DE3879157T2 - Verdrehbarer aufnahme- und absetz-vakuumgreifkopf für plättchenbefestigungsapparat. - Google Patents

Verdrehbarer aufnahme- und absetz-vakuumgreifkopf für plättchenbefestigungsapparat.

Info

Publication number
DE3879157T2
DE3879157T2 DE88906460T DE3879157T DE3879157T2 DE 3879157 T2 DE3879157 T2 DE 3879157T2 DE 88906460 T DE88906460 T DE 88906460T DE 3879157 T DE3879157 T DE 3879157T DE 3879157 T2 DE3879157 T2 DE 3879157T2
Authority
DE
Germany
Prior art keywords
grapping
head
mounting apparatus
tablet mounting
turntable receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88906460T
Other languages
English (en)
Other versions
DE3879157D1 (de
Inventor
G Niskala
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of DE3879157D1 publication Critical patent/DE3879157D1/de
Publication of DE3879157T2 publication Critical patent/DE3879157T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/907—Sensor controlled device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/125—Combined or convertible implements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T483/00—Tool changing
    • Y10T483/19—Miscellaneous
DE88906460T 1987-07-20 1988-06-27 Verdrehbarer aufnahme- und absetz-vakuumgreifkopf für plättchenbefestigungsapparat. Expired - Fee Related DE3879157T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/075,157 US4799854A (en) 1987-07-20 1987-07-20 Rotatable pick and place vacuum sense head for die bonding apparatus

Publications (2)

Publication Number Publication Date
DE3879157D1 DE3879157D1 (de) 1993-04-15
DE3879157T2 true DE3879157T2 (de) 1993-09-30

Family

ID=22123938

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88906460T Expired - Fee Related DE3879157T2 (de) 1987-07-20 1988-06-27 Verdrehbarer aufnahme- und absetz-vakuumgreifkopf für plättchenbefestigungsapparat.

Country Status (5)

Country Link
US (1) US4799854A (de)
EP (1) EP0324002B1 (de)
JP (1) JPH02500151A (de)
DE (1) DE3879157T2 (de)
WO (1) WO1989000768A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015279A (en) * 1989-02-10 1991-05-14 Quartz & Silice Apparatus for extracting spin cast fused silica objects
JPH0797599B2 (ja) * 1990-04-27 1995-10-18 株式会社芝浦製作所 基板検出装置
US5086477A (en) * 1990-08-07 1992-02-04 Northwest Technology Corp. Automated system for extracting design and layout information from an integrated circuit
US5201696A (en) * 1992-05-05 1993-04-13 Universal Instruments Corp. Apparatus for replacement of vacuum nozzles
US5385441A (en) * 1993-11-23 1995-01-31 Motorola, Inc. Method and apparatus for picking and placing an article
JP3591677B2 (ja) * 1996-09-20 2004-11-24 株式会社アドバンテスト Ｉｃ搬送用制御装置
US5782515A (en) * 1996-11-13 1998-07-21 Eastman Kodak Company Rotatable arm mechanism for assembling and disassembling samples
US5800777A (en) * 1996-11-13 1998-09-01 Eastman Kodak Company Method and apparatus for automatic sample preparation and handling
US5910878A (en) * 1997-06-26 1999-06-08 International Business Machines Corporation Method and apparatus for protecting electrical devices from static electricity
US6137299A (en) * 1997-06-27 2000-10-24 International Business Machines Corporation Method and apparatus for testing integrated circuit chips
US5979606A (en) * 1997-12-23 1999-11-09 Sony Corporation Conveyor elevator
US6015174A (en) * 1998-06-04 2000-01-18 Eastman Kodak Company Universal end effector for robotic applications
JP2001338935A (ja) * 2000-05-26 2001-12-07 Nidec Copal Corp ダイボンディング装置
US6718608B2 (en) * 2002-01-22 2004-04-13 St Assembly Test Services Pte Ltd Multi-package conversion kit for a pick and place handler
DE102006022277B4 (de) * 2006-05-11 2010-03-11 Deutsche Post Ag Sauggreifer
TWI451522B (zh) * 2008-06-30 2014-09-01 Apparatus and method for removing crystal grains
US8387851B1 (en) * 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
CN104669284A (zh) * 2013-11-30 2015-06-03 深圳富泰宏精密工业有限公司 吸放料装置
SG11201809359QA (en) 2016-05-27 2018-12-28 Universal Instruments Corp Dispensing head having a nozzle heater device, system and method
CN112967949B (zh) * 2020-08-11 2022-05-20 重庆康佳光电技术研究院有限公司 一种转移构件、转移装置及转移方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US32538A (en) * 1861-06-11 Improvement in steam-engines
US4135630A (en) * 1977-12-08 1979-01-23 Universal Instruments Corporation Centering device for automatic placement of chip components in hybrid circuits
SE453168B (sv) * 1982-04-19 1988-01-18 Lennart Palmer Anordning for att utbytbart anordna verktyg pa en industrirobot
JPS59224279A (ja) * 1983-06-01 1984-12-17 富士機械製造株式会社 電子部品の位置決め保持方法および装置
JPS6047431A (ja) * 1983-08-26 1985-03-14 Tokyo Sokuhan Kk 部品マウント装置
JPS60147125A (ja) * 1984-01-11 1985-08-03 Toshiba Corp 半導体組立装置
CA1246625A (en) * 1984-04-06 1988-12-13 Stanley R. Vancelette Placement mechanism
US4723353A (en) * 1984-05-14 1988-02-09 Monforte Mathew L Exchangeable multi-function end effector tools
US4620362A (en) * 1984-06-22 1986-11-04 The Boeing Company Changeable tooling system for robot end-effector
JPH0715916B2 (ja) * 1984-07-31 1995-02-22 株式会社東芝 ボンデイング装置
US4604787A (en) * 1984-08-15 1986-08-12 Transamerica Delaval Inc. Tool changer for manipulator arm
US4611397A (en) * 1984-10-09 1986-09-16 Universal Instruments Corporation Pick and place method and apparatus for handling electrical components
US4611846A (en) * 1984-10-23 1986-09-16 Amp Incorporated Gripper head
CH664110A5 (fr) * 1985-11-08 1988-02-15 Ismeca S A Machine automatique de placement de composants sur des substrats, tete de placement pour cette machine.

Also Published As

Publication number Publication date
WO1989000768A1 (en) 1989-01-26
JPH02500151A (ja) 1990-01-18
US4799854A (en) 1989-01-24
EP0324002B1 (de) 1993-03-10
EP0324002A1 (de) 1989-07-19
DE3879157D1 (de) 1993-04-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee