DE3880385T2 - Gedruckte Leiterplatte. - Google Patents

Gedruckte Leiterplatte.

Info

Publication number
DE3880385T2
DE3880385T2 DE88109621T DE3880385T DE3880385T2 DE 3880385 T2 DE3880385 T2 DE 3880385T2 DE 88109621 T DE88109621 T DE 88109621T DE 3880385 T DE3880385 T DE 3880385T DE 3880385 T2 DE3880385 T2 DE 3880385T2
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88109621T
Other languages
English (en)
Other versions
DE3880385D1 (de
Inventor
Mario Enrique Ecker
Leonard Theodore Olson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE3880385D1 publication Critical patent/DE3880385D1/de
Application granted granted Critical
Publication of DE3880385T2 publication Critical patent/DE3880385T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
DE88109621T 1987-07-13 1988-06-16 Gedruckte Leiterplatte. Expired - Fee Related DE3880385T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/072,833 US4785135A (en) 1987-07-13 1987-07-13 De-coupled printed circuits

Publications (2)

Publication Number Publication Date
DE3880385D1 DE3880385D1 (de) 1993-05-27
DE3880385T2 true DE3880385T2 (de) 1993-10-28

Family

ID=22110029

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88109621T Expired - Fee Related DE3880385T2 (de) 1987-07-13 1988-06-16 Gedruckte Leiterplatte.

Country Status (4)

Country Link
US (1) US4785135A (de)
EP (1) EP0299221B1 (de)
JP (1) JPH0766998B2 (de)
DE (1) DE3880385T2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4891616A (en) * 1988-06-01 1990-01-02 Honeywell Inc. Parallel planar signal transmission system
US5186647A (en) 1992-02-24 1993-02-16 At&T Bell Laboratories High frequency electrical connector
JPH0770837B2 (ja) * 1992-05-20 1995-07-31 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層配線を有する電子パッケージ基板及び方法
US5414393A (en) * 1992-08-20 1995-05-09 Hubbell Incorporated Telecommunication connector with feedback
US5432484A (en) * 1992-08-20 1995-07-11 Hubbell Incorporated Connector for communication systems with cancelled crosstalk
US5430247A (en) * 1993-08-31 1995-07-04 Motorola, Inc. Twisted-pair planar conductor line off-set structure
US5917860A (en) * 1993-12-13 1999-06-29 Industrial Technology Research Institute Digital transmitter utilizing a phase shifter having decoupled coplanar microstrips
US5357051A (en) * 1994-01-31 1994-10-18 Hwang Richard H Printed circuit board for reducing radio frequency interferences
US5618185A (en) * 1995-03-15 1997-04-08 Hubbell Incorporated Crosstalk noise reduction connector for telecommunication system
CN1148843C (zh) 1995-06-12 2004-05-05 连接器系统技术股份有限公司 低串扰和阻抗受控的电连接器和电缆组
US6939173B1 (en) 1995-06-12 2005-09-06 Fci Americas Technology, Inc. Low cross talk and impedance controlled electrical connector with solder masses
US5817973A (en) * 1995-06-12 1998-10-06 Berg Technology, Inc. Low cross talk and impedance controlled electrical cable assembly
TW267265B (en) * 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
US5789807A (en) * 1996-10-15 1998-08-04 International Business Machines Corporation On-chip power distribution for improved decoupling
DE19652258A1 (de) * 1996-12-16 1998-06-18 Ibm Verbesserte Verdrahtungsstruktur für Hochleistungschips
US5944535A (en) * 1997-02-04 1999-08-31 Hubbell Incorporated Interface panel system for networks
US5931703A (en) * 1997-02-04 1999-08-03 Hubbell Incorporated Low crosstalk noise connector for telecommunication systems
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US6208219B1 (en) * 1999-05-12 2001-03-27 Samuel Singer Broadband RF circuits with microstrips laid out in randomly meandering paths
US6518663B1 (en) * 1999-08-30 2003-02-11 Texas Instruments Incorporated Constant impedance routing for high performance integrated circuit packaging
US7271985B1 (en) 2004-09-24 2007-09-18 Storage Technology Corporation System and method for crosstalk reduction in a flexible trace interconnect array
GB2439861A (en) 2005-03-01 2008-01-09 X2Y Attenuators Llc Internally overlapped conditioners
CN100553032C (zh) * 2005-03-30 2009-10-21 松下电器产业株式会社 传输线对
KR101352344B1 (ko) * 2006-09-13 2014-01-15 삼성디스플레이 주식회사 신호전송 부재 및 이를 갖는 표시장치
JP4979534B2 (ja) * 2007-10-11 2012-07-18 日本オプネクスト株式会社 光モジュール
JP5427644B2 (ja) * 2010-02-25 2014-02-26 株式会社日立製作所 プリント基板
US9930771B2 (en) * 2015-12-16 2018-03-27 Dell Products, Lp Aperiodic routing to mitigate floquet mode resonances
JP2019005199A (ja) * 2017-06-23 2019-01-17 株式会社三共 遊技機
JP2019005198A (ja) * 2017-06-23 2019-01-17 株式会社三共 遊技機
JP2019005197A (ja) * 2017-06-23 2019-01-17 株式会社三共 遊技機
JP2019017887A (ja) * 2017-07-21 2019-02-07 株式会社三共 遊技機
JP2019025263A (ja) * 2017-08-04 2019-02-21 株式会社三共 遊技機
JP2019025261A (ja) * 2017-08-04 2019-02-21 株式会社三共 遊技機
JP2019107194A (ja) * 2017-12-18 2019-07-04 株式会社三共 遊技機
JP6720247B2 (ja) * 2018-04-26 2020-07-08 株式会社三共 遊技機

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US278289A (en) * 1883-05-22 Samuel i
NL268381A (de) * 1960-09-28
DE1218572B (de) * 1963-03-22 1966-06-08 Siemens Ag Fernmeldekabel mit in Lagen angeordneten Einzeladern, aus denen durch gegenseitiges Kreuzen Doppelleitungen gebildet sind
FR1402897A (fr) * 1964-03-06 1965-06-18 Telecommunications Sa Circuits à conducteurs plats pour câbles de télécommunication
US3573670A (en) * 1969-03-21 1971-04-06 Ibm High-speed impedance-compensated circuits
US3736366A (en) * 1972-04-27 1973-05-29 Bell Telephone Labor Inc Mass bonding of twisted pair cables
US3761842A (en) * 1972-06-01 1973-09-25 Bell Telephone Labor Inc Twisted pair flat conductor cable with means to equalize impedance and propagation velocity
US3764727A (en) * 1972-06-12 1973-10-09 Western Electric Co Electrically conductive flat cable structures
US3774123A (en) * 1972-12-11 1973-11-20 Ibm Broad band microstrip n-pole m-throw pin diode switch having predetermined spacing between pole and throw conductors
US3876964A (en) * 1973-08-23 1975-04-08 Amp Inc Flat flexible transmission cable
FR2243578B1 (de) * 1973-09-12 1976-11-19 Honeywell Bull Soc Ind
GB1589519A (en) * 1976-11-19 1981-05-13 Solartron Electronic Group Printed circuits
US4076357A (en) * 1976-12-06 1978-02-28 International Business Machines Corporation Laminated programmable microstrip interconnector
DE2709129A1 (de) * 1977-02-28 1978-08-31 Siemens Ag Elektrische flachbandleitung mit verseilten adern
DE3326800A1 (de) * 1983-07-26 1985-02-14 ANT Nachrichtentechnik GmbH, 7150 Backnang Leiterplatte
GB8412606D0 (en) * 1984-05-17 1984-06-20 Murray J Printed circuit boards

Also Published As

Publication number Publication date
EP0299221A3 (en) 1990-11-07
DE3880385D1 (de) 1993-05-27
JPH01119087A (ja) 1989-05-11
JPH0766998B2 (ja) 1995-07-19
EP0299221B1 (de) 1993-04-21
EP0299221A2 (de) 1989-01-18
US4785135A (en) 1988-11-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee