DE3886384T2 - Selbstausrichtende anordnung für flüssigkeitskühlung. - Google Patents

Selbstausrichtende anordnung für flüssigkeitskühlung.

Info

Publication number
DE3886384T2
DE3886384T2 DE88909948T DE3886384T DE3886384T2 DE 3886384 T2 DE3886384 T2 DE 3886384T2 DE 88909948 T DE88909948 T DE 88909948T DE 3886384 T DE3886384 T DE 3886384T DE 3886384 T2 DE3886384 T2 DE 3886384T2
Authority
DE
Germany
Prior art keywords
self
liquid cooling
cooling arrangement
adjusting liquid
adjusting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE88909948T
Other languages
English (en)
Other versions
DE3886384D1 (de
Inventor
George Adrian
Edward Nicol
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Unisys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisys Corp filed Critical Unisys Corp
Application granted granted Critical
Publication of DE3886384D1 publication Critical patent/DE3886384D1/de
Publication of DE3886384T2 publication Critical patent/DE3886384T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
DE88909948T 1987-10-13 1988-10-06 Selbstausrichtende anordnung für flüssigkeitskühlung. Expired - Lifetime DE3886384T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/108,367 US4791983A (en) 1987-10-13 1987-10-13 Self-aligning liquid-cooling assembly
PCT/US1988/003428 WO1989003590A1 (en) 1987-10-13 1988-10-06 Self-aligning liquid-cooling assembly

Publications (2)

Publication Number Publication Date
DE3886384D1 DE3886384D1 (de) 1994-01-27
DE3886384T2 true DE3886384T2 (de) 1994-04-07

Family

ID=22321807

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88909948T Expired - Lifetime DE3886384T2 (de) 1987-10-13 1988-10-06 Selbstausrichtende anordnung für flüssigkeitskühlung.

Country Status (5)

Country Link
US (1) US4791983A (de)
EP (1) EP0340284B1 (de)
JP (1) JPH02501695A (de)
DE (1) DE3886384T2 (de)
WO (1) WO1989003590A1 (de)

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CA1283225C (en) * 1987-11-09 1991-04-16 Shinji Mine Cooling system for three-dimensional ic package
EP0320198B1 (de) * 1987-12-07 1995-03-01 Nec Corporation Kühlungssystem für integrierte Schaltungspackung
US4809134A (en) * 1988-04-18 1989-02-28 Unisys Corporation Low stress liquid cooling assembly
EP0341950B1 (de) * 1988-05-09 1994-09-14 Nec Corporation Flache Kühlungsstruktur für integrierte Schaltung
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
DE68925403T2 (de) * 1988-09-20 1996-05-30 Nec Corp Kühlungsstruktur für elektronische Bauelemente
US4882654A (en) * 1988-12-22 1989-11-21 Microelectronics And Computer Technology Corporation Method and apparatus for adjustably mounting a heat exchanger for an electronic component
JPH03208365A (ja) * 1990-01-10 1991-09-11 Hitachi Ltd 電子装置の冷却機構及びその使用方法
US5046552A (en) * 1990-07-20 1991-09-10 Minnesota Mining And Manufacturing Flow-through heat transfer apparatus with movable thermal via
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
CA2070062C (en) * 1991-05-30 1997-01-07 Hironobu Ikeda Cooling structure for integrated circuits
US5205348A (en) * 1991-05-31 1993-04-27 Minnesota Mining And Manufacturing Company Semi-rigid heat transfer devices
US5263536A (en) * 1991-07-19 1993-11-23 Thermo Electron Technologies Corp. Miniature heat exchanger
JP2852148B2 (ja) * 1991-10-21 1999-01-27 日本電気株式会社 集積回路パッケージの冷却構造
JPH06266474A (ja) * 1993-03-17 1994-09-22 Hitachi Ltd 電子機器装置及びラップトップ型電子機器装置
US5459352A (en) * 1993-03-31 1995-10-17 Unisys Corporation Integrated circuit package having a liquid metal-aluminum/copper joint
JP2500757B2 (ja) * 1993-06-21 1996-05-29 日本電気株式会社 集積回路の冷却構造
EP0709885A3 (de) * 1994-10-31 1997-08-27 At & T Corp Baugruppe mit integriertem, geschlossenem Kühlkreislaufsystem
US5802707A (en) * 1996-03-28 1998-09-08 Intel Corporation Controlled bondline thickness attachment mechanism
KR20010024447A (ko) 1997-10-07 2001-03-26 릴라이어빌리티 인코포레이티드 적응성 있는 방열 장치를 구비한 번인 보드
CN1274518A (zh) 1997-10-07 2000-11-22 可靠公司 具有高功耗的老化板
US6161612A (en) * 1998-06-02 2000-12-19 Ericsson Inc. Cooling system and method for distributing cooled air
JP3315649B2 (ja) 1998-08-11 2002-08-19 富士通株式会社 電子機器
US6700396B1 (en) 2001-05-16 2004-03-02 Ltx Corporation Integrated micromachine relay for automated test equipment applications
CA2352997A1 (en) 2001-07-13 2003-01-13 Coolit Systems Inc. Computer cooling apparatus
US7739883B2 (en) * 2001-07-13 2010-06-22 Coolit Systems Inc. Computer cooling apparatus
US20030033346A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for managing multiple resources in a system
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US7133907B2 (en) 2001-10-18 2006-11-07 Sun Microsystems, Inc. Method, system, and program for configuring system resources
US6965559B2 (en) * 2001-10-19 2005-11-15 Sun Microsystems, Inc. Method, system, and program for discovering devices communicating through a switch
US20050039880A1 (en) * 2001-12-26 2005-02-24 Scott Alexander Robin Walter Computer cooling apparatus
US20080006037A1 (en) * 2001-12-26 2008-01-10 Coolit Systems Inc. Computer cooling apparatus
US7103889B2 (en) 2002-07-23 2006-09-05 Sun Microsystems, Inc. Method, system, and article of manufacture for agent processing
US7143615B2 (en) 2002-07-31 2006-12-05 Sun Microsystems, Inc. Method, system, and program for discovering components within a network
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
US7032651B2 (en) * 2003-06-23 2006-04-25 Raytheon Company Heat exchanger
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7243704B2 (en) * 2004-11-18 2007-07-17 Delta Design, Inc. Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end
US7515418B2 (en) * 2005-09-26 2009-04-07 Curtiss-Wright Controls, Inc. Adjustable height liquid cooler in liquid flow through plate
US7298618B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
WO2007098078A2 (en) * 2006-02-16 2007-08-30 Cooligy, Inc. Liquid cooling loops for server applications
US20070227709A1 (en) * 2006-03-30 2007-10-04 Girish Upadhya Multi device cooling
WO2007120530A2 (en) 2006-03-30 2007-10-25 Cooligy, Inc. Integrated liquid to air conduction module
US20070256815A1 (en) * 2006-05-04 2007-11-08 Cooligy, Inc. Scalable liquid cooling system with modular radiators
CA2573941A1 (en) * 2007-01-15 2008-07-15 Coolit Systems Inc. Computer cooling system
WO2008137143A1 (en) * 2007-05-02 2008-11-13 Cooligy Inc. Micro-tube/multi-port counter flow radiator design for electronic cooling applications
FI120219B (fi) * 2007-06-29 2009-07-31 Abb Oy Jäähdytyselementti
TW200924625A (en) 2007-08-07 2009-06-01 Cooligy Inc Deformable duct guides that accommodate electronic connection lines
US7508676B1 (en) * 2008-04-11 2009-03-24 International Business Machines Corporation Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability
US20100129140A1 (en) * 2008-11-26 2010-05-27 Coolit Systems Inc. Connector for a liquid cooling system in a computer
US9500701B2 (en) * 2010-03-17 2016-11-22 Delta Design, Inc. Alignment mechanism
US8477500B2 (en) * 2010-05-25 2013-07-02 General Electric Company Locking device and method for making the same
US9472487B2 (en) * 2012-04-02 2016-10-18 Raytheon Company Flexible electronic package integrated heat exchanger with cold plate and risers
JP5408285B2 (ja) * 2012-04-27 2014-02-05 ダイキン工業株式会社 冷却器、電装品ユニット及び冷凍装置
DE112017007720T5 (de) * 2017-07-03 2020-03-19 Mitsubishi Electric Corporation Kühlkörper
US10575438B1 (en) * 2018-12-14 2020-02-25 Juniper Networks, Inc Apparatus, system, and method for cooling multi-chip modules via clustered fluid-cooled plates

Family Cites Families (8)

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Publication number Priority date Publication date Assignee Title
US3481393A (en) * 1968-01-15 1969-12-02 Ibm Modular cooling system
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
US4093971A (en) * 1976-12-10 1978-06-06 Burroughs Corporation D-I-P On island
US4193445A (en) * 1978-06-29 1980-03-18 International Business Machines Corporation Conduction cooled module
US4235283A (en) * 1979-12-17 1980-11-25 International Business Machines Corporation Multi-stud thermal conduction module
US4448240A (en) * 1982-12-20 1984-05-15 International Business Machines Corporation Telescoping thermal conduction element for cooling semiconductor devices
JPS59200495A (ja) * 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル
US4671204A (en) * 1986-05-16 1987-06-09 Varian Associates, Inc. Low compliance seal for gas-enhanced wafer cooling in vacuum

Also Published As

Publication number Publication date
EP0340284B1 (de) 1993-12-15
DE3886384D1 (de) 1994-01-27
JPH0418469B2 (de) 1992-03-27
JPH02501695A (ja) 1990-06-07
US4791983A (en) 1988-12-20
EP0340284A1 (de) 1989-11-08
WO1989003590A1 (en) 1989-04-20

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