DE3877171T2 - Drucksensor. - Google Patents
Drucksensor.Info
- Publication number
- DE3877171T2 DE3877171T2 DE8888311276T DE3877171T DE3877171T2 DE 3877171 T2 DE3877171 T2 DE 3877171T2 DE 8888311276 T DE8888311276 T DE 8888311276T DE 3877171 T DE3877171 T DE 3877171T DE 3877171 T2 DE3877171 T2 DE 3877171T2
- Authority
- DE
- Germany
- Prior art keywords
- pressure sensor
- sensor
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0038—Fluidic connecting means being part of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
- G01L19/143—Two part housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
- G01L27/007—Malfunction diagnosis, i.e. diagnosing a sensor defect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49103—Strain gauge making
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/136,579 US4850227A (en) | 1987-12-22 | 1987-12-22 | Pressure sensor and method of fabrication thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3877171D1 DE3877171D1 (de) | 1993-02-11 |
DE3877171T2 true DE3877171T2 (de) | 1993-04-29 |
Family
ID=22473443
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3851547T Expired - Fee Related DE3851547T2 (de) | 1987-12-22 | 1988-11-29 | Methode zur Herstellung und zum Justierung eines Drucksensors. |
DE8888311276T Expired - Fee Related DE3877171T2 (de) | 1987-12-22 | 1988-11-29 | Drucksensor. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3851547T Expired - Fee Related DE3851547T2 (de) | 1987-12-22 | 1988-11-29 | Methode zur Herstellung und zum Justierung eines Drucksensors. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4850227A (de) |
EP (2) | EP0480544B1 (de) |
JP (1) | JPH0656345B2 (de) |
DE (2) | DE3851547T2 (de) |
Families Citing this family (94)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5048181A (en) * | 1988-09-19 | 1991-09-17 | Ford Motor Company | Method for making thick film circuit housing assembly design |
US5225373A (en) * | 1990-03-07 | 1993-07-06 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing semiconductor pressure sensor device with two semiconductor pressure sensor chips |
US5233871A (en) * | 1991-11-01 | 1993-08-10 | Delco Electronics Corporation | Hybrid accelerometer assembly |
US5209122A (en) * | 1991-11-20 | 1993-05-11 | Delco Electronics Corporation | Pressurer sensor and method for assembly of same |
US5257547A (en) * | 1991-11-26 | 1993-11-02 | Honeywell Inc. | Amplified pressure transducer |
US5263241A (en) * | 1992-04-06 | 1993-11-23 | Delco Electronics Corporation | Apparatus useful in the manufacture of a pressure sensor assembly |
JP3092307B2 (ja) * | 1992-04-16 | 2000-09-25 | 富士電機株式会社 | 半導体圧力センサ |
JP2991014B2 (ja) * | 1993-10-08 | 1999-12-20 | 三菱電機株式会社 | 圧力センサ |
US5686698A (en) * | 1994-06-30 | 1997-11-11 | Motorola, Inc. | Package for electrical components having a molded structure with a port extending into the molded structure |
US5533404A (en) * | 1994-12-09 | 1996-07-09 | Rjg Technologies, Inc. | Mold pressure sensor body |
AU5417096A (en) | 1995-02-24 | 1996-09-11 | Lucas Novasensor | Pressure sensor with transducer mounted on a metal base |
US5640764A (en) * | 1995-05-22 | 1997-06-24 | Alfred E. Mann Foundation For Scientific Research | Method of forming a tubular feed-through hermetic seal for an implantable medical device |
DE19544974C1 (de) * | 1995-12-01 | 1997-05-22 | Siemens Ag | Steuergerät, insbesondere zur Auslösung eines Rückhaltemittels in einem Fahrzeug |
US6202853B1 (en) * | 1996-01-11 | 2001-03-20 | Autosplice Systems, Inc. | Secondary processing for electrical or mechanical components molded to continuous carrier supports |
DE19626084C2 (de) * | 1996-06-28 | 2003-04-17 | Infineon Technologies Ag | Drucksensorvorrichtung für eine Montage auf der Bestückungsoberfläche einer Leiterplatte |
US5938038A (en) | 1996-08-02 | 1999-08-17 | Dial Tool Industries, Inc. | Parts carrier strip and apparatus for assembling parts in such a strip |
JP4118353B2 (ja) * | 1996-10-11 | 2008-07-16 | 株式会社デンソー | 樹脂封止型半導体装置の製造方法およびモールド金型 |
US5948991A (en) * | 1996-12-09 | 1999-09-07 | Denso Corporation | Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip |
US5714409A (en) * | 1997-01-21 | 1998-02-03 | Ford Motor Company | Method and apparatus for packaging a vehicle sensor and integrated circuit chip |
US6053049A (en) * | 1997-05-30 | 2000-04-25 | Motorola Inc. | Electrical device having atmospheric isolation |
DE19723615A1 (de) * | 1997-06-05 | 1998-12-10 | Trw Automotive Electron & Comp | Drucksensoreinheit, insbesondere für die Kraftfahrzeugtechnik |
US20040099061A1 (en) | 1997-12-22 | 2004-05-27 | Mks Instruments | Pressure sensor for detecting small pressure differences and low pressures |
US5967328A (en) * | 1998-01-22 | 1999-10-19 | Dial Tool Industries, Inc. | Part carrier strip |
JP3532776B2 (ja) * | 1998-10-20 | 2004-05-31 | 株式会社日立製作所 | 自動車用センサの取付け構造 |
WO2001013085A1 (de) * | 1999-08-17 | 2001-02-22 | Siemens Aktiengesellschaft | Saugrohrdruckaufnehmer |
US6571132B1 (en) | 1999-09-28 | 2003-05-27 | Rosemount Inc. | Component type adaptation in a transducer assembly |
US6765968B1 (en) | 1999-09-28 | 2004-07-20 | Rosemount Inc. | Process transmitter with local databus |
US6484107B1 (en) * | 1999-09-28 | 2002-11-19 | Rosemount Inc. | Selectable on-off logic modes for a sensor module |
AU7835100A (en) | 1999-09-28 | 2001-04-30 | Rosemount Inc. | Environmentally sealed instrument loop adapter |
US6510740B1 (en) | 1999-09-28 | 2003-01-28 | Rosemount Inc. | Thermal management in a pressure transmitter |
US7134354B2 (en) * | 1999-09-28 | 2006-11-14 | Rosemount Inc. | Display for process transmitter |
US6487912B1 (en) | 1999-09-28 | 2002-12-03 | Rosemount Inc. | Preinstallation of a pressure sensor module |
CA2314573C (en) * | 2000-01-13 | 2009-09-29 | Z.I. Probes, Inc. | System for acquiring data from a facility and method |
CA2408901C (en) * | 2002-10-18 | 2011-10-11 | Zed.I Solutions (Canada) Inc. | System for acquiring data from a facility and method |
US6208233B1 (en) | 2000-03-03 | 2001-03-27 | Delphi Technologies, Inc. | Trim resistor connector and sensor system |
US6546805B2 (en) | 2000-03-07 | 2003-04-15 | Rosemount Inc. | Process fluid transmitter with an environmentally sealed service block |
US20020033050A1 (en) * | 2000-04-28 | 2002-03-21 | Toshitaka Shibata | Pressure sensor |
US6662662B1 (en) | 2000-05-04 | 2003-12-16 | Rosemount, Inc. | Pressure transmitter with improved isolator system |
US6504489B1 (en) | 2000-05-15 | 2003-01-07 | Rosemount Inc. | Process control transmitter having an externally accessible DC circuit common |
AU2001270103A1 (en) * | 2000-06-23 | 2002-01-08 | Kaiser Electroprecision | Sensor capable of operating outside of ambient operating temperature limits |
US6480131B1 (en) | 2000-08-10 | 2002-11-12 | Rosemount Inc. | Multiple die industrial process control transmitter |
FR2818676B1 (fr) * | 2000-12-27 | 2003-03-07 | Freyssinet Int Stup | Procede de demontage d'un cable de precontrainte et dispositif pour la mise en oeuvre |
US6612176B2 (en) * | 2000-12-28 | 2003-09-02 | Mks Instruments, Inc. | Pressure transducer assembly with thermal shield |
US6516672B2 (en) | 2001-05-21 | 2003-02-11 | Rosemount Inc. | Sigma-delta analog to digital converter for capacitive pressure sensor and process transmitter |
US6684711B2 (en) | 2001-08-23 | 2004-02-03 | Rosemount Inc. | Three-phase excitation circuit for compensated capacitor industrial process control transmitters |
JP4127396B2 (ja) * | 2001-10-18 | 2008-07-30 | 株式会社日立製作所 | センサ装置 |
DE10223357A1 (de) * | 2002-05-25 | 2003-12-04 | Bosch Gmbh Robert | Vorrichtung zur Druckmessung |
US7773715B2 (en) | 2002-09-06 | 2010-08-10 | Rosemount Inc. | Two wire transmitter with isolated can output |
US7109883B2 (en) * | 2002-09-06 | 2006-09-19 | Rosemount Inc. | Low power physical layer for a bus in an industrial transmitter |
US6779406B1 (en) * | 2003-02-04 | 2004-08-24 | Delphi Technologies, Inc. | Self-retaining pressure sensor assembly having notched seal retention flange |
US6993973B2 (en) * | 2003-05-16 | 2006-02-07 | Mks Instruments, Inc. | Contaminant deposition control baffle for a capacitive pressure transducer |
GB0315489D0 (en) * | 2003-07-02 | 2003-08-06 | Melexis Nv | Pressure sensor |
US7024937B2 (en) | 2003-12-03 | 2006-04-11 | Honeywell International Inc. | Isolated pressure transducer |
US7036381B2 (en) * | 2004-06-25 | 2006-05-02 | Rosemount Inc. | High temperature pressure transmitter assembly |
US7201057B2 (en) * | 2004-09-30 | 2007-04-10 | Mks Instruments, Inc. | High-temperature reduced size manometer |
US7141447B2 (en) | 2004-10-07 | 2006-11-28 | Mks Instruments, Inc. | Method of forming a seal between a housing and a diaphragm of a capacitance sensor |
US7137301B2 (en) * | 2004-10-07 | 2006-11-21 | Mks Instruments, Inc. | Method and apparatus for forming a reference pressure within a chamber of a capacitance sensor |
US7204150B2 (en) | 2005-01-14 | 2007-04-17 | Mks Instruments, Inc. | Turbo sump for use with capacitive pressure sensor |
DE102005053014B4 (de) * | 2005-11-07 | 2009-09-24 | Continental Automotive Gmbh | Drucksensorgehäuse und Verfahren zu seiner Herstellung |
DE102005054177B4 (de) * | 2005-11-14 | 2011-12-22 | Infineon Technologies Ag | Verfahren zum Herstellen einer Vielzahl von gehäusten Sensormodulen |
US7162927B1 (en) * | 2005-12-16 | 2007-01-16 | Honeywell International Inc. | Design of a wet/wet amplified differential pressure sensor based on silicon piezoresistive technology |
US7525419B2 (en) * | 2006-01-30 | 2009-04-28 | Rosemount Inc. | Transmitter with removable local operator interface |
JP5490349B2 (ja) * | 2006-05-24 | 2014-05-14 | 株式会社デンソー | 圧力センサ |
US7430918B2 (en) * | 2006-12-04 | 2008-10-07 | Honeywell International Inc. | Amplified flow through pressure sensor |
US7497124B2 (en) * | 2007-04-20 | 2009-03-03 | Delphi Technologies, Inc. | Dual pressure sensor apparatus |
KR101545765B1 (ko) | 2008-04-17 | 2015-08-20 | 알러간, 인코포레이티드 | 이식가능한 액세스 포트 장치 및 부착 시스템 |
US9023063B2 (en) | 2008-04-17 | 2015-05-05 | Apollo Endosurgery, Inc. | Implantable access port device having a safety cap |
US7819016B2 (en) * | 2009-03-03 | 2010-10-26 | Kuo-Liang Chen | Non-disposable and reusable air pressure gauge |
US8506532B2 (en) | 2009-08-26 | 2013-08-13 | Allergan, Inc. | System including access port and applicator tool |
US8715158B2 (en) | 2009-08-26 | 2014-05-06 | Apollo Endosurgery, Inc. | Implantable bottom exit port |
US8708979B2 (en) | 2009-08-26 | 2014-04-29 | Apollo Endosurgery, Inc. | Implantable coupling device |
DE102009047506A1 (de) * | 2009-12-04 | 2011-06-09 | Robert Bosch Gmbh | Sensor mit einem Sensorgehäuse |
DE102010001418A1 (de) * | 2010-02-01 | 2011-08-04 | Robert Bosch GmbH, 70469 | Sensormodul, Verfahren zur Herstellung eines Sensormoduls |
US8882728B2 (en) | 2010-02-10 | 2014-11-11 | Apollo Endosurgery, Inc. | Implantable injection port |
US8334788B2 (en) * | 2010-03-04 | 2012-12-18 | Rosemount Inc. | Process variable transmitter with display |
US20110270021A1 (en) | 2010-04-30 | 2011-11-03 | Allergan, Inc. | Electronically enhanced access port for a fluid filled implant |
US8992415B2 (en) | 2010-04-30 | 2015-03-31 | Apollo Endosurgery, Inc. | Implantable device to protect tubing from puncture |
US20110270025A1 (en) | 2010-04-30 | 2011-11-03 | Allergan, Inc. | Remotely powered remotely adjustable gastric band system |
US20120041258A1 (en) | 2010-08-16 | 2012-02-16 | Allergan, Inc. | Implantable access port system |
US20120065460A1 (en) | 2010-09-14 | 2012-03-15 | Greg Nitka | Implantable access port system |
US8821373B2 (en) | 2011-05-10 | 2014-09-02 | Apollo Endosurgery, Inc. | Directionless (orientation independent) needle injection port |
US8801597B2 (en) | 2011-08-25 | 2014-08-12 | Apollo Endosurgery, Inc. | Implantable access port with mesh attachment rivets |
US9199069B2 (en) | 2011-10-20 | 2015-12-01 | Apollo Endosurgery, Inc. | Implantable injection port |
US8858421B2 (en) | 2011-11-15 | 2014-10-14 | Apollo Endosurgery, Inc. | Interior needle stick guard stems for tubes |
US9089395B2 (en) | 2011-11-16 | 2015-07-28 | Appolo Endosurgery, Inc. | Pre-loaded septum for use with an access port |
US8811636B2 (en) | 2011-11-29 | 2014-08-19 | Qualcomm Mems Technologies, Inc. | Microspeaker with piezoelectric, metal and dielectric membrane |
DE102012101859A1 (de) * | 2012-03-06 | 2013-09-12 | Continental Automotive Gmbh | Drucksensor für ein Aufprallsensorsystem |
JP5912069B2 (ja) * | 2012-07-26 | 2016-04-27 | アルプス電気株式会社 | 物理量センサ装置及びその製造方法 |
DE102013209060A1 (de) * | 2013-05-16 | 2014-11-20 | Robert Bosch Gmbh | Vorrichtung zur Erfassung eines Drucks und einer Temperatur eines in einem Kanal strömenden fluiden Mediums |
JP6228790B2 (ja) * | 2013-09-18 | 2017-11-08 | アルプス電気株式会社 | 圧力検知装置およびこれを使用した吸気圧測定装置 |
DE102015223850A1 (de) * | 2015-12-01 | 2017-06-01 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Vorrichtung zur Erfassung mindestens einer Eigenschaft eines fluiden Mediums in einem Messraum |
DE102016200699A1 (de) * | 2016-01-20 | 2017-07-20 | Robert Bosch Gmbh | Herstellungsverfahren für eine Detektionsvorrichtung und Detektionsvorrichtungen |
WO2017188351A1 (ja) * | 2016-04-27 | 2017-11-02 | 北陸電気工業株式会社 | 圧力センサ装置 |
CN114608732B (zh) * | 2022-04-22 | 2023-07-25 | 淄博市特种设备检验研究院 | 一种在线监测压力容器运行安全的监测设备 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3858150A (en) * | 1973-06-21 | 1974-12-31 | Motorola Inc | Polycrystalline silicon pressure sensor |
US4033787A (en) * | 1975-10-06 | 1977-07-05 | Honeywell Inc. | Fabrication of semiconductor devices utilizing ion implantation |
US4202081A (en) * | 1976-06-07 | 1980-05-13 | Borg Instruments, Inc. | Method of assembling a pressure sensor |
US4295117A (en) * | 1980-09-11 | 1981-10-13 | General Motors Corporation | Pressure sensor assembly |
US4372803A (en) * | 1980-09-26 | 1983-02-08 | The United States Of America As Represented By The Secretary Of The Navy | Method for etch thinning silicon devices |
US4456901A (en) * | 1981-08-31 | 1984-06-26 | Kulite Semiconductor Products, Inc. | Dielectrically isolated transducer employing single crystal strain gages |
US4532533A (en) * | 1982-04-27 | 1985-07-30 | International Business Machines Corporation | Ballistic conduction semiconductor device |
US4492825A (en) * | 1982-07-28 | 1985-01-08 | At&T Bell Laboratories | Electroacoustic transducer |
JPS59117271A (ja) * | 1982-12-24 | 1984-07-06 | Hitachi Ltd | 圧力感知素子を有する半導体装置とその製造法 |
DE3476695D1 (en) * | 1984-11-08 | 1989-03-16 | Ppg Hellige Bv | Measuring transducer, in particular for medical applications |
US4708012A (en) * | 1986-08-19 | 1987-11-24 | Motorola, Inc. | Method and apparatus for high pressure testing of solid state pressure sensors |
-
1987
- 1987-12-22 US US07/136,579 patent/US4850227A/en not_active Expired - Lifetime
-
1988
- 1988-11-29 DE DE3851547T patent/DE3851547T2/de not_active Expired - Fee Related
- 1988-11-29 EP EP91203296A patent/EP0480544B1/de not_active Expired - Lifetime
- 1988-11-29 EP EP88311276A patent/EP0322122B1/de not_active Expired - Lifetime
- 1988-11-29 DE DE8888311276T patent/DE3877171T2/de not_active Expired - Fee Related
- 1988-12-22 JP JP63324726A patent/JPH0656345B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0322122A2 (de) | 1989-06-28 |
EP0322122A3 (de) | 1991-01-30 |
EP0480544A2 (de) | 1992-04-15 |
JPH01280232A (ja) | 1989-11-10 |
JPH0656345B2 (ja) | 1994-07-27 |
DE3877171D1 (de) | 1993-02-11 |
EP0480544B1 (de) | 1994-09-14 |
EP0480544A3 (en) | 1992-07-08 |
US4850227A (en) | 1989-07-25 |
EP0322122B1 (de) | 1992-12-30 |
DE3851547T2 (de) | 1995-01-05 |
DE3851547D1 (de) | 1994-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: DELPHI TECHNOLOGIES, INC., TROY, MICH., US |
|
8339 | Ceased/non-payment of the annual fee |