DE3886082T2 - Hybrider Kontaktrahmen für einen Wärmetintenstrahldruckkopf und Verfahren zu seiner Herstellung und Verbindung. - Google Patents

Hybrider Kontaktrahmen für einen Wärmetintenstrahldruckkopf und Verfahren zu seiner Herstellung und Verbindung.

Info

Publication number
DE3886082T2
DE3886082T2 DE88302408T DE3886082T DE3886082T2 DE 3886082 T2 DE3886082 T2 DE 3886082T2 DE 88302408 T DE88302408 T DE 88302408T DE 3886082 T DE3886082 T DE 3886082T DE 3886082 T2 DE3886082 T2 DE 3886082T2
Authority
DE
Germany
Prior art keywords
manufacture
connection
ink jet
thermal ink
jet printhead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88302408T
Other languages
English (en)
Other versions
DE3886082D1 (de
Inventor
Janet E Mebane
Lawrence W Chan
Duong Ton La
Ruben Nevarez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE3886082D1 publication Critical patent/DE3886082D1/de
Publication of DE3886082T2 publication Critical patent/DE3886082T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14024Assembling head parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14072Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • B41J2/1603Production of bubble jet print heads of the front shooter type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1629Manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14362Assembling elements of heads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49083Heater type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49099Coating resistive material on a base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device
DE88302408T 1987-04-09 1988-03-18 Hybrider Kontaktrahmen für einen Wärmetintenstrahldruckkopf und Verfahren zu seiner Herstellung und Verbindung. Expired - Fee Related DE3886082T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/037,289 US4806106A (en) 1987-04-09 1987-04-09 Interconnect lead frame for thermal ink jet printhead and methods of manufacture

Publications (2)

Publication Number Publication Date
DE3886082D1 DE3886082D1 (de) 1994-01-20
DE3886082T2 true DE3886082T2 (de) 1994-05-05

Family

ID=21893531

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88302408T Expired - Fee Related DE3886082T2 (de) 1987-04-09 1988-03-18 Hybrider Kontaktrahmen für einen Wärmetintenstrahldruckkopf und Verfahren zu seiner Herstellung und Verbindung.

Country Status (6)

Country Link
US (1) US4806106A (de)
EP (1) EP0286258B1 (de)
JP (1) JP2950831B2 (de)
CA (1) CA1295182C (de)
DE (1) DE3886082T2 (de)
HK (1) HK69196A (de)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68918074T2 (de) * 1988-12-29 1995-01-26 Canon Kk Tintenstrahlaufzeichnungskopf und Tintenstrahlaufzeichnungsgerät.
US4940413A (en) * 1989-07-26 1990-07-10 Hewlett-Packard Company Electrical make/break interconnect having high trace density
JPH03268952A (ja) * 1990-03-19 1991-11-29 Toshiba Corp サーマルヘッド
US5253415A (en) * 1990-03-20 1993-10-19 Die Tech, Inc. Method of making an integrated circuit substrate lead assembly
US5060370A (en) * 1990-10-15 1991-10-29 Scales Jr James W Modification method for etched printed circuit boards
US5189787A (en) * 1991-07-30 1993-03-02 Hewlett-Packard Company Attachment of a flexible circuit to an ink-jet pen
JPH05315021A (ja) * 1991-07-31 1993-11-26 Du Pont Singapore Pte Ltd コネクタ
JPH05326087A (ja) * 1991-08-15 1993-12-10 Du Pont Singapore Pte Ltd コネクタ及びこのコネクタを用いた電気的接続構造体
CA2085568C (en) 1991-12-19 2000-10-17 Kenjiro Watanabe Ink jet recording head, ink jet recording head cartridge and recording apparatus using same
US5343616B1 (en) * 1992-02-14 1998-12-29 Rock Ltd Method of making high density self-aligning conductive networks and contact clusters
US5434607A (en) * 1992-04-02 1995-07-18 Hewlett-Packard Company Attachment of nozzle plate to flexible circuit for facilitating assembly of printhead
DE69305418T2 (de) * 1992-05-22 1997-05-07 Tokyo Electric Co Ltd Auswechselbare Tintenstrahldruckkopf-Tintenkassetteanordnung
US5411343A (en) * 1992-07-31 1995-05-02 Hewlett-Packard Company Redundant make/break interconnect for a print head
US5442386A (en) * 1992-10-13 1995-08-15 Hewlett-Packard Company Structure and method for preventing ink shorting of conductors connected to printhead
US6003974A (en) * 1993-04-30 1999-12-21 Hewlett-Packard Company Unitary interconnect system for an inkjet printer
EP0622240B1 (de) * 1993-04-30 1998-06-10 Hewlett-Packard Company Modularer Wagenzusammenbau für einen Tintenstrahldrucker
US5471163A (en) * 1993-11-16 1995-11-28 Hewlett-Packard Company Tab circuit fusible links for disconnection or encoding information
US5565900A (en) * 1994-02-04 1996-10-15 Hewlett-Packard Company Unit print head assembly for ink-jet printing
US6305786B1 (en) 1994-02-23 2001-10-23 Hewlett-Packard Company Unit print head assembly for an ink-jet printer
US6070969A (en) * 1994-03-23 2000-06-06 Hewlett-Packard Company Thermal inkjet printhead having a preferred nucleation site
US5519421A (en) * 1994-07-18 1996-05-21 Hewlett-Packard Company Disruption of polymer surface of a nozzle member to inhibit adhesive flow
US5612511A (en) * 1995-09-25 1997-03-18 Hewlett-Packard Company Double-sided electrical interconnect flexible circuit for ink-jet hard copy systems
CH690479A5 (de) * 1995-10-26 2000-09-15 Reichle & De Massari Fa Verfahren und Anschluss-Vorrichtung zum Durchschalten einer Mehrzahl voneinander distanzierter elektrischer Kontaktstellen.
US5901425A (en) 1996-08-27 1999-05-11 Topaz Technologies Inc. Inkjet print head apparatus
JPH10329349A (ja) * 1997-05-30 1998-12-15 Seiko Instr Inc サーマルヘッド及びその製造方法
US6238845B1 (en) * 1997-11-13 2001-05-29 Texas Instruments Incorporated Method of forming lead frames with preformation support
US6161915A (en) * 1998-06-19 2000-12-19 Lexmark International, Inc Identification of thermal inkjet printer cartridges
US6227651B1 (en) 1998-09-25 2001-05-08 Hewlett-Packard Company Lead frame-mounted ink jet print head module
US6624979B1 (en) 2000-06-09 2003-09-23 Iomega Corporation Method and apparatus for parking and releasing a magnetic head
US6628474B1 (en) 2000-06-09 2003-09-30 Iomega Corporation Method and apparatus for electrostatic discharge protection in a removable cartridge
US6717762B1 (en) 2000-06-09 2004-04-06 Iomega Corporation Method and apparatus for making a drive compatible with a removable cartridge
US6633445B1 (en) 2000-06-09 2003-10-14 Iomega Corporation Method and apparatus for electrically coupling components in a removable cartridge
US6781782B2 (en) 2000-12-21 2004-08-24 Iomega Corporation Method and apparatus for saving calibration parameters for a removable cartridge
US6496362B2 (en) 2001-05-14 2002-12-17 Iomega Corporation Method and apparatus for protecting a hard disk drive from shock
US6779067B2 (en) 2001-05-14 2004-08-17 Iomega Corporation Method and apparatus for providing extended functionality for a bus
US6901525B2 (en) 2001-05-25 2005-05-31 Iomega Corporation Method and apparatus for managing power consumption on a bus
US7101021B2 (en) * 2001-07-30 2006-09-05 Seiko Epson Corporation Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip
US6856007B2 (en) * 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US20030042295A1 (en) * 2001-08-30 2003-03-06 Wong Marvin G. Self-adhesive flexible repair circuit
US6830176B2 (en) * 2002-02-01 2004-12-14 Visteon Global Technologies, Inc. System and method for repairing flex circuits
US6722756B2 (en) 2002-07-01 2004-04-20 Hewlett-Packard Development Company, L.P. Capping shroud for fluid ejection device
US6764165B2 (en) 2002-09-30 2004-07-20 Hewlett-Packard Development Company, L.P. Fluid ejection device and method of manufacturing a fluid ejection device
JP3895697B2 (ja) * 2003-03-03 2007-03-22 日東電工株式会社 フレキシブル配線回路基板
US6877840B2 (en) * 2003-04-30 2005-04-12 Hewlett-Packard Development Company, L.P. Fluid-ejection assembly
US6736488B1 (en) 2003-05-23 2004-05-18 Hewlett-Packard Development Company, L.P. Electrical interconnect for printhead assembly
US6972480B2 (en) 2003-06-16 2005-12-06 Shellcase Ltd. Methods and apparatus for packaging integrated circuit devices
WO2005004195A2 (en) * 2003-07-03 2005-01-13 Shellcase Ltd. Method and apparatus for packaging integrated circuit devices
JP2007516602A (ja) * 2003-09-26 2007-06-21 テッセラ,インコーポレイテッド 流動可能な伝導媒体を含むキャップ付きチップの製造構造および方法
US20050067681A1 (en) * 2003-09-26 2005-03-31 Tessera, Inc. Package having integral lens and wafer-scale fabrication method therefor
US20050116344A1 (en) * 2003-10-29 2005-06-02 Tessera, Inc. Microelectronic element having trace formed after bond layer
US20050139984A1 (en) * 2003-12-19 2005-06-30 Tessera, Inc. Package element and packaged chip having severable electrically conductive ties
US20050189622A1 (en) * 2004-03-01 2005-09-01 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
US20060183270A1 (en) * 2005-02-14 2006-08-17 Tessera, Inc. Tools and methods for forming conductive bumps on microelectronic elements
US8143095B2 (en) * 2005-03-22 2012-03-27 Tessera, Inc. Sequential fabrication of vertical conductive interconnects in capped chips
US20060232627A1 (en) * 2005-03-31 2006-10-19 Lexmark International, Inc. Power distribution routing to reduce chip area
US20070190747A1 (en) * 2006-01-23 2007-08-16 Tessera Technologies Hungary Kft. Wafer level packaging to lidded chips
US7936062B2 (en) * 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
US20080029879A1 (en) * 2006-03-01 2008-02-07 Tessera, Inc. Structure and method of making lidded chips
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
US20090260862A1 (en) * 2008-04-16 2009-10-22 Andrew Yaung Circuit modification device for printed circuit boards
US9007783B2 (en) * 2011-05-31 2015-04-14 Sony Corporation Memory device and receptacle for electronic devices
US9406817B2 (en) * 2012-09-13 2016-08-02 International Business Machines Corporation Lead frame package for solar concentrators
WO2019117937A1 (en) * 2017-12-15 2019-06-20 Hewlett-Packard Development Company, L.P. Fluidic ejection controllers with selectively removable ejection boards

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3755892A (en) * 1968-05-13 1973-09-04 F Dieterich Potentiometer contact springs
US3803709A (en) * 1973-03-01 1974-04-16 Western Electric Co Test probe for integrated circuit chips
US3808506A (en) * 1973-03-26 1974-04-30 J Lang Connector assembly for integrated circuit stack
US3858154A (en) * 1973-11-02 1974-12-31 Gte Automatic Electric Lab Inc Sliding three dimensional packaging technique
US3952410A (en) * 1974-03-28 1976-04-27 Xynetics, Inc. Probe card including a multiplicity of probe contacts and method of making
US3890702A (en) * 1974-04-03 1975-06-24 Honeywell Inc Method of making thermal recording print head
US4155615A (en) * 1978-01-24 1979-05-22 Amp Incorporated Multi-contact connector for ceramic substrate packages and the like
US4342152A (en) * 1980-01-30 1982-08-03 Western Electric Company, Inc. Methods of terminating and connectorizing cables
JPS5838966U (ja) * 1981-09-10 1983-03-14 伊勢電子工業株式会社 螢光表示管
FR2530384A1 (fr) * 1982-07-15 1984-01-20 Amp France Procede et connecteur electrique pour terminer un conducteur d'un cable flexible plat
US4701781A (en) * 1984-07-05 1987-10-20 National Semiconductor Corporation Pre-testable semiconductor die package
US4635073A (en) * 1985-11-22 1987-01-06 Hewlett Packard Company Replaceable thermal ink jet component and thermosonic beam bonding process for fabricating same
US4680859A (en) * 1985-12-06 1987-07-21 Hewlett-Packard Company Thermal ink jet print head method of manufacture

Also Published As

Publication number Publication date
JP2950831B2 (ja) 1999-09-20
JPS63265644A (ja) 1988-11-02
US4806106A (en) 1989-02-21
EP0286258B1 (de) 1993-12-08
CA1295182C (en) 1992-02-04
EP0286258A2 (de) 1988-10-12
HK69196A (en) 1996-04-26
DE3886082D1 (de) 1994-01-20
EP0286258A3 (en) 1990-07-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee