DE3784130D1 - Kuehlung von objekten, zum beispiel halbleiteranordnungen. - Google Patents

Kuehlung von objekten, zum beispiel halbleiteranordnungen.

Info

Publication number
DE3784130D1
DE3784130D1 DE8787115294T DE3784130T DE3784130D1 DE 3784130 D1 DE3784130 D1 DE 3784130D1 DE 8787115294 T DE8787115294 T DE 8787115294T DE 3784130 T DE3784130 T DE 3784130T DE 3784130 D1 DE3784130 D1 DE 3784130D1
Authority
DE
Germany
Prior art keywords
example semiconductor
semiconductor arrangements
cooling objects
arrangements
objects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787115294T
Other languages
English (en)
Other versions
DE3784130T2 (de
Inventor
Katsuhide Fujitsu Ltd K Natori
Isao Fujitsu Ltd Kosu Watanabe
Koji Fujitsu Ltd Kos Katsuyama
Isao Fujitsu Ltd Kosu Kawamura
Haruhiko Fujitsu Ltd Yamamoto
Takeshi Fujitsu Ltd Kosu Nagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE3784130D1 publication Critical patent/DE3784130D1/de
Application granted granted Critical
Publication of DE3784130T2 publication Critical patent/DE3784130T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
DE8787115294T 1986-10-20 1987-10-19 Kuehlung von objekten, zum beispiel halbleiteranordnungen. Expired - Fee Related DE3784130T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61248801A JPH0770650B2 (ja) 1986-10-20 1986-10-20 半導体装置の冷却方法

Publications (2)

Publication Number Publication Date
DE3784130D1 true DE3784130D1 (de) 1993-03-25
DE3784130T2 DE3784130T2 (de) 1993-06-03

Family

ID=17183603

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787115294T Expired - Fee Related DE3784130T2 (de) 1986-10-20 1987-10-19 Kuehlung von objekten, zum beispiel halbleiteranordnungen.

Country Status (4)

Country Link
US (2) US5012858A (de)
EP (1) EP0264892B1 (de)
JP (1) JPH0770650B2 (de)
DE (1) DE3784130T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5225157A (en) * 1989-07-19 1993-07-06 Microelectronics And Computer Technology Corporation Amalgam composition for room temperature bonding
US5198189A (en) * 1989-08-03 1993-03-30 International Business Machines Corporation Liquid metal matrix thermal paste
US5173256A (en) * 1989-08-03 1992-12-22 International Business Machines Corporation Liquid metal matrix thermal paste
DE4019091A1 (de) * 1990-06-15 1991-12-19 Battelle Institut E V Waermeableitungseinrichtung fuer halbleiterbauelemente und verfahren zu deren herstellung
DE69117891T2 (de) * 1990-11-20 1996-07-25 Sumitomo Electric Industries Verfahren zum Montieren von Halbleiterelementen
US5146981A (en) * 1991-11-14 1992-09-15 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
WO1993016883A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
EP0563668A2 (de) * 1992-04-01 1993-10-06 Siemens Nixdorf Informationssysteme Aktiengesellschaft Einrichtung zum Kühlen von zu Flachbaugruppen zusammengefassten gehäuselosen integrierten Bausteinen
EP0608418B1 (de) 1992-05-20 1998-11-04 Seiko Epson Corporation Kassette für eine elektronische vorrichtung
US8213431B2 (en) * 2008-01-18 2012-07-03 The Boeing Company System and method for enabling wireless real time applications over a wide area network in high signal intermittence environments
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
US5399200A (en) * 1994-03-10 1995-03-21 Stauffer; Craig M. Module in an integrated delivery system for chemical vapors from liquid sources
US6065529A (en) * 1997-01-10 2000-05-23 Trw Inc. Embedded heat pipe structure
US6108208A (en) * 1997-12-08 2000-08-22 Unisys Corporation Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules
KR100310099B1 (ko) * 1998-08-20 2001-12-17 윤종용 반도체집적회로장치용방열장치및그것을구비하는휴대용컴퓨터
US6084775A (en) * 1998-12-09 2000-07-04 International Business Machines Corporation Heatsink and package structures with fusible release layer
US6085831A (en) * 1999-03-03 2000-07-11 International Business Machines Corporation Direct chip-cooling through liquid vaporization heat exchange
US6075702A (en) * 1999-05-26 2000-06-13 Hewlett-Packard Company Heat transfer device for a retention assembly
US6372997B1 (en) 2000-02-25 2002-04-16 Thermagon, Inc. Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
US6339120B1 (en) 2000-04-05 2002-01-15 The Bergquist Company Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
US6984685B2 (en) * 2000-04-05 2006-01-10 The Bergquist Company Thermal interface pad utilizing low melting metal with retention matrix
US6797758B2 (en) * 2000-04-05 2004-09-28 The Bergquist Company Morphing fillers and thermal interface materials
JP4241623B2 (ja) * 2003-02-24 2009-03-18 富士通株式会社 半導体装置および半導体装置の製造方法
JP4337648B2 (ja) * 2004-06-24 2009-09-30 株式会社ニコン Ｅｕｖ光源、ｅｕｖ露光装置、及び半導体デバイスの製造方法
JP4714434B2 (ja) * 2004-07-20 2011-06-29 古河スカイ株式会社 ヒートパイプヒートシンク
US20080099476A1 (en) * 2006-10-31 2008-05-01 Fung Duncan C Foldable ovenware container and method of production
JP6209376B2 (ja) * 2013-07-08 2017-10-04 株式会社日本マイクロニクス 電気的接続装置
CN116536547B (zh) * 2023-07-06 2023-10-27 有研工程技术研究院有限公司 一种橡皮泥状金属材料及其制备方法和应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3852803A (en) * 1973-06-18 1974-12-03 Gen Electric Heat sink cooled power semiconductor device assembly having liquid metal interface
EP0017472A1 (de) * 1979-04-06 1980-10-15 Lintott Engineering Limited Vakuumapparatur mit einer Vorrichtung zur Wärmeübertragung und Verfahren zur Herstellung von Halbleiterkomponenten unter Anwendung dieser Apparatus
US4313492A (en) * 1979-12-20 1982-02-02 International Business Machines Corporation Micro helix thermo capsule
US4446916A (en) * 1981-08-13 1984-05-08 Hayes Claude Q C Heat-absorbing heat sink
JPS58196041A (ja) * 1982-05-12 1983-11-15 Hitachi Ltd 熱伝達接続装置
JPS58199546A (ja) * 1982-05-17 1983-11-19 Hitachi Ltd 半導体冷却装置
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式
US4639829A (en) * 1984-06-29 1987-01-27 International Business Machines Corporation Thermal conduction disc-chip cooling enhancement means
US4649990A (en) * 1985-05-06 1987-03-17 Hitachi, Ltd. Heat-conducting cooling module
US4879632A (en) * 1985-10-04 1989-11-07 Fujitsu Limited Cooling system for an electronic circuit device

Also Published As

Publication number Publication date
EP0264892A2 (de) 1988-04-27
EP0264892B1 (de) 1993-02-10
EP0264892A3 (en) 1988-07-27
DE3784130T2 (de) 1993-06-03
US5012858A (en) 1991-05-07
JPH0770650B2 (ja) 1995-07-31
JPS63102345A (ja) 1988-05-07
US5024264A (en) 1991-06-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee