DE502004004323D1 - Gehäuseanordnung - Google Patents

Gehäuseanordnung

Info

Publication number
DE502004004323D1
DE502004004323D1 DE502004004323T DE502004004323T DE502004004323D1 DE 502004004323 D1 DE502004004323 D1 DE 502004004323D1 DE 502004004323 T DE502004004323 T DE 502004004323T DE 502004004323 T DE502004004323 T DE 502004004323T DE 502004004323 D1 DE502004004323 D1 DE 502004004323D1
Authority
DE
Germany
Prior art keywords
housing arrangement
housing
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE502004004323T
Other languages
English (en)
Inventor
Martin Doerrich
Michael Nicolai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rittal GmbH and Co KG
Original Assignee
Rittal GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rittal GmbH and Co KG filed Critical Rittal GmbH and Co KG
Publication of DE502004004323D1 publication Critical patent/DE502004004323D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
DE502004004323T 2004-02-17 2004-11-20 Gehäuseanordnung Active DE502004004323D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004008461A DE102004008461A1 (de) 2004-02-17 2004-02-17 Gehäuseanordnung
PCT/EP2004/013199 WO2005081604A1 (de) 2004-02-17 2004-11-20 Gehäuseanordnung

Publications (1)

Publication Number Publication Date
DE502004004323D1 true DE502004004323D1 (de) 2007-08-23

Family

ID=34877063

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102004008461A Withdrawn DE102004008461A1 (de) 2004-02-17 2004-02-17 Gehäuseanordnung
DE502004004323T Active DE502004004323D1 (de) 2004-02-17 2004-11-20 Gehäuseanordnung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102004008461A Withdrawn DE102004008461A1 (de) 2004-02-17 2004-02-17 Gehäuseanordnung

Country Status (8)

Country Link
US (1) US7466549B2 (de)
EP (1) EP1719397B1 (de)
JP (1) JP4404910B2 (de)
CN (1) CN100452953C (de)
DE (2) DE102004008461A1 (de)
ES (1) ES2287791T3 (de)
RU (1) RU2321975C2 (de)
WO (1) WO2005081604A1 (de)

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TW201004545A (en) * 2008-07-02 2010-01-16 Ming-Chang Lai Pipe module of a cabinet for housing electronic equipment
US7817423B2 (en) * 2006-03-06 2010-10-19 Graham Andrew Morehead Peltier-assisted liquid-cooled computer enclosure
DE202006007275U1 (de) * 2006-05-06 2006-09-07 Schroff Gmbh Baugruppenträger mit einem Gehäuse zur Aufnahme von Steckbaugruppen
CN100403223C (zh) * 2006-09-04 2008-07-16 曙光信息产业(北京)有限公司 一种刀片服务器机箱
DE502007001183D1 (de) * 2007-01-23 2009-09-10 Schroff Gmbh Schaltschrank zur Aufnahme elektronischer Steckbaugruppen mit einem Wärmetauscher
US9496200B2 (en) 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
DE102007061593B4 (de) * 2007-12-20 2012-02-16 Siemens Ag Elektronikeinrichtung eines Magnetresonanzgeräts sowie Magnetresonanzgerät mit einer solchen Elektronikeinrichtung
WO2009096974A1 (en) * 2008-01-31 2009-08-06 Hewlett-Packard Development Company, L.P. Modular data processing components and systems
US8164901B2 (en) * 2008-04-16 2012-04-24 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
US7639499B1 (en) * 2008-07-07 2009-12-29 International Business Machines Corporation Liquid cooling apparatus and method for facilitating cooling of an electronics system
US7944694B2 (en) 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7983040B2 (en) 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7961475B2 (en) 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7916483B2 (en) 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7885070B2 (en) 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
DE102009006924B3 (de) * 2009-02-02 2010-08-05 Knürr AG Betriebsverfahren und Anordnung zum Kühlen von elektrischen und elektronischen Bauelementen und Moduleinheiten in Geräteschränken
US7978472B2 (en) * 2009-06-10 2011-07-12 International Business Machines Corporation Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
TWI487473B (zh) * 2011-05-06 2015-06-01 Ind Tech Res Inst 資料中心之冷卻系統
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
US9016352B2 (en) 2012-05-21 2015-04-28 Calvary Applied Technologies, LLC Apparatus and methods for cooling rejected heat from server racks
WO2013179449A1 (ja) * 2012-05-31 2013-12-05 富士通株式会社 ラック型情報処理装置
IN2015DN03088A (de) * 2012-09-25 2015-10-02 Liquidcool Solutions Inc
US8436246B1 (en) 2012-10-19 2013-05-07 Calvary Applied Technologies, LLC Refrigerant line electrical ground isolation device for data center cooling applications
US9049800B2 (en) * 2013-02-01 2015-06-02 Dell Products L.P. Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet
FR3002624B1 (fr) * 2013-02-28 2015-02-27 Bull Sas Repartiteur hydraulique
CN104349638B (zh) 2013-07-24 2017-04-26 华为技术有限公司 机柜液冷系统及机柜
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
WO2021229365A1 (en) 2020-05-11 2021-11-18 Coolit Systems, Inc. Liquid pumping units, and related systems and methods

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
DE8028580U1 (de) * 1980-10-27 1981-04-09 Nell, Karl-Heinz, 8990 Lindau Sanitaer-verteiler
IT1191604B (it) * 1986-06-09 1988-03-23 Ciro Mastromatteo Collettori per fluidi
JPS63131556A (ja) * 1986-11-21 1988-06-03 Nec Corp 回路基板の冷却装置
JPH01286397A (ja) * 1988-05-11 1989-11-17 Nec Corp 電子回路基板冷却装置
DE9003687U1 (de) 1990-03-29 1990-05-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
SE469298B (sv) * 1991-10-24 1993-06-14 Ericsson Telefon Ab L M Anordning foer kylning av elektronik medelst straalningsoeverfoering
DE4327444A1 (de) * 1993-08-14 1995-02-16 Indramat Gmbh Kühleinrichtung für einen Schaltschrank
EP0767601A1 (de) 1995-10-02 1997-04-09 General Electric Company Mechanische Anordnung für eine mittels einer Flüssigkeit gekühlte elektronische Schaltung
JP3315649B2 (ja) * 1998-08-11 2002-08-19 富士通株式会社 電子機器
US6519955B2 (en) * 2000-04-04 2003-02-18 Thermal Form & Function Pumped liquid cooling system using a phase change refrigerant
DE10112389A1 (de) * 2001-03-15 2002-10-02 Martin Hess Mobilfunkstation
JP2002374086A (ja) * 2001-06-15 2002-12-26 Hitachi Ltd ラックマウント搭載型情報処理装置の冷却方法
DE10210480B4 (de) * 2002-03-11 2005-07-21 Rittal Gmbh & Co. Kg Kühlanordnung
US6714412B1 (en) * 2002-09-13 2004-03-30 International Business Machines Corporation Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use
US6807056B2 (en) * 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
US7484552B2 (en) * 2003-12-19 2009-02-03 Amphenol Corporation Modular rackmount chiller
US7257000B2 (en) * 2004-07-07 2007-08-14 Amphenol Corporation Thermally enhanced pressure regulation of electronics cooling system
US7342789B2 (en) * 2005-06-30 2008-03-11 International Business Machines Corporation Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling

Also Published As

Publication number Publication date
CN100452953C (zh) 2009-01-14
RU2321975C2 (ru) 2008-04-10
EP1719397B1 (de) 2007-07-11
ES2287791T3 (es) 2007-12-16
EP1719397A1 (de) 2006-11-08
RU2006108384A (ru) 2006-07-27
JP2007535136A (ja) 2007-11-29
JP4404910B2 (ja) 2010-01-27
US20070121287A1 (en) 2007-05-31
US7466549B2 (en) 2008-12-16
CN1826849A (zh) 2006-08-30
DE102004008461A1 (de) 2005-10-06
WO2005081604A1 (de) 2005-09-01

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