DE3886082T2 - Hybrider Kontaktrahmen für einen Wärmetintenstrahldruckkopf und Verfahren zu seiner Herstellung und Verbindung. - Google Patents
Hybrider Kontaktrahmen für einen Wärmetintenstrahldruckkopf und Verfahren zu seiner Herstellung und Verbindung.Info
- Publication number
- DE3886082T2 DE3886082T2 DE88302408T DE3886082T DE3886082T2 DE 3886082 T2 DE3886082 T2 DE 3886082T2 DE 88302408 T DE88302408 T DE 88302408T DE 3886082 T DE3886082 T DE 3886082T DE 3886082 T2 DE3886082 T2 DE 3886082T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- connection
- ink jet
- thermal ink
- jet printhead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14024—Assembling head parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14362—Assembling elements of heads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/037,289 US4806106A (en) | 1987-04-09 | 1987-04-09 | Interconnect lead frame for thermal ink jet printhead and methods of manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3886082D1 DE3886082D1 (de) | 1994-01-20 |
DE3886082T2 true DE3886082T2 (de) | 1994-05-05 |
Family
ID=21893531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88302408T Expired - Fee Related DE3886082T2 (de) | 1987-04-09 | 1988-03-18 | Hybrider Kontaktrahmen für einen Wärmetintenstrahldruckkopf und Verfahren zu seiner Herstellung und Verbindung. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4806106A (de) |
EP (1) | EP0286258B1 (de) |
JP (1) | JP2950831B2 (de) |
CA (1) | CA1295182C (de) |
DE (1) | DE3886082T2 (de) |
HK (1) | HK69196A (de) |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE68918074T2 (de) * | 1988-12-29 | 1995-01-26 | Canon Kk | Tintenstrahlaufzeichnungskopf und Tintenstrahlaufzeichnungsgerät. |
US4940413A (en) * | 1989-07-26 | 1990-07-10 | Hewlett-Packard Company | Electrical make/break interconnect having high trace density |
JPH03268952A (ja) * | 1990-03-19 | 1991-11-29 | Toshiba Corp | サーマルヘッド |
US5253415A (en) * | 1990-03-20 | 1993-10-19 | Die Tech, Inc. | Method of making an integrated circuit substrate lead assembly |
US5060370A (en) * | 1990-10-15 | 1991-10-29 | Scales Jr James W | Modification method for etched printed circuit boards |
US5189787A (en) * | 1991-07-30 | 1993-03-02 | Hewlett-Packard Company | Attachment of a flexible circuit to an ink-jet pen |
JPH05315021A (ja) * | 1991-07-31 | 1993-11-26 | Du Pont Singapore Pte Ltd | コネクタ |
JPH05326087A (ja) * | 1991-08-15 | 1993-12-10 | Du Pont Singapore Pte Ltd | コネクタ及びこのコネクタを用いた電気的接続構造体 |
CA2085568C (en) | 1991-12-19 | 2000-10-17 | Kenjiro Watanabe | Ink jet recording head, ink jet recording head cartridge and recording apparatus using same |
US5343616B1 (en) * | 1992-02-14 | 1998-12-29 | Rock Ltd | Method of making high density self-aligning conductive networks and contact clusters |
US5434607A (en) * | 1992-04-02 | 1995-07-18 | Hewlett-Packard Company | Attachment of nozzle plate to flexible circuit for facilitating assembly of printhead |
DE69305418T2 (de) * | 1992-05-22 | 1997-05-07 | Tokyo Electric Co Ltd | Auswechselbare Tintenstrahldruckkopf-Tintenkassetteanordnung |
US5411343A (en) * | 1992-07-31 | 1995-05-02 | Hewlett-Packard Company | Redundant make/break interconnect for a print head |
US5442386A (en) * | 1992-10-13 | 1995-08-15 | Hewlett-Packard Company | Structure and method for preventing ink shorting of conductors connected to printhead |
US6003974A (en) * | 1993-04-30 | 1999-12-21 | Hewlett-Packard Company | Unitary interconnect system for an inkjet printer |
EP0622240B1 (de) * | 1993-04-30 | 1998-06-10 | Hewlett-Packard Company | Modularer Wagenzusammenbau für einen Tintenstrahldrucker |
US5471163A (en) * | 1993-11-16 | 1995-11-28 | Hewlett-Packard Company | Tab circuit fusible links for disconnection or encoding information |
US5565900A (en) * | 1994-02-04 | 1996-10-15 | Hewlett-Packard Company | Unit print head assembly for ink-jet printing |
US6305786B1 (en) | 1994-02-23 | 2001-10-23 | Hewlett-Packard Company | Unit print head assembly for an ink-jet printer |
US6070969A (en) * | 1994-03-23 | 2000-06-06 | Hewlett-Packard Company | Thermal inkjet printhead having a preferred nucleation site |
US5519421A (en) * | 1994-07-18 | 1996-05-21 | Hewlett-Packard Company | Disruption of polymer surface of a nozzle member to inhibit adhesive flow |
US5612511A (en) * | 1995-09-25 | 1997-03-18 | Hewlett-Packard Company | Double-sided electrical interconnect flexible circuit for ink-jet hard copy systems |
CH690479A5 (de) * | 1995-10-26 | 2000-09-15 | Reichle & De Massari Fa | Verfahren und Anschluss-Vorrichtung zum Durchschalten einer Mehrzahl voneinander distanzierter elektrischer Kontaktstellen. |
US5901425A (en) | 1996-08-27 | 1999-05-11 | Topaz Technologies Inc. | Inkjet print head apparatus |
JPH10329349A (ja) * | 1997-05-30 | 1998-12-15 | Seiko Instr Inc | サーマルヘッド及びその製造方法 |
US6238845B1 (en) * | 1997-11-13 | 2001-05-29 | Texas Instruments Incorporated | Method of forming lead frames with preformation support |
US6161915A (en) * | 1998-06-19 | 2000-12-19 | Lexmark International, Inc | Identification of thermal inkjet printer cartridges |
US6227651B1 (en) | 1998-09-25 | 2001-05-08 | Hewlett-Packard Company | Lead frame-mounted ink jet print head module |
US6624979B1 (en) | 2000-06-09 | 2003-09-23 | Iomega Corporation | Method and apparatus for parking and releasing a magnetic head |
US6628474B1 (en) | 2000-06-09 | 2003-09-30 | Iomega Corporation | Method and apparatus for electrostatic discharge protection in a removable cartridge |
US6717762B1 (en) | 2000-06-09 | 2004-04-06 | Iomega Corporation | Method and apparatus for making a drive compatible with a removable cartridge |
US6633445B1 (en) | 2000-06-09 | 2003-10-14 | Iomega Corporation | Method and apparatus for electrically coupling components in a removable cartridge |
US6781782B2 (en) | 2000-12-21 | 2004-08-24 | Iomega Corporation | Method and apparatus for saving calibration parameters for a removable cartridge |
US6496362B2 (en) | 2001-05-14 | 2002-12-17 | Iomega Corporation | Method and apparatus for protecting a hard disk drive from shock |
US6779067B2 (en) | 2001-05-14 | 2004-08-17 | Iomega Corporation | Method and apparatus for providing extended functionality for a bus |
US6901525B2 (en) | 2001-05-25 | 2005-05-31 | Iomega Corporation | Method and apparatus for managing power consumption on a bus |
US7101021B2 (en) * | 2001-07-30 | 2006-09-05 | Seiko Epson Corporation | Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip |
US6856007B2 (en) * | 2001-08-28 | 2005-02-15 | Tessera, Inc. | High-frequency chip packages |
US20030042295A1 (en) * | 2001-08-30 | 2003-03-06 | Wong Marvin G. | Self-adhesive flexible repair circuit |
US6830176B2 (en) * | 2002-02-01 | 2004-12-14 | Visteon Global Technologies, Inc. | System and method for repairing flex circuits |
US6722756B2 (en) | 2002-07-01 | 2004-04-20 | Hewlett-Packard Development Company, L.P. | Capping shroud for fluid ejection device |
US6764165B2 (en) | 2002-09-30 | 2004-07-20 | Hewlett-Packard Development Company, L.P. | Fluid ejection device and method of manufacturing a fluid ejection device |
JP3895697B2 (ja) * | 2003-03-03 | 2007-03-22 | 日東電工株式会社 | フレキシブル配線回路基板 |
US6877840B2 (en) * | 2003-04-30 | 2005-04-12 | Hewlett-Packard Development Company, L.P. | Fluid-ejection assembly |
US6736488B1 (en) | 2003-05-23 | 2004-05-18 | Hewlett-Packard Development Company, L.P. | Electrical interconnect for printhead assembly |
US6972480B2 (en) | 2003-06-16 | 2005-12-06 | Shellcase Ltd. | Methods and apparatus for packaging integrated circuit devices |
WO2005004195A2 (en) * | 2003-07-03 | 2005-01-13 | Shellcase Ltd. | Method and apparatus for packaging integrated circuit devices |
JP2007516602A (ja) * | 2003-09-26 | 2007-06-21 | テッセラ,インコーポレイテッド | 流動可能な伝導媒体を含むキャップ付きチップの製造構造および方法 |
US20050067681A1 (en) * | 2003-09-26 | 2005-03-31 | Tessera, Inc. | Package having integral lens and wafer-scale fabrication method therefor |
US20050116344A1 (en) * | 2003-10-29 | 2005-06-02 | Tessera, Inc. | Microelectronic element having trace formed after bond layer |
US20050139984A1 (en) * | 2003-12-19 | 2005-06-30 | Tessera, Inc. | Package element and packaged chip having severable electrically conductive ties |
US20050189622A1 (en) * | 2004-03-01 | 2005-09-01 | Tessera, Inc. | Packaged acoustic and electromagnetic transducer chips |
US20060183270A1 (en) * | 2005-02-14 | 2006-08-17 | Tessera, Inc. | Tools and methods for forming conductive bumps on microelectronic elements |
US8143095B2 (en) * | 2005-03-22 | 2012-03-27 | Tessera, Inc. | Sequential fabrication of vertical conductive interconnects in capped chips |
US20060232627A1 (en) * | 2005-03-31 | 2006-10-19 | Lexmark International, Inc. | Power distribution routing to reduce chip area |
US20070190747A1 (en) * | 2006-01-23 | 2007-08-16 | Tessera Technologies Hungary Kft. | Wafer level packaging to lidded chips |
US7936062B2 (en) * | 2006-01-23 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer level chip packaging |
US20080029879A1 (en) * | 2006-03-01 | 2008-02-07 | Tessera, Inc. | Structure and method of making lidded chips |
US8604605B2 (en) | 2007-01-05 | 2013-12-10 | Invensas Corp. | Microelectronic assembly with multi-layer support structure |
US20090260862A1 (en) * | 2008-04-16 | 2009-10-22 | Andrew Yaung | Circuit modification device for printed circuit boards |
US9007783B2 (en) * | 2011-05-31 | 2015-04-14 | Sony Corporation | Memory device and receptacle for electronic devices |
US9406817B2 (en) * | 2012-09-13 | 2016-08-02 | International Business Machines Corporation | Lead frame package for solar concentrators |
WO2019117937A1 (en) * | 2017-12-15 | 2019-06-20 | Hewlett-Packard Development Company, L.P. | Fluidic ejection controllers with selectively removable ejection boards |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3755892A (en) * | 1968-05-13 | 1973-09-04 | F Dieterich | Potentiometer contact springs |
US3803709A (en) * | 1973-03-01 | 1974-04-16 | Western Electric Co | Test probe for integrated circuit chips |
US3808506A (en) * | 1973-03-26 | 1974-04-30 | J Lang | Connector assembly for integrated circuit stack |
US3858154A (en) * | 1973-11-02 | 1974-12-31 | Gte Automatic Electric Lab Inc | Sliding three dimensional packaging technique |
US3952410A (en) * | 1974-03-28 | 1976-04-27 | Xynetics, Inc. | Probe card including a multiplicity of probe contacts and method of making |
US3890702A (en) * | 1974-04-03 | 1975-06-24 | Honeywell Inc | Method of making thermal recording print head |
US4155615A (en) * | 1978-01-24 | 1979-05-22 | Amp Incorporated | Multi-contact connector for ceramic substrate packages and the like |
US4342152A (en) * | 1980-01-30 | 1982-08-03 | Western Electric Company, Inc. | Methods of terminating and connectorizing cables |
JPS5838966U (ja) * | 1981-09-10 | 1983-03-14 | 伊勢電子工業株式会社 | 螢光表示管 |
FR2530384A1 (fr) * | 1982-07-15 | 1984-01-20 | Amp France | Procede et connecteur electrique pour terminer un conducteur d'un cable flexible plat |
US4701781A (en) * | 1984-07-05 | 1987-10-20 | National Semiconductor Corporation | Pre-testable semiconductor die package |
US4635073A (en) * | 1985-11-22 | 1987-01-06 | Hewlett Packard Company | Replaceable thermal ink jet component and thermosonic beam bonding process for fabricating same |
US4680859A (en) * | 1985-12-06 | 1987-07-21 | Hewlett-Packard Company | Thermal ink jet print head method of manufacture |
-
1987
- 1987-04-09 US US07/037,289 patent/US4806106A/en not_active Expired - Lifetime
-
1988
- 1988-02-10 CA CA000558647A patent/CA1295182C/en not_active Expired - Lifetime
- 1988-03-18 EP EP88302408A patent/EP0286258B1/de not_active Expired - Lifetime
- 1988-03-18 DE DE88302408T patent/DE3886082T2/de not_active Expired - Fee Related
- 1988-04-08 JP JP63087046A patent/JP2950831B2/ja not_active Expired - Lifetime
-
1996
- 1996-04-18 HK HK69196A patent/HK69196A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2950831B2 (ja) | 1999-09-20 |
JPS63265644A (ja) | 1988-11-02 |
US4806106A (en) | 1989-02-21 |
EP0286258B1 (de) | 1993-12-08 |
CA1295182C (en) | 1992-02-04 |
EP0286258A2 (de) | 1988-10-12 |
HK69196A (en) | 1996-04-26 |
DE3886082D1 (de) | 1994-01-20 |
EP0286258A3 (en) | 1990-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |