DE3888476T2 - Elektrische Kontaktstellen und damit versehene Gehäuse. - Google Patents

Elektrische Kontaktstellen und damit versehene Gehäuse.

Info

Publication number
DE3888476T2
DE3888476T2 DE3888476T DE3888476T DE3888476T2 DE 3888476 T2 DE3888476 T2 DE 3888476T2 DE 3888476 T DE3888476 T DE 3888476T DE 3888476 T DE3888476 T DE 3888476T DE 3888476 T2 DE3888476 T2 DE 3888476T2
Authority
DE
Germany
Prior art keywords
electrical contact
contact points
housings provided
housings
points
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3888476T
Other languages
English (en)
Other versions
DE3888476D1 (de
Inventor
Toshio Tsuda
Yasuhiko Horio
Yoshihiro Bessho
Toru Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62309805A external-priority patent/JP2506861B2/ja
Priority claimed from JP18493688A external-priority patent/JPH063820B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE3888476D1 publication Critical patent/DE3888476D1/de
Publication of DE3888476T2 publication Critical patent/DE3888476T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • H01L2224/02Bonding areas; Manufacturing methods related thereto
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    • H01L2224/0554External layer
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    • H01L2224/05617Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • Y10T29/49149Assembling terminal to base by metal fusion bonding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • Y10T29/49151Assembling terminal to base by deforming or shaping
DE3888476T 1987-12-08 1988-12-07 Elektrische Kontaktstellen und damit versehene Gehäuse. Expired - Lifetime DE3888476T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62309805A JP2506861B2 (ja) 1987-12-08 1987-12-08 電気的接続接点の形成方法
JP18493688A JPH063820B2 (ja) 1988-07-25 1988-07-25 半導体装置の実装方法

Publications (2)

Publication Number Publication Date
DE3888476D1 DE3888476D1 (de) 1994-04-21
DE3888476T2 true DE3888476T2 (de) 1994-09-29

Family

ID=26502799

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3888476T Expired - Lifetime DE3888476T2 (de) 1987-12-08 1988-12-07 Elektrische Kontaktstellen und damit versehene Gehäuse.

Country Status (5)

Country Link
US (2) US5014111A (de)
EP (1) EP0320244B1 (de)
KR (1) KR910009780B1 (de)
DE (1) DE3888476T2 (de)
HK (1) HK89096A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004059389A1 (de) * 2004-12-09 2006-06-14 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Kontaktierung eines Halbleiterbauelements

Families Citing this family (138)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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DE3888476D1 (de) 1994-04-21
EP0320244A2 (de) 1989-06-14
US5090119A (en) 1992-02-25
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US5014111A (en) 1991-05-07
EP0320244A3 (en) 1990-10-10

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