DE3787595T2 - Verfahren zum Entfernen von unerwünschten Teilchen von der Oberfläche eines Substrats. - Google Patents
Verfahren zum Entfernen von unerwünschten Teilchen von der Oberfläche eines Substrats.Info
- Publication number
- DE3787595T2 DE3787595T2 DE87201332T DE3787595T DE3787595T2 DE 3787595 T2 DE3787595 T2 DE 3787595T2 DE 87201332 T DE87201332 T DE 87201332T DE 3787595 T DE3787595 T DE 3787595T DE 3787595 T2 DE3787595 T2 DE 3787595T2
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- removing unwanted
- unwanted particles
- particles
- unwanted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002245 particle Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8601939A NL8601939A (nl) | 1986-07-28 | 1986-07-28 | Werkwijze voor het verwijderen van ongewenste deeltjes van een oppervlak van een substraat. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3787595D1 DE3787595D1 (de) | 1993-11-04 |
DE3787595T2 true DE3787595T2 (de) | 1994-03-24 |
Family
ID=19848356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE87201332T Expired - Fee Related DE3787595T2 (de) | 1986-07-28 | 1987-07-14 | Verfahren zum Entfernen von unerwünschten Teilchen von der Oberfläche eines Substrats. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4781764A (de) |
EP (1) | EP0255167B1 (de) |
JP (1) | JP2517607B2 (de) |
KR (1) | KR960013142B1 (de) |
DE (1) | DE3787595T2 (de) |
NL (1) | NL8601939A (de) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4962776A (en) * | 1987-03-26 | 1990-10-16 | Regents Of The University Of Minnesota | Process for surface and fluid cleaning |
US4964919A (en) * | 1988-12-27 | 1990-10-23 | Nalco Chemical Company | Cleaning of silicon wafers with an aqueous solution of KOH and a nitrogen-containing compound |
NL8900480A (nl) * | 1989-02-27 | 1990-09-17 | Philips Nv | Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. |
JPH047071A (ja) * | 1990-04-24 | 1992-01-10 | Ebara Res Co Ltd | 洗浄方法 |
ATE258084T1 (de) | 1991-10-04 | 2004-02-15 | Cfmt Inc | Superreinigung von komplizierten mikroteilchen |
JP2777498B2 (ja) * | 1991-12-06 | 1998-07-16 | 三菱電機株式会社 | 基板の洗浄方法 |
US5660642A (en) * | 1995-05-26 | 1997-08-26 | The Regents Of The University Of California | Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor |
US6045624A (en) * | 1996-09-27 | 2000-04-04 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
US20040007255A1 (en) * | 1997-06-20 | 2004-01-15 | Labib Mohamed Emam | Apparatus and method for cleaning pipelines, tubing and membranes using two-phase flow |
KR100452542B1 (ko) | 1998-04-14 | 2004-10-12 | 가부시끼가이샤가이죠 | 세정물 건조장치 및 건조방법 |
US6090217A (en) | 1998-12-09 | 2000-07-18 | Kittle; Paul A. | Surface treatment of semiconductor substrates |
EP1290720A1 (de) | 2000-06-16 | 2003-03-12 | Applied Materials, Inc. | Konfigurierbare integrierte mehrkammer-reinigungsvorrichtung zur nass-trocken-behandlung von einzelnen substraten |
US6899111B2 (en) * | 2001-06-15 | 2005-05-31 | Applied Materials, Inc. | Configurable single substrate wet-dry integrated cluster cleaner |
US6398875B1 (en) | 2001-06-27 | 2002-06-04 | International Business Machines Corporation | Process of drying semiconductor wafers using liquid or supercritical carbon dioxide |
US20030171239A1 (en) * | 2002-01-28 | 2003-09-11 | Patel Bakul P. | Methods and compositions for chemically treating a substrate using foam technology |
US20040031167A1 (en) | 2002-06-13 | 2004-02-19 | Stein Nathan D. | Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife |
US7913703B1 (en) | 2003-06-27 | 2011-03-29 | Lam Research Corporation | Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate |
US7799141B2 (en) | 2003-06-27 | 2010-09-21 | Lam Research Corporation | Method and system for using a two-phases substrate cleaning compound |
US7737097B2 (en) | 2003-06-27 | 2010-06-15 | Lam Research Corporation | Method for removing contamination from a substrate and for making a cleaning solution |
US8316866B2 (en) | 2003-06-27 | 2012-11-27 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
US8522801B2 (en) | 2003-06-27 | 2013-09-03 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
US7648584B2 (en) * | 2003-06-27 | 2010-01-19 | Lam Research Corporation | Method and apparatus for removing contamination from substrate |
US8323420B2 (en) | 2005-06-30 | 2012-12-04 | Lam Research Corporation | Method for removing material from semiconductor wafer and apparatus for performing the same |
US7416370B2 (en) | 2005-06-15 | 2008-08-26 | Lam Research Corporation | Method and apparatus for transporting a substrate using non-Newtonian fluid |
US8043441B2 (en) | 2005-06-15 | 2011-10-25 | Lam Research Corporation | Method and apparatus for cleaning a substrate using non-Newtonian fluids |
US7862662B2 (en) | 2005-12-30 | 2011-01-04 | Lam Research Corporation | Method and material for cleaning a substrate |
US7568490B2 (en) | 2003-12-23 | 2009-08-04 | Lam Research Corporation | Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids |
US8522799B2 (en) | 2005-12-30 | 2013-09-03 | Lam Research Corporation | Apparatus and system for cleaning a substrate |
US8070884B2 (en) * | 2005-04-01 | 2011-12-06 | Fsi International, Inc. | Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas enviroment including a drying enhancement substance |
EP2428557A1 (de) | 2005-12-30 | 2012-03-14 | LAM Research Corporation | Reinigungslösung |
US7897213B2 (en) | 2007-02-08 | 2011-03-01 | Lam Research Corporation | Methods for contained chemical surface treatment |
US8211846B2 (en) | 2007-12-14 | 2012-07-03 | Lam Research Group | Materials for particle removal by single-phase and two-phase media |
US8226774B2 (en) | 2008-09-30 | 2012-07-24 | Princeton Trade & Technology, Inc. | Method for cleaning passageways such an endoscope channels using flow of liquid and gas |
US8114221B2 (en) | 2008-09-30 | 2012-02-14 | Princeton Trade & Technology, Inc. | Method and composition for cleaning tubular systems employing moving three-phase contact lines |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1497779A1 (de) * | 1966-04-27 | 1969-10-02 | Helmut Schneider | Verfahren und Vorrichtung zur Erzeugung von Schall- oder Ultraschallwellen an Oberflaechen |
SU380754A1 (ru) * | 1969-04-08 | 1973-05-15 | Способ химического обезжиривания металлических поверхностей | |
US3664871A (en) * | 1970-03-30 | 1972-05-23 | Atlantic Richfield Co | Coating removal method |
JPS52125582A (en) * | 1975-03-12 | 1977-10-21 | Mitsui Mining & Smelting Co | Method of peeling other substance from plastics |
US4186032A (en) * | 1976-09-23 | 1980-01-29 | Rca Corp. | Method for cleaning and drying semiconductors |
US4118649A (en) * | 1977-05-25 | 1978-10-03 | Rca Corporation | Transducer assembly for megasonic cleaning |
US4178188A (en) * | 1977-09-14 | 1979-12-11 | Branson Ultrasonics Corporation | Method for cleaning workpieces by ultrasonic energy |
US4169807A (en) * | 1978-03-20 | 1979-10-02 | Rca Corporation | Novel solvent drying agent |
JPS5527032A (en) * | 1978-08-14 | 1980-02-26 | Fujitsu Ltd | Washing method by distilled liquid |
US4238244A (en) * | 1978-10-10 | 1980-12-09 | Halliburton Company | Method of removing deposits from surfaces with a gas agitated cleaning liquid |
US4375992A (en) * | 1980-12-24 | 1983-03-08 | Rca Corporation | Apparatus and method for cleaning recorded discs |
JPS58132934A (ja) * | 1982-02-03 | 1983-08-08 | Nec Corp | 半導体ウエハ−の水洗方法 |
JPS60223130A (ja) * | 1984-04-19 | 1985-11-07 | Sharp Corp | 基板の洗滌乾燥方法及びその装置 |
JPS6115334A (ja) * | 1984-07-02 | 1986-01-23 | Tasu Gijutsu Kenkyusho:Kk | 超音波洗浄方法 |
JPS6160799A (ja) * | 1984-08-31 | 1986-03-28 | 株式会社東芝 | 洗浄液 |
JPS6187338A (ja) * | 1984-10-05 | 1986-05-02 | Nec Corp | 多重ビ−ム照射Si表面ドライ洗浄法 |
JPS61228629A (ja) * | 1985-04-02 | 1986-10-11 | Mitsubishi Electric Corp | ウエハ等薄板体の表面処理装置 |
KR890001502B1 (ko) * | 1985-06-24 | 1989-05-06 | 씨.에프.엠 테크늘러지즈 인코포레이티드 | 반도체 웨이퍼 흐름 처리공정 및 그 장치 |
-
1986
- 1986-07-28 NL NL8601939A patent/NL8601939A/nl not_active Application Discontinuation
-
1987
- 1987-07-14 DE DE87201332T patent/DE3787595T2/de not_active Expired - Fee Related
- 1987-07-14 EP EP87201332A patent/EP0255167B1/de not_active Expired - Lifetime
- 1987-07-21 US US07/076,101 patent/US4781764A/en not_active Expired - Lifetime
- 1987-07-25 KR KR1019870008113A patent/KR960013142B1/ko not_active IP Right Cessation
- 1987-07-27 JP JP62185627A patent/JP2517607B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0255167B1 (de) | 1993-09-29 |
DE3787595D1 (de) | 1993-11-04 |
NL8601939A (nl) | 1988-02-16 |
EP0255167A2 (de) | 1988-02-03 |
EP0255167A3 (en) | 1989-06-28 |
KR960013142B1 (ko) | 1996-09-30 |
US4781764A (en) | 1988-11-01 |
JP2517607B2 (ja) | 1996-07-24 |
KR880002246A (ko) | 1988-04-29 |
JPS6336535A (ja) | 1988-02-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N |
|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |