DE3855324T2 - Vorrichtung zum Positionieren eines Wafers - Google Patents

Vorrichtung zum Positionieren eines Wafers

Info

Publication number
DE3855324T2
DE3855324T2 DE3855324T DE3855324T DE3855324T2 DE 3855324 T2 DE3855324 T2 DE 3855324T2 DE 3855324 T DE3855324 T DE 3855324T DE 3855324 T DE3855324 T DE 3855324T DE 3855324 T2 DE3855324 T2 DE 3855324T2
Authority
DE
Germany
Prior art keywords
wafer
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3855324T
Other languages
English (en)
Other versions
DE3855324D1 (de
Inventor
Kazuo Shimane
Nobuo Iijima
Tatsuro Kawabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE3855324D1 publication Critical patent/DE3855324D1/de
Application granted granted Critical
Publication of DE3855324T2 publication Critical patent/DE3855324T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D3/00—Control of position or direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
DE3855324T 1987-10-20 1988-10-20 Vorrichtung zum Positionieren eines Wafers Expired - Fee Related DE3855324T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62262736A JPH0620097B2 (ja) 1987-10-20 1987-10-20 ウエハ位置決め装置

Publications (2)

Publication Number Publication Date
DE3855324D1 DE3855324D1 (de) 1996-07-04
DE3855324T2 true DE3855324T2 (de) 1996-10-10

Family

ID=17379870

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3855324T Expired - Fee Related DE3855324T2 (de) 1987-10-20 1988-10-20 Vorrichtung zum Positionieren eines Wafers

Country Status (5)

Country Link
US (1) US4955780A (de)
EP (1) EP0313466B1 (de)
JP (1) JPH0620097B2 (de)
KR (1) KR910007106B1 (de)
DE (1) DE3855324T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
JP2986121B2 (ja) * 1991-03-26 1999-12-06 東京エレクトロン株式会社 ロードロック装置及び真空処理装置
JPH04298060A (ja) * 1991-03-26 1992-10-21 Tokyo Electron Ltd ウエハの位置合わせ装置
TW201364B (de) * 1991-04-09 1993-03-01 Ito Co Ltd
DE69329269T2 (de) * 1992-11-12 2000-12-28 Applied Materials Inc System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum
US5443358A (en) * 1993-04-30 1995-08-22 Burton Industries, Inc. Indexing part loader
US6624433B2 (en) * 1994-02-22 2003-09-23 Nikon Corporation Method and apparatus for positioning substrate and the like
US5700046A (en) * 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
US5768125A (en) * 1995-12-08 1998-06-16 Asm International N.V. Apparatus for transferring a substantially circular article
JPH09321102A (ja) * 1996-05-31 1997-12-12 Tokyo Electron Ltd 検査装置
US6007292A (en) * 1998-02-11 1999-12-28 Crandell; Rod Work piece transfer apparatus
WO1999052686A1 (en) * 1998-04-16 1999-10-21 Genmark Automation, Inc. Substrate prealigner
US6298280B1 (en) * 1998-09-28 2001-10-02 Asyst Technologies, Inc. Method for in-cassette wafer center determination
US6188323B1 (en) * 1998-10-15 2001-02-13 Asyst Technologies, Inc. Wafer mapping system
US6300644B1 (en) 1998-12-21 2001-10-09 Microtool, Inc. Tool for aligning a robot arm to a cassette for holding semiconductor wafers
US6075334A (en) * 1999-03-15 2000-06-13 Berkeley Process Control, Inc Automatic calibration system for wafer transfer robot
US6332751B1 (en) * 1999-04-02 2001-12-25 Tokyo Electron Limited Transfer device centering method and substrate processing apparatus
US6275742B1 (en) 1999-04-16 2001-08-14 Berkeley Process Control, Inc. Wafer aligner system
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
US6516244B1 (en) 2000-08-25 2003-02-04 Wafermasters, Inc. Wafer alignment system and method
US6591161B2 (en) 2001-01-31 2003-07-08 Wafermasters, Inc. Method for determining robot alignment
US7008802B2 (en) 2001-05-29 2006-03-07 Asm America, Inc. Method and apparatus to correct water drift
JP4260423B2 (ja) * 2002-05-30 2009-04-30 ローツェ株式会社 円盤状物の基準位置教示方法、位置決め方法および搬送方法並びに、それらの方法を使用する円盤状物の基準位置教示装置、位置決め装置、搬送装置および半導体製造設備
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
KR101015778B1 (ko) * 2003-06-03 2011-02-22 도쿄엘렉트론가부시키가이샤 기판 처리장치 및 기판 수수 위치의 조정 방법
EP1489425B1 (de) * 2003-06-20 2007-02-14 Tecan Trading AG Vorrichtung und Verfahren zum Positionieren von Funktionselementen und/oder Behältern auf dem Arbeitsfeld eines Labormanipulators mittels zweier sich kreuzender Lichtschranken
US8041450B2 (en) 2007-10-04 2011-10-18 Asm Japan K.K. Position sensor system for substrate transfer robot
KR101489963B1 (ko) 2007-12-13 2015-02-04 한국에이에스엠지니텍 주식회사 박막 증착 장치 및 이를 이용한 증착 방법
US8273178B2 (en) 2008-02-28 2012-09-25 Asm Genitech Korea Ltd. Thin film deposition apparatus and method of maintaining the same
US7963736B2 (en) 2008-04-03 2011-06-21 Asm Japan K.K. Wafer processing apparatus with wafer alignment device
US9196518B1 (en) 2013-03-15 2015-11-24 Persimmon Technologies, Corp. Adaptive placement system and method
KR102469258B1 (ko) 2014-11-18 2022-11-22 퍼시몬 테크놀로지스 코포레이션 엔드 이펙터 위치 추정을 위한 로봇의 적응형 배치 시스템
US10145672B2 (en) 2017-01-24 2018-12-04 Lithoptek LLC Detection of position, orientation and scale of work pieces using retroreflective surfaces

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU474435A1 (ru) * 1973-04-12 1975-06-25 Государственный Научно-Исследовательский Институт Машиноведения Очувствленный робот
US3820647A (en) * 1973-09-14 1974-06-28 Texas Instruments Inc Slice pre aligner
US4024944A (en) * 1975-12-24 1977-05-24 Texas Instruments Incorporated Semiconductor slice prealignment system
US4376581A (en) * 1979-12-20 1983-03-15 Censor Patent- Und Versuchs-Anstalt Method of positioning disk-shaped workpieces, preferably semiconductor wafers
US4483654A (en) * 1981-02-13 1984-11-20 Lam Research Corporation Workpiece transfer mechanism
JPS5946026A (ja) * 1982-09-09 1984-03-15 Toshiba Corp 試料位置測定方法
US4633419A (en) * 1983-03-07 1986-12-30 Asahi Kogaku Kogyo K.K. Angle measuring device
JPS59172244A (ja) * 1983-03-22 1984-09-28 Nippon Telegr & Teleph Corp <Ntt> 円板形状体の切欠検出方法
JPS6085536A (ja) * 1983-10-17 1985-05-15 Hitachi Ltd ウエハ位置決め装置
US4584045A (en) * 1984-02-21 1986-04-22 Plasma-Therm, Inc. Apparatus for conveying a semiconductor wafer
JPS61184841A (ja) * 1985-02-13 1986-08-18 Canon Inc ウエハの位置決め方法および装置
JPS6220343A (ja) * 1985-07-19 1987-01-28 Hitachi Ltd ウエハ位置決め装置
JPS6276643A (ja) * 1985-09-30 1987-04-08 Mitaka Koki Kk ウエハの非接触位置決め装置
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer

Also Published As

Publication number Publication date
DE3855324D1 (de) 1996-07-04
EP0313466A2 (de) 1989-04-26
JPH0620097B2 (ja) 1994-03-16
EP0313466A3 (en) 1990-09-05
KR910007106B1 (ko) 1991-09-18
KR890007145A (ko) 1989-06-19
JPH01106440A (ja) 1989-04-24
EP0313466B1 (de) 1996-05-29
US4955780A (en) 1990-09-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee