DE3856202D1 - Triamin-Entschichtungslösung für positive Photolacke - Google Patents

Triamin-Entschichtungslösung für positive Photolacke

Info

Publication number
DE3856202D1
DE3856202D1 DE3856202T DE3856202T DE3856202D1 DE 3856202 D1 DE3856202 D1 DE 3856202D1 DE 3856202 T DE3856202 T DE 3856202T DE 3856202 T DE3856202 T DE 3856202T DE 3856202 D1 DE3856202 D1 DE 3856202D1
Authority
DE
Germany
Prior art keywords
triamine
stripping solution
positive photoresists
organic photoresist
positive organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3856202T
Other languages
English (en)
Other versions
DE3856202T2 (de
Inventor
Wai Mun Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EKC Technology Inc
Original Assignee
EKC Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EKC Technology Inc filed Critical EKC Technology Inc
Application granted granted Critical
Publication of DE3856202D1 publication Critical patent/DE3856202D1/de
Publication of DE3856202T2 publication Critical patent/DE3856202T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
DE3856202T 1987-07-30 1988-07-20 Triamin-Entschichtungslösung für positive Photolacke Expired - Fee Related DE3856202T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/079,714 US4824763A (en) 1987-07-30 1987-07-30 Triamine positive photoresist stripping composition and prebaking process

Publications (2)

Publication Number Publication Date
DE3856202D1 true DE3856202D1 (de) 1998-07-16
DE3856202T2 DE3856202T2 (de) 1998-10-22

Family

ID=22152327

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3856553T Expired - Lifetime DE3856553T2 (de) 1987-07-30 1988-07-20 Wärmebehandlungsverfahren zum Erleichtern der Entfernung eines positiven Photoresists mit Entschichtungslösungen
DE3856202T Expired - Fee Related DE3856202T2 (de) 1987-07-30 1988-07-20 Triamin-Entschichtungslösung für positive Photolacke

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE3856553T Expired - Lifetime DE3856553T2 (de) 1987-07-30 1988-07-20 Wärmebehandlungsverfahren zum Erleichtern der Entfernung eines positiven Photoresists mit Entschichtungslösungen

Country Status (7)

Country Link
US (2) US4824763A (de)
EP (2) EP0301756B1 (de)
JP (2) JP2930956B2 (de)
KR (1) KR890003003A (de)
AT (2) ATE167310T1 (de)
DE (2) DE3856553T2 (de)
HK (2) HK1012166A1 (de)

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US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US20040018949A1 (en) * 1990-11-05 2004-01-29 Wai Mun Lee Semiconductor process residue removal composition and process
US7205265B2 (en) * 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US6110881A (en) * 1990-11-05 2000-08-29 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US6121217A (en) 1990-11-05 2000-09-19 Ekc Technology, Inc. Alkanolamine semiconductor process residue removal composition and process
US6546939B1 (en) 1990-11-05 2003-04-15 Ekc Technology, Inc. Post clean treatment
US6242400B1 (en) 1990-11-05 2001-06-05 Ekc Technology, Inc. Method of stripping resists from substrates using hydroxylamine and alkanolamine
US6187730B1 (en) 1990-11-05 2001-02-13 Ekc Technology, Inc. Hydroxylamine-gallic compound composition and process
US6000411A (en) * 1990-11-05 1999-12-14 Ekc Technology, Inc. Cleaning compositions for removing etching residue and method of using
DE69333877T2 (de) * 1992-07-09 2006-06-14 Ekc Technology Inc Reinigungsmittelzusammensetzung, das einem Redox Aminverbindung enthält
EP0605089B1 (de) * 1992-11-03 1999-01-07 International Business Machines Corporation Photolackzusammensetzung
JP2688168B2 (ja) 1992-11-03 1997-12-08 インターナショナル・ビジネス・マシーンズ・コーポレイション フォトレジストイメージ形成プロセス
JPH06204162A (ja) * 1992-12-28 1994-07-22 Mitsubishi Electric Corp 半導体装置の製造方法および該方法に用いられるレジスト組成物
JP2823768B2 (ja) * 1993-02-22 1998-11-11 松下電器産業株式会社 半導体装置の製造方法
US7144849B2 (en) * 1993-06-21 2006-12-05 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
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US5545353A (en) * 1995-05-08 1996-08-13 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
KR0154164B1 (ko) * 1994-07-11 1998-12-01 김주용 반도체소자의 제조방법
US5670376A (en) * 1994-12-14 1997-09-23 Lucent Technologies Inc. Methodology for monitoring solvent quality
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US5648324A (en) * 1996-01-23 1997-07-15 Ocg Microelectronic Materials, Inc. Photoresist stripping composition
US5741368A (en) * 1996-01-30 1998-04-21 Silicon Valley Chemlabs Dibasic ester stripping composition
US6511547B1 (en) 1996-01-30 2003-01-28 Siliconvalley Chemlabs, Inc. Dibasic ester stripping composition
US5909744A (en) * 1996-01-30 1999-06-08 Silicon Valley Chemlabs, Inc. Dibasic ester stripping composition
US5904570A (en) * 1996-05-20 1999-05-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method for polymer removal after etching
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6030932A (en) 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
US5798323A (en) * 1997-05-05 1998-08-25 Olin Microelectronic Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6268323B1 (en) 1997-05-05 2001-07-31 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6432209B2 (en) * 1998-03-03 2002-08-13 Silicon Valley Chemlabs Composition and method for removing resist and etching residues using hydroxylazmmonium carboxylates
US7135445B2 (en) * 2001-12-04 2006-11-14 Ekc Technology, Inc. Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials
US6368421B1 (en) 1998-07-10 2002-04-09 Clariant Finance (Bvi) Limited Composition for stripping photoresist and organic materials from substrate surfaces
US20020132491A1 (en) * 1998-12-31 2002-09-19 John E. Lang Method of removing photoresist material with dimethyl sulfoxide
JP3393082B2 (ja) 1999-04-02 2003-04-07 東京エレクトロン株式会社 現像方法および現像装置
US7129199B2 (en) * 2002-08-12 2006-10-31 Air Products And Chemicals, Inc. Process solutions containing surfactants
US6413923B2 (en) * 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
WO2002003143A2 (en) 2000-06-29 2002-01-10 Huntsman Petrochemical Corporation Alkylene carbonate-based photoresist stripping compositions
US6764551B2 (en) * 2001-10-05 2004-07-20 International Business Machines Corporation Process for removing dopant ions from a substrate
JP4314320B2 (ja) * 2002-04-10 2009-08-12 三菱電機株式会社 化合物半導体装置の製造方法
WO2003091376A1 (en) * 2002-04-24 2003-11-06 Ekc Technology, Inc. Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
TW200404829A (en) * 2002-08-19 2004-04-01 Rohm & Haas Resin cleaning method
US20040157759A1 (en) * 2003-02-07 2004-08-12 Buckeye International, Inc. Stripper formulations and process
US6951710B2 (en) * 2003-05-23 2005-10-04 Air Products And Chemicals, Inc. Compositions suitable for removing photoresist, photoresist byproducts and etching residue, and use thereof
US7344988B2 (en) * 2003-10-27 2008-03-18 Dupont Air Products Nanomaterials Llc Alumina abrasive for chemical mechanical polishing
US7419911B2 (en) * 2003-11-10 2008-09-02 Ekc Technology, Inc. Compositions and methods for rapidly removing overfilled substrates
US20060094612A1 (en) * 2004-11-04 2006-05-04 Mayumi Kimura Post etch cleaning composition for use with substrates having aluminum
US7888302B2 (en) * 2005-02-03 2011-02-15 Air Products And Chemicals, Inc. Aqueous based residue removers comprising fluoride
US7682458B2 (en) * 2005-02-03 2010-03-23 Air Products And Chemicals, Inc. Aqueous based residue removers comprising fluoride
KR101088568B1 (ko) * 2005-04-19 2011-12-05 아반토르 퍼포먼스 머티리얼스, 인크. 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼
US7395717B2 (en) * 2006-02-10 2008-07-08 Milliken & Company Flexible capacitive sensor
EP1903400A1 (de) * 2006-09-20 2008-03-26 Interuniversitair Microelektronica Centrum Verfahren zur Entfernung von Fotolackschichten von einem Substrat
TW200927998A (en) * 2007-09-06 2009-07-01 Ekc Technology Inc Compositions and method for treating a copper surface
US9481854B2 (en) 2008-02-21 2016-11-01 S. C. Johnson & Son, Inc. Cleaning composition that provides residual benefits
US8980813B2 (en) 2008-02-21 2015-03-17 S. C. Johnson & Son, Inc. Cleaning composition having high self-adhesion on a vertical hard surface and providing residual benefits
ES2422261T5 (es) * 2008-02-21 2017-05-12 S.C. Johnson & Son, Inc. Composición para limpieza que tiene alta autoadhesión y que proporciona beneficios residuales
WO2009105232A1 (en) * 2008-02-21 2009-08-27 S. C. Johnson & Son, Inc. Cleaning composition that provides residual benefits
US9410111B2 (en) 2008-02-21 2016-08-09 S.C. Johnson & Son, Inc. Cleaning composition that provides residual benefits
US8993502B2 (en) 2008-02-21 2015-03-31 S. C. Johnson & Son, Inc. Cleaning composition having high self-adhesion to a vertical hard surface and providing residual benefits
US8143206B2 (en) * 2008-02-21 2012-03-27 S.C. Johnson & Son, Inc. Cleaning composition having high self-adhesion and providing residual benefits
US8101561B2 (en) * 2009-11-17 2012-01-24 Wai Mun Lee Composition and method for treating semiconductor substrate surface
DE202009016945U1 (de) 2009-12-15 2010-03-18 Cognis Ip Management Gmbh Reinigungsmittel für Elektronikbauteile
CN104423182B (zh) * 2013-08-29 2019-05-10 得凯莫斯公司弗罗里达有限公司 正型光阻剥除剂
JP6536464B2 (ja) * 2016-04-26 2019-07-03 信越化学工業株式会社 洗浄剤組成物及び薄型基板の製造方法
KR102209389B1 (ko) * 2016-09-26 2021-01-28 주식회사 엘지화학 포토레지스트 제거용 스트리퍼 폐액의 정제 방법
WO2020102085A1 (en) 2018-11-14 2020-05-22 Lam Research Corporation Methods for making hard masks useful in next-generation lithography
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Also Published As

Publication number Publication date
DE3856202T2 (de) 1998-10-22
US5399464A (en) 1995-03-21
HK1012166A1 (en) 1999-07-23
EP0301756B1 (de) 1998-06-10
JP3044207B2 (ja) 2000-05-22
ATE231987T1 (de) 2003-02-15
JP2930956B2 (ja) 1999-08-09
JPH01105949A (ja) 1989-04-24
US4824763A (en) 1989-04-25
EP0301756A2 (de) 1989-02-01
DE3856553T2 (de) 2004-02-19
DE3856553D1 (de) 2003-03-06
EP0846984A2 (de) 1998-06-10
KR890003003A (ko) 1989-04-12
EP0301756A3 (de) 1990-11-14
EP0846984A3 (de) 2000-03-22
EP0846984B1 (de) 2003-01-29
JPH10319609A (ja) 1998-12-04
ATE167310T1 (de) 1998-06-15
HK1011882A1 (en) 1999-07-23

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Legal Events

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8339 Ceased/non-payment of the annual fee