B1 (en) * | 2003-10-01 | 2005-03-08 | Optopac, Inc. | Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof |
US7122874B2 (en) * | 2004-04-12 | 2006-10-17 | Optopac, Inc. | Electronic package having a sealing structure on predetermined area, and the method thereof |
US6943424B1 (en) | 2004-05-06 | 2005-09-13 | Optopac, Inc. | Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof |
US20060043513A1 (en) * | 2004-09-02 | 2006-03-02 | Deok-Hoon Kim | Method of making camera module in wafer level |
JP2006101479A (ja) * | 2004-09-02 | 2006-04-13 | Canon Inc | 固体撮像装置及びそれを用いたカメラ |
KR100498708B1 (ko) * | 2004-11-08 | 2005-07-01 | 옵토팩 주식회사 | 반도체 소자용 전자패키지 및 그 패키징 방법 |
DE102006014247B4 (de) * | 2006-03-28 | 2019-10-24 | Robert Bosch Gmbh | Bildaufnahmesystem und Verfahren zu dessen Herstellung |
US8084563B2 (en) * | 2006-07-07 | 2011-12-27 | Jsr Corporation | Cyclic olefin addition copolymer, process for production thereof, and retardation film obtained from the copolymer |
JP5276371B2 (ja) * | 2008-07-09 | 2013-08-28 | キヤノン株式会社 | 撮像装置 |
US10283538B2 (en) | 2016-02-17 | 2019-05-07 | Canon Kabshiki Kaisha | Imaging device and method of driving imaging device |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3622419A (en) * | 1969-10-08 | 1971-11-23 | Motorola Inc | Method of packaging an optoelectrical device |
US4203792A (en) * | 1977-11-17 | 1980-05-20 | Bell Telephone Laboratories, Incorporated | Method for the fabrication of devices including polymeric materials |
JPS572773A (en) * | 1980-06-06 | 1982-01-08 | Nippon Telegr & Teleph Corp <Ntt> | Recording system for gradation image |
JPS58192366A (ja) * | 1982-05-07 | 1983-11-09 | Hitachi Ltd | 受光素子内蔵集積回路装置 |
US4641418A (en) * | 1982-08-30 | 1987-02-10 | International Rectifier Corporation | Molding process for semiconductor devices and lead frame structure therefor |
US4504435A (en) * | 1982-10-04 | 1985-03-12 | Texas Instruments Incorporated | Method for semiconductor device packaging |
JPS5995504A (ja) * | 1982-11-24 | 1984-06-01 | Canon Inc | 合焦位置検出装置 |
JPH065760B2 (ja) * | 1983-02-14 | 1994-01-19 | 三洋電機株式会社 | 感 光 装 置 |
JPS59148872A (ja) * | 1983-02-15 | 1984-08-25 | Rion Co Ltd | 熱式風速計 |
IT1212711B (it) * | 1983-03-09 | 1989-11-30 | Ates Componenti Elettron | Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione. |
JPS6018941A (ja) * | 1983-07-12 | 1985-01-31 | Seiko Epson Corp | 半導体装置 |
US4685987A (en) * | 1983-09-02 | 1987-08-11 | The Bergquist Company | Method of preparing interfacings of heat sinks with electrical devices |
US4644384A (en) * | 1984-02-02 | 1987-02-17 | National Semiconductor Corporation | Apparatus and method for packaging eprom integrated circuits |
JPS60257546A (ja) * | 1984-06-04 | 1985-12-19 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
US4697074A (en) * | 1984-12-17 | 1987-09-29 | Sanyo Electric Co., Ltd. | Thermally improved photodetector having a roughened, recessed, raised or inclined light receiving surface |
JPS62244139A (ja) * | 1986-04-17 | 1987-10-24 | Citizen Watch Co Ltd | 樹脂封止型ピングリツドアレイ及びその製造方法 |
US4843036A (en) * | 1987-06-29 | 1989-06-27 | Eastman Kodak Company | Method for encapsulating electronic devices |
-
1987
- 1987-07-16 DE DE8787306304T patent/DE3782201T2/de not_active Expired - Fee Related
- 1987-07-16 EP EP87306304A patent/EP0253664B1/de not_active Expired - Lifetime
-
1995
- 1995-06-07 US US08/472,110 patent/US5583076A/en not_active Expired - Fee Related
-
1998
- 1998-01-26 US US09/013,031 patent/US5912504A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0253664A3 (en) | 1989-02-08 |
EP0253664B1 (de) | 1992-10-14 |
EP0253664A2 (de) | 1988-01-20 |
US5583076A (en) | 1996-12-10 |
DE3782201T2 (de) | 1993-04-15 |
US5912504A (en) | 1999-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |