DE59104416D1 - Verfahren und Einrichtung zur Messung der Schwingungsamplitude an einem Energietransducer. - Google Patents
Verfahren und Einrichtung zur Messung der Schwingungsamplitude an einem Energietransducer.Info
- Publication number
- DE59104416D1 DE59104416D1 DE59104416T DE59104416T DE59104416D1 DE 59104416 D1 DE59104416 D1 DE 59104416D1 DE 59104416 T DE59104416 T DE 59104416T DE 59104416 T DE59104416 T DE 59104416T DE 59104416 D1 DE59104416 D1 DE 59104416D1
- Authority
- DE
- Germany
- Prior art keywords
- energy transducer
- bonding
- head
- measuring
- correction factor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
- H01L2224/85207—Thermosonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH47191 | 1991-02-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE59104416D1 true DE59104416D1 (de) | 1995-03-09 |
Family
ID=4187762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE59104416T Expired - Fee Related DE59104416D1 (de) | 1991-02-15 | 1991-11-14 | Verfahren und Einrichtung zur Messung der Schwingungsamplitude an einem Energietransducer. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5199630A (de) |
EP (1) | EP0498936B1 (de) |
JP (1) | JP3178874B2 (de) |
AT (1) | ATE117611T1 (de) |
DE (1) | DE59104416D1 (de) |
HK (1) | HK103495A (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2705423B2 (ja) * | 1992-01-24 | 1998-01-28 | 株式会社日立製作所 | 超音波接合装置及び品質モニタリング方法 |
JP3128710B2 (ja) * | 1992-08-12 | 2001-01-29 | 株式会社新川 | ワイヤボンデイング方法 |
DE4400210A1 (de) * | 1994-01-05 | 1995-08-10 | Branson Ultraschall | Verfahren und Einrichtung zum Betrieb eines Generators zur HF-Energieversorgung eines Ultraschallwandlers |
DE4447073C1 (de) * | 1994-12-29 | 1996-07-18 | Bosch Gmbh Robert | Verfahren zum Prüfen von durch Ultraschalldrahtbonden hergestellten Verbindungen |
US5608172A (en) * | 1995-03-16 | 1997-03-04 | Texas Instruments Incorporated | Die bond touch down detector |
DE19512820B4 (de) * | 1995-04-05 | 2005-11-03 | Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co | Verfahren und Vorrichtung zum Einstellen der Arbeitsfrequenz eines Orbitalvibrationsschweißsystems |
DE69614544T2 (de) | 1995-06-26 | 2002-04-04 | Minnesota Mining & Mfg | Schweisssteuereinrichtung |
AU7124696A (en) * | 1995-08-15 | 1997-03-12 | Hesse & Knipps Gmbh | Wire-guiding device |
DE59804204D1 (de) | 1997-09-20 | 2002-06-27 | Hesse & Knipps Gmbh | Drahtbremse |
JP3631030B2 (ja) * | 1998-01-23 | 2005-03-23 | 株式会社ハイニックスセミコンダクター | ワイヤボンダ装備のx、y、z軸駆動装置及びその位置制御方法 |
DE19810509C2 (de) * | 1998-03-11 | 2000-02-10 | Fraunhofer Ges Forschung | Vorrichtung zum Schweißen mit Ultraschall |
JP3176580B2 (ja) * | 1998-04-09 | 2001-06-18 | 太陽誘電株式会社 | 電子部品の実装方法及び実装装置 |
DE19924623A1 (de) * | 1999-05-28 | 2000-11-30 | Herrmann Ultraschalltechnik | Verfahren zum Steuern und Regeln von Prozessparametern einer Ultraschallschweisseinrichtung |
US6827247B1 (en) * | 1999-12-08 | 2004-12-07 | Asm Technology Singapore Pte Ltd. | Apparatus for detecting the oscillation amplitude of an oscillating object |
KR100896828B1 (ko) * | 2001-10-26 | 2009-05-12 | 외르리콘 어셈블리 이큅먼트 아게, 슈타인하우젠 | 와이어 본더를 보정하는 방법 |
EP1306159B1 (de) * | 2001-10-26 | 2005-08-10 | Unaxis International Trading Ltd | Verfahren für die Kalibrierung eines Wire Bonders |
KR20030066348A (ko) * | 2002-02-01 | 2003-08-09 | 에섹 트레이딩 에스에이 | 와이어본더의 보정을 위한 방법 |
KR100903458B1 (ko) * | 2002-02-28 | 2009-06-18 | 외르리콘 어셈블리 이큅먼트 아게, 슈타인하우젠 | 와이어 본더의 자유 진동하는 모세관의 진폭을 측정하기위한 방법 및 장치 |
EP1340582A1 (de) * | 2002-02-28 | 2003-09-03 | Esec Trading S.A. | Verfahren und Einrichtung für die Messung der Amplitude einer frei schwingenden Kapillare eines Wire Bonders |
TW575932B (en) * | 2002-12-17 | 2004-02-11 | Ind Tech Res Inst | Structure and method for testing etching rate |
EP1431729A1 (de) * | 2002-12-20 | 2004-06-23 | Esec Trading S.A. | Einrichtung zur Messung der Schwingungsamplitude der Spitze einer Kapillare |
DE10357418B4 (de) * | 2002-12-20 | 2005-06-16 | Esec Trading S.A. | Einrichtung zur Messung der Schwingungsamplitude der Spitze einer Kapillare |
KR20040089480A (ko) * | 2003-04-14 | 2004-10-21 | 에섹 트레이딩 에스에이 | 모세관과 이미지 인식 시스템 사이의 벡터 거리를결정하는 장치를 갖는 와이어 본더 및 그 방법 |
DE102004026826B4 (de) * | 2004-05-28 | 2010-01-14 | Schunk Ultraschalltechnik Gmbh | Ultraschallschweißvorrichtung und Konverter einer Ultraschallschweißvorrichtung |
US7819013B2 (en) * | 2006-07-05 | 2010-10-26 | The Hong Kong Polytechnic University | Method and apparatus for measuring oscillation amplitude of an ultrasonic device |
ATE472387T1 (de) | 2006-09-05 | 2010-07-15 | Univ Berlin Tech | Verfahren und vorrichtung zur regelung der herstellung von drahtbondverbindungen |
EP3603826B1 (de) * | 2018-07-31 | 2023-05-10 | Infineon Technologies AG | Verfahren zur kalibrierung einer ultraschallverbindungsmaschine |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1506164A (en) * | 1974-07-09 | 1978-04-05 | Mullard Ltd | Ultrasonic bonding apparatus |
DE3241710A1 (de) * | 1982-11-11 | 1984-05-17 | Diffracto Ltd., Windsor, Ontario | Verfahren und vorrichtung zur pruefung von teilen oder werkstuecken |
DE3701652A1 (de) * | 1987-01-21 | 1988-08-04 | Siemens Ag | Ueberwachung von bondparametern waehrend des bondvorganges |
EP0317787B2 (de) * | 1987-11-25 | 1997-05-07 | Esec Sa | Einrichtung zur Durchführung der Zustellbewegung eines Arbeitsorgans zu einer Arbeitsstation |
EP0340506B1 (de) * | 1988-05-05 | 1994-02-02 | Esec Sa | Vorrichtung zur ultraschallkontaktierenden Drahtverbindung an elektronischen Komponenten |
EP0342358A1 (de) * | 1988-05-18 | 1989-11-23 | Esec Sa | Verfahren und Einrichtung zum Bereitstellen eines Bonddrahtes |
-
1991
- 1991-11-14 AT AT91119407T patent/ATE117611T1/de not_active IP Right Cessation
- 1991-11-14 EP EP91119407A patent/EP0498936B1/de not_active Expired - Lifetime
- 1991-11-14 DE DE59104416T patent/DE59104416D1/de not_active Expired - Fee Related
- 1991-12-24 JP JP35554191A patent/JP3178874B2/ja not_active Expired - Fee Related
-
1992
- 1992-01-22 US US07/824,133 patent/US5199630A/en not_active Expired - Lifetime
-
1995
- 1995-06-29 HK HK103495A patent/HK103495A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0498936A1 (de) | 1992-08-19 |
EP0498936B1 (de) | 1995-01-25 |
HK103495A (en) | 1995-07-07 |
JP3178874B2 (ja) | 2001-06-25 |
US5199630A (en) | 1993-04-06 |
ATE117611T1 (de) | 1995-02-15 |
JPH04319627A (ja) | 1992-11-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: ESEC TRADING S.A., CHAM, CH |
|
8339 | Ceased/non-payment of the annual fee |