DE502007005443D1 - Verfahren zur herstellung eines elektrischen widerstands auf einem substrat - Google Patents

Verfahren zur herstellung eines elektrischen widerstands auf einem substrat

Info

Publication number
DE502007005443D1
DE502007005443D1 DE502007005443T DE502007005443T DE502007005443D1 DE 502007005443 D1 DE502007005443 D1 DE 502007005443D1 DE 502007005443 T DE502007005443 T DE 502007005443T DE 502007005443 T DE502007005443 T DE 502007005443T DE 502007005443 D1 DE502007005443 D1 DE 502007005443D1
Authority
DE
Germany
Prior art keywords
substrate
layer
producing
resistor
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE502007005443T
Other languages
English (en)
Inventor
Walter Roethlingshoefer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of DE502007005443D1 publication Critical patent/DE502007005443D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component
DE502007005443T 2006-12-21 2007-11-02 Verfahren zur herstellung eines elektrischen widerstands auf einem substrat Active DE502007005443D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006060634A DE102006060634A1 (de) 2006-12-21 2006-12-21 Verfahren zur Herstellung eines elektrischen Widerstands auf einem Substrat
PCT/EP2007/061831 WO2008077671A1 (de) 2006-12-21 2007-11-02 Verfahren zur herstellung eines elektrischen widerstands auf einem substrat

Publications (1)

Publication Number Publication Date
DE502007005443D1 true DE502007005443D1 (de) 2010-12-02

Family

ID=39262787

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102006060634A Withdrawn DE102006060634A1 (de) 2006-12-21 2006-12-21 Verfahren zur Herstellung eines elektrischen Widerstands auf einem Substrat
DE502007005443T Active DE502007005443D1 (de) 2006-12-21 2007-11-02 Verfahren zur herstellung eines elektrischen widerstands auf einem substrat

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102006060634A Withdrawn DE102006060634A1 (de) 2006-12-21 2006-12-21 Verfahren zur Herstellung eines elektrischen Widerstands auf einem Substrat

Country Status (6)

Country Link
US (1) US8115589B2 (de)
EP (1) EP2127505B1 (de)
JP (1) JP4763833B2 (de)
AT (1) ATE485705T1 (de)
DE (2) DE102006060634A1 (de)
WO (1) WO2008077671A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017114891A1 (de) * 2017-07-04 2019-01-10 Rogers Germany Gmbh Verfahren zur Herstellung einer Durchkontaktierung in einer aus einer Keramik gefertigten Trägerschicht und Trägerschicht mit Durchkontaktierung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3413240A (en) * 1965-03-25 1968-11-26 Du Pont Compositions
JPS5852900A (ja) * 1981-09-24 1983-03-29 株式会社日立製作所 セラミツク多層配線板の製造方法
JPH0691323B2 (ja) * 1989-02-25 1994-11-14 大陽誘電株式会社 低温焼成型セラミック多層配線基板
DE3915106A1 (de) 1989-05-09 1990-11-15 Haendler Metall & Masch Geraet zum ausstossen eines koerpers, insbesondere einer warenpackung
EP0415571A3 (de) * 1989-08-07 1991-03-13 Ford Motor Company Limited Dickschichtwiderstände und Verfahren zu ihrer Herstellung
GB8920745D0 (en) * 1989-09-13 1989-10-25 Ici Plc Thick film resistor/integrated circuit substrate and method of manufacture
US5221644A (en) * 1991-12-13 1993-06-22 Delco Electronics Corporation Thick film sense resistor composition and method of using the same
US5345212A (en) * 1993-07-07 1994-09-06 National Starch And Chemical Investment Holding Corporation Power surge resistor with palladium and silver composition
JPH07320534A (ja) 1994-05-26 1995-12-08 Mitsubishi Materials Corp 厚膜導体およびその形成方法ならびにその使用方法
JP3093601B2 (ja) 1994-09-28 2000-10-03 株式会社住友金属エレクトロデバイス セラミック回路基板
JP2896996B2 (ja) * 1996-08-27 1999-05-31 釜屋電機株式会社 低抵抗チップ抵抗器及びその製造方法
US6127052A (en) * 1997-06-10 2000-10-03 Canon Kabushiki Kaisha Substrate and method for producing it
JPH1117343A (ja) * 1997-06-24 1999-01-22 Tdk Corp セラミック基体の製造方法
US5889445A (en) * 1997-07-22 1999-03-30 Avx Corporation Multilayer ceramic RC device
JPH11195505A (ja) * 1997-12-26 1999-07-21 E I Du Pont De Nemours & Co 厚膜抵抗体及びその製造方法
DE19953594A1 (de) * 1998-11-20 2000-05-25 Matsushita Electric Ind Co Ltd Oberflächenmontierte elektronische Komponente
DE10144364A1 (de) * 2001-09-10 2003-04-03 Epcos Ag Elektrisches Vielschichtbauelement
US7127809B2 (en) 2004-03-18 2006-10-31 Northrop Grumman Corporation Method of forming one or more base structures on an LTCC cofired module

Also Published As

Publication number Publication date
US8115589B2 (en) 2012-02-14
JP4763833B2 (ja) 2011-08-31
DE102006060634A1 (de) 2008-06-26
ATE485705T1 (de) 2010-11-15
WO2008077671A1 (de) 2008-07-03
EP2127505B1 (de) 2010-10-20
EP2127505A1 (de) 2009-12-02
JP2010514175A (ja) 2010-04-30
US20100039213A1 (en) 2010-02-18

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