DE3853413D1 - Verfahren und Kühlungsanordnung für ein Gehäuse einer integrierten Schaltung. - Google Patents
Verfahren und Kühlungsanordnung für ein Gehäuse einer integrierten Schaltung.Info
- Publication number
- DE3853413D1 DE3853413D1 DE3853413T DE3853413T DE3853413D1 DE 3853413 D1 DE3853413 D1 DE 3853413D1 DE 3853413 T DE3853413 T DE 3853413T DE 3853413 T DE3853413 T DE 3853413T DE 3853413 D1 DE3853413 D1 DE 3853413D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- circuit package
- cooling arrangement
- cooling
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09572—Solder filled plated through-hole in the final product
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8717920A FR2625038B1 (fr) | 1987-12-22 | 1987-12-22 | Procede et dispositif de refroidissement d'un boitier de circuit integre |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3853413D1 true DE3853413D1 (de) | 1995-04-27 |
DE3853413T2 DE3853413T2 (de) | 1995-09-21 |
Family
ID=9358156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3853413T Expired - Fee Related DE3853413T2 (de) | 1987-12-22 | 1988-12-19 | Verfahren und Kühlungsanordnung für ein Gehäuse einer integrierten Schaltung. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4924352A (de) |
EP (1) | EP0321899B1 (de) |
JP (1) | JPH022655A (de) |
CA (1) | CA1278878C (de) |
DE (1) | DE3853413T2 (de) |
FR (1) | FR2625038B1 (de) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2521546A1 (fr) | 1982-02-18 | 1983-08-19 | Centre Nat Rech Scient | Nouveaux verres halogenes, leur preparation et leur application |
US5043845A (en) * | 1989-10-16 | 1991-08-27 | Eastman Kodak Company | High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact |
US5058265A (en) * | 1990-05-10 | 1991-10-22 | Rockwell International Corporation | Method for packaging a board of electronic components |
JP3018554B2 (ja) * | 1991-04-25 | 2000-03-13 | 株式会社日立製作所 | 半導体モジュ−ル及びその製造方法 |
US5280409A (en) * | 1992-10-09 | 1994-01-18 | Sun Microsystems, Inc. | Heat sink and cover for tab integrated circuits |
US6205654B1 (en) * | 1992-12-11 | 2001-03-27 | Staktek Group L.P. | Method of manufacturing a surface mount package |
US5313099A (en) * | 1993-03-04 | 1994-05-17 | Square Head, Inc. | Heat sink assembly for solid state devices |
WO1994029900A1 (en) * | 1993-06-09 | 1994-12-22 | Lykat Corporation | Heat dissipative means for integrated circuit chip package |
US5467251A (en) * | 1993-10-08 | 1995-11-14 | Northern Telecom Limited | Printed circuit boards and heat sink structures |
AU3415095A (en) * | 1994-09-06 | 1996-03-27 | Sheldahl, Inc. | Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture |
US5581443A (en) * | 1994-09-14 | 1996-12-03 | Kabushiki Kaisha Toshiba | Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure |
US5784256A (en) * | 1994-09-14 | 1998-07-21 | Kabushiki Kaisha Toshiba | Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board |
US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
US5646826A (en) * | 1995-01-26 | 1997-07-08 | Northern Telecom Limited | Printed circuit board and heat sink arrangement |
US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
ATE203355T1 (de) * | 1995-06-27 | 2001-08-15 | Braun Gmbh | Wärmeleite-befestigung eines elektronischen leistungsbauelementes auf einer leiterplatte mit kühlblech |
EP0926733B1 (de) * | 1997-12-16 | 2004-03-17 | STMicroelectronics S.r.l. | Leiterplattenanordnung bestehend aus einem in einem Kunststoffgehäuse verpackten Leistungshalbleiterbauelement, dessen interne Wärmesenke mit einer externen Wärmesenke gelötet ist |
US6235991B1 (en) * | 1998-06-30 | 2001-05-22 | Lucent Technologies Inc. | Recessed mechanical fasteners for circuit boards |
US6674163B1 (en) * | 1998-08-18 | 2004-01-06 | Oki Electric Industry Co., Ltd. | Package structure for a semiconductor device |
JP3602968B2 (ja) * | 1998-08-18 | 2004-12-15 | 沖電気工業株式会社 | 半導体装置およびその基板接続構造 |
EP1014767A1 (de) * | 1998-12-23 | 2000-06-28 | Lucent Technologies Inc. | Entlastung thermischer Spannungen für oberflächenmontierte Bauelemente unter Verwendung der Füllung von Durchgangslöchern |
GB2345576A (en) * | 1999-01-05 | 2000-07-12 | Ericsson Telefon Ab L M | Heat-sink of ICs and method of mounting to PCBs |
US6294742B1 (en) * | 1999-07-27 | 2001-09-25 | Agilent Technologies, Inc. | Apparatus and method for adapting surface mount solder pad for heat sink function |
US6572387B2 (en) | 1999-09-24 | 2003-06-03 | Staktek Group, L.P. | Flexible circuit connector for stacked chip module |
JP3573034B2 (ja) * | 1999-11-17 | 2004-10-06 | 日本電気株式会社 | 多層プリント配線板およびその放熱構造 |
US6304451B1 (en) | 1999-12-01 | 2001-10-16 | Tyco Electronics Logistics Ag | Reverse mount heat sink assembly |
GB9929800D0 (en) * | 1999-12-17 | 2000-02-09 | Pace Micro Tech Plc | Heat dissipation in electrical apparatus |
US6293331B1 (en) | 2000-08-11 | 2001-09-25 | Tyco Electronics Logistics Ag | Vibration and shock resistant heat sink assembly |
US6608763B1 (en) | 2000-09-15 | 2003-08-19 | Staktek Group L.P. | Stacking system and method |
US6343012B1 (en) | 2000-11-13 | 2002-01-29 | Tyco Electronics Logistis Ag | Heat dissipation device with threaded fan module |
US6462408B1 (en) | 2001-03-27 | 2002-10-08 | Staktek Group, L.P. | Contact member stacking system and method |
US6683787B1 (en) | 2002-02-14 | 2004-01-27 | Mercury Computer Systems, Inc. | Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks |
US6759588B1 (en) | 2002-02-14 | 2004-07-06 | Mercury Computer Systems, Inc. | Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover |
US6661657B1 (en) | 2002-02-14 | 2003-12-09 | Mercury Computer Systems, Inc. | Circuit board assembly for use in a central inlet chassis configuration |
US6879486B1 (en) | 2002-02-14 | 2005-04-12 | Mercury Computer Systems, Inc. | Central inlet circuit board assembly |
US6781831B1 (en) | 2002-02-14 | 2004-08-24 | Mercury Computer Systems, Inc. | Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers |
US6690575B1 (en) | 2002-02-14 | 2004-02-10 | Mercury Computer Systems, Inc. | Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies |
US6697255B1 (en) | 2002-02-14 | 2004-02-24 | Mercury Computer Systems, Inc. | Circuit board assembly with integrated shaping and control of flow resistance curve |
US7461690B2 (en) * | 2005-09-27 | 2008-12-09 | Delphi Technologies, Inc. | Optimally shaped spreader plate for electronics cooling assembly |
DE102007037297A1 (de) * | 2007-08-07 | 2009-02-19 | Continental Automotive Gmbh | Schaltungsträgeraufbau mit verbesserter Wärmeableitung |
US8248803B2 (en) * | 2010-03-31 | 2012-08-21 | Hong Kong Applied Science and Technology Research Institute Company Limited | Semiconductor package and method of manufacturing the same |
US8929077B2 (en) | 2012-01-02 | 2015-01-06 | Tem Products Inc. | Thermal connector |
FR2999864A1 (fr) * | 2012-12-19 | 2014-06-20 | Valeo Systemes Thermiques | Dispositif de refroidissement pour carte de circuit imprime |
CH708881B1 (de) * | 2013-11-20 | 2017-06-15 | Besi Switzerland Ag | Durchlaufofen für Substrate, die mit Bauteilen bestückt werden, und Die Bonder. |
JP2018101661A (ja) * | 2016-12-19 | 2018-06-28 | 新電元工業株式会社 | 実装基板及び発熱部品実装モジュール |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1414466A1 (de) * | 1955-10-08 | 1969-09-04 | Telefunken Patent | Halbleitergeraet |
GB1084028A (en) * | 1965-11-29 | 1967-09-20 | Standard Telephones Cables Ltd | A method of soldering a semiconductor chip to a backing plate |
US4420767A (en) * | 1978-11-09 | 1983-12-13 | Zilog, Inc. | Thermally balanced leadless microelectronic circuit chip carrier |
EP0023534A3 (de) * | 1979-08-06 | 1982-04-28 | Teccor Electronics, Inc. | Montagestruktur einer Halbleiteranordnung und Verfahren zum Montieren |
US4628407A (en) * | 1983-04-22 | 1986-12-09 | Cray Research, Inc. | Circuit module with enhanced heat transfer and distribution |
GB8324839D0 (en) * | 1983-09-16 | 1983-10-19 | Lucas Ind Plc | Mounting carrier for microelectronic silicon chip |
US4682269A (en) * | 1984-10-11 | 1987-07-21 | Teradyne, Inc. | Heat dissipation for electronic components on a ceramic substrate |
DE3570343D1 (en) * | 1984-10-31 | 1989-06-22 | Contraves Ag | Arrangement for the tension compensation and the heat dissipation of an electronic component |
-
1987
- 1987-12-22 FR FR8717920A patent/FR2625038B1/fr not_active Expired - Fee Related
-
1988
- 1988-12-19 EP EP88121209A patent/EP0321899B1/de not_active Expired - Lifetime
- 1988-12-19 DE DE3853413T patent/DE3853413T2/de not_active Expired - Fee Related
- 1988-12-20 CA CA000586393A patent/CA1278878C/fr not_active Expired - Fee Related
- 1988-12-20 JP JP63321855A patent/JPH022655A/ja active Pending
- 1988-12-21 US US07/287,251 patent/US4924352A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE3853413T2 (de) | 1995-09-21 |
FR2625038B1 (fr) | 1990-08-17 |
FR2625038A1 (fr) | 1989-06-23 |
EP0321899A1 (de) | 1989-06-28 |
US4924352A (en) | 1990-05-08 |
CA1278878C (fr) | 1991-01-08 |
EP0321899B1 (de) | 1995-03-22 |
JPH022655A (ja) | 1990-01-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |