DE59813564D1 - Verfahren zur Herstellung einer Chipkarte - Google Patents
Verfahren zur Herstellung einer ChipkarteInfo
- Publication number
- DE59813564D1 DE59813564D1 DE59813564T DE59813564T DE59813564D1 DE 59813564 D1 DE59813564 D1 DE 59813564D1 DE 59813564 T DE59813564 T DE 59813564T DE 59813564 T DE59813564 T DE 59813564T DE 59813564 D1 DE59813564 D1 DE 59813564D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- chip card
- card
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE59813564T DE59813564D1 (de) | 1997-03-13 | 1998-03-05 | Verfahren zur Herstellung einer Chipkarte |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19710144A DE19710144C2 (de) | 1997-03-13 | 1997-03-13 | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
DE59813564T DE59813564D1 (de) | 1997-03-13 | 1998-03-05 | Verfahren zur Herstellung einer Chipkarte |
Publications (1)
Publication Number | Publication Date |
---|---|
DE59813564D1 true DE59813564D1 (de) | 2006-07-06 |
Family
ID=7823077
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19710144A Expired - Fee Related DE19710144C2 (de) | 1997-03-13 | 1997-03-13 | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
DE59813564T Expired - Lifetime DE59813564D1 (de) | 1997-03-13 | 1998-03-05 | Verfahren zur Herstellung einer Chipkarte |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19710144A Expired - Fee Related DE19710144C2 (de) | 1997-03-13 | 1997-03-13 | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
Country Status (4)
Country | Link |
---|---|
US (1) | US5969951A (de) |
EP (1) | EP0869453B1 (de) |
DE (2) | DE19710144C2 (de) |
ES (1) | ES2267158T3 (de) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08316411A (ja) * | 1995-05-18 | 1996-11-29 | Hitachi Ltd | 半導体装置 |
US6412701B1 (en) * | 1997-05-19 | 2002-07-02 | Hitachi Maxell, Ltd. | Flexible IC module and method of its manufacture, and method of manufacturing information carrier comprising flexible IC module |
FR2769110B1 (fr) * | 1997-09-26 | 1999-12-03 | Gemplus Card Int | Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette |
US6252777B1 (en) * | 1998-02-13 | 2001-06-26 | Shinko Electric Industries Co., Ltd. | IC card and its frame |
EP1055192A1 (de) * | 1998-12-18 | 2000-11-29 | Koninklijke Philips Electronics N.V. | Datenträgermodul mit integriertem schaltkreis und übertragungsspule |
FR2795846B1 (fr) * | 1999-07-01 | 2001-08-31 | Schlumberger Systems & Service | PROCEDE DE FABRICATION DE CARTES LAMINEES MUNIES D'UNE COUCHE INTERMEDIAIRES DE petg |
DE19939347C1 (de) * | 1999-08-19 | 2001-02-15 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
DE19940480C2 (de) * | 1999-08-26 | 2001-06-13 | Orga Kartensysteme Gmbh | Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Chipkarte mit einer Leiterbahnträgerschicht und Verfahren zur Herstellung einer Chipkarte |
FR2801708B1 (fr) * | 1999-11-29 | 2003-12-26 | A S K | Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux |
FR2801707B1 (fr) * | 1999-11-29 | 2002-02-15 | A S K | Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux |
FR2801709B1 (fr) | 1999-11-29 | 2002-02-15 | A S K | Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude |
FI112288B (fi) * | 2000-01-17 | 2003-11-14 | Rafsec Oy | Menetelmä älytarrasyöttörainan valmistamiseksi |
JP3815936B2 (ja) * | 2000-01-25 | 2006-08-30 | 株式会社ルネサステクノロジ | Icカード |
ES2312310T3 (es) * | 2000-02-02 | 2009-03-01 | Infineon Technologies Ag | Tarjeta chip con puntos de flexion predefinidos. |
JP3680676B2 (ja) * | 2000-02-03 | 2005-08-10 | 松下電器産業株式会社 | 非接触データキャリア |
KR100732648B1 (ko) * | 2000-02-22 | 2007-06-28 | 도레이엔지니어링가부시키가이샤 | 비접촉 아이디 카드 및 그의 제조방법 |
FI112287B (fi) * | 2000-03-31 | 2003-11-14 | Rafsec Oy | Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi |
DE10024052C2 (de) * | 2000-05-16 | 2002-02-28 | Orga Kartensysteme Gmbh | Chipkarte |
FI111881B (fi) * | 2000-06-06 | 2003-09-30 | Rafsec Oy | Älykorttiraina ja menetelmä sen valmistamiseksi |
KR100702940B1 (ko) * | 2000-07-28 | 2007-04-03 | 삼성테크윈 주식회사 | 집적회로카드와 이의 제조방법 |
FI112121B (fi) * | 2000-12-11 | 2003-10-31 | Rafsec Oy | Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa |
DE10113476C1 (de) * | 2001-03-20 | 2003-04-17 | Giesecke & Devrient Gmbh | Datenträger mit eingebetteter Spule und Verfahren zu seiner Herstellung |
DE10122416A1 (de) * | 2001-05-09 | 2002-11-14 | Giesecke & Devrient Gmbh | Verfahren und Halbzeug zur Herstellung einer Chipkarte mit Spule |
FI112550B (fi) * | 2001-05-31 | 2003-12-15 | Rafsec Oy | Älytarra ja älytarraraina |
FI117331B (fi) * | 2001-07-04 | 2006-09-15 | Rafsec Oy | Menetelmä ruiskuvaletun tuotteen valmistamiseksi |
FR2829857B1 (fr) * | 2001-09-14 | 2004-09-17 | A S K | Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique |
FI119401B (fi) * | 2001-12-21 | 2008-10-31 | Upm Raflatac Oy | Älytarraraina ja menetelmä sen valmistamiseksi |
CA2652104C (en) * | 2001-12-24 | 2012-02-14 | Digimarc Id Systems, Llc | Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same |
US7823777B2 (en) * | 2003-01-03 | 2010-11-02 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making same |
US7530491B2 (en) * | 2003-01-03 | 2009-05-12 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making the same |
US8033457B2 (en) * | 2003-01-03 | 2011-10-11 | American Express Travel Related Services Company, Inc. | Metal-containing transaction card and method of making the same |
MY148205A (en) * | 2003-05-13 | 2013-03-15 | Nagraid Sa | Process for assembling an electronic component on a substrate |
DE102004010715B4 (de) * | 2004-03-04 | 2009-10-01 | Infineon Technologies Ag | Chipkarte zur kontaktlosen Datenübertragung sowie Verfahren zum Herstellen einer Chipkarte zur kontaktlosen Datenübertragung |
US7810718B2 (en) * | 2005-05-12 | 2010-10-12 | Cubic Corporation | Variable thickness data card body |
US20090004467A1 (en) * | 2006-04-05 | 2009-01-01 | Assa Abloy Ab | High durability contactless identification card |
US20070237932A1 (en) * | 2006-04-05 | 2007-10-11 | Assa Abloy Ab | Thermally stable proximity identification card |
HK1109708A2 (en) * | 2007-04-24 | 2008-06-13 | On Track Innovations Ltd | Interface card and apparatus and process for the formation thereof |
US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
NO20093601A1 (no) | 2009-12-29 | 2011-06-30 | Idex Asa | Overflatesensor |
DE102010025774A1 (de) * | 2010-07-01 | 2012-01-05 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Inlays für einen tragbaren Datenträger und Inlay |
US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
KR101308827B1 (ko) * | 2011-04-27 | 2013-09-26 | (주)엘지하우시스 | 성형성 및 광택성이 우수한 친환경 데코 시트 |
DE102011114635A1 (de) * | 2011-10-04 | 2013-04-04 | Smartrac Ip B.V. | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
DE102012205768B4 (de) * | 2012-04-10 | 2019-02-21 | Smartrac Ip B.V. | Transponderlage und Verfahren zu deren Herstellung |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
GB201208680D0 (en) | 2012-05-17 | 2012-06-27 | Origold As | Method of manufacturing an electronic card |
US9253910B2 (en) * | 2013-01-30 | 2016-02-02 | Texas Instruments Incorporated | Circuit assembly |
US20160232438A1 (en) | 2015-02-06 | 2016-08-11 | American Express Travel Related Services Company, Inc. | Ceramic-containing transaction cards |
US9965716B2 (en) | 2015-08-14 | 2018-05-08 | Capital One Services, Llc | Two-piece transaction card construction |
FR3049739B1 (fr) | 2016-03-30 | 2021-03-12 | Linxens Holding | Procedes de fabrication de cartes a puce et de supports d’antenne pour carte a puce |
WO2019014883A1 (zh) * | 2017-07-20 | 2019-01-24 | 深圳市汇顶科技股份有限公司 | 芯片封装结构、芯片模组及电子终端 |
US11200385B2 (en) * | 2018-09-27 | 2021-12-14 | Apple Inc. | Electronic card having an electronic interface |
CN111341750B (zh) * | 2018-12-19 | 2024-03-01 | 奥特斯奥地利科技与系统技术有限公司 | 包括有导电基部结构的部件承载件及制造方法 |
WO2021255490A1 (en) * | 2020-06-18 | 2021-12-23 | Linxens Holding | A method of forming a smart card, a prelam body, and a smart card |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3804361C1 (de) * | 1988-02-12 | 1988-09-29 | Deutsche Bundespost, Vertreten Durch Den Praesidenten Des Fernmeldetechnischen Zentralamtes, 6100 Darmstadt, De | |
DE4040296C1 (de) * | 1990-12-17 | 1992-01-09 | Orga Kartensysteme Gmbh, 6072 Dreieich, De | |
FR2678753B1 (fr) * | 1991-07-02 | 1996-12-20 | Gemplus Card Int | Fabrication de cartes a puce a module autodetachable. |
DE4132720A1 (de) * | 1991-10-01 | 1993-04-08 | Gao Ges Automation Org | Chipkarte und verfahren zur herstellung derselben |
DE4403513A1 (de) * | 1994-02-04 | 1995-08-10 | Giesecke & Devrient Gmbh | Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte |
DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
DE4419973A1 (de) * | 1994-06-08 | 1995-12-14 | Bayer Ag | Monohydratform des (R)-2-Cycloheptylmethylaminomethyl-8-methoxy-chroman-hydrochlorids |
ES2102317B1 (es) * | 1994-09-19 | 1998-04-16 | Nacional Moneda Timbre | Tarjeta inteligente de uso en telefonia y similar. |
DE19500925C2 (de) * | 1995-01-16 | 1999-04-08 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer kontaktlosen Chipkarte |
DE19505245C1 (de) * | 1995-02-16 | 1996-04-25 | Karl Heinz Wendisch | Ausweischipkarte mit Antennenwicklung |
DE29503249U1 (de) * | 1995-03-08 | 1995-11-02 | Mb Lasersysteme Gmbh | Chipkarte mit Wechselchip |
FR2734071B1 (fr) * | 1995-05-11 | 1997-06-06 | Schlumberger Ind Sa | Carte de paiement electronique a module interchangeable |
CN1106627C (zh) * | 1995-08-01 | 2003-04-23 | 奥地利塑料卡及证件系统股份有限公司 | 带有一个拥有一个构件的模块的和带有一个线圈的数据载体和用于制造这种数据载体的方法 |
DE19606789C2 (de) * | 1996-02-23 | 1998-07-09 | Orga Kartensysteme Gmbh | Kunststoffkarte mit aus dieser heraustrennbarer Minichipkarte |
DE29604946U1 (de) * | 1996-03-16 | 1997-07-17 | Fev Motorentech Gmbh & Co Kg | Elektromagnetischer Aktuator für ein Gaswechselventil mit Ventilspielausgleich |
JPH09256015A (ja) * | 1996-03-25 | 1997-09-30 | Kobe Steel Ltd | 微粉炭搬送性向上剤 |
-
1997
- 1997-03-13 DE DE19710144A patent/DE19710144C2/de not_active Expired - Fee Related
-
1998
- 1998-03-05 EP EP98103913A patent/EP0869453B1/de not_active Expired - Lifetime
- 1998-03-05 ES ES98103913T patent/ES2267158T3/es not_active Expired - Lifetime
- 1998-03-05 DE DE59813564T patent/DE59813564D1/de not_active Expired - Lifetime
- 1998-03-13 US US09/041,750 patent/US5969951A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE19710144A1 (de) | 1998-09-17 |
US5969951A (en) | 1999-10-19 |
EP0869453A3 (de) | 2002-08-07 |
ES2267158T3 (es) | 2007-03-01 |
DE19710144C2 (de) | 1999-10-14 |
EP0869453A2 (de) | 1998-10-07 |
EP0869453B1 (de) | 2006-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE59813564D1 (de) | Verfahren zur Herstellung einer Chipkarte | |
DE59710644D1 (de) | Verfahren zur herstellung einer chipkarte | |
DE60030949D1 (de) | Verfahren zur herstellung einer karte | |
DE69836401D1 (de) | Verfahren zur Herstellung einer Halbleiteranordnung | |
DE69527866D1 (de) | Verfahren zur Herstellung einer kontaktlosen Karte | |
DE69730940D1 (de) | Verfahren zur herstellung einer halbleiteranordnung | |
DE59806195D1 (de) | Verfahren zur herstellung von aliphatischen alkoholen | |
DE69906491D1 (de) | VERFAHREN ZUR HERSTELLUNG EINER SiCOI-STRUKTUR | |
DE69823686T2 (de) | Verfahren zur herstellung komplexer alkalimetallhydriden | |
DE69607546D1 (de) | Verfahren zur Herstellung einer Schaltungsanordnung | |
DE69940737D1 (de) | Verfahren zur herstellung einer halbleiteranordnung | |
DE69805608D1 (de) | Verfahren zur herstellung von epoxyverbindungen | |
DE69942186D1 (de) | Verfahren zur herstellung einer halbleiteranordnung | |
DE59800621D1 (de) | Verfahren zur Herstellung einer mikromechanischen Halbleiteranordnung | |
DE69738198D1 (de) | Verfahren zur herstellung einer kugelkeilwellenverbindung | |
DE59808395D1 (de) | Verfahren zur herstellung einer gebauten nockenwelle | |
DE69819191D1 (de) | Verfahren zur herstellung von pentafluorethan | |
DE69907414D1 (de) | Verfahren zur herstellung einer ic-karte | |
ATE225797T1 (de) | Verfahren zur herstellung von oxazaphosphorin-2- aminen | |
DE69805969D1 (de) | Verfahren zur herstellung von epoxy-verbindungen | |
DE69733152D1 (de) | Verfahren zur herstellung von tetrazolylbenzopyranen | |
DE59601908D1 (de) | Verfahren zur Authentisierung einer Chipkarte | |
DE69806759T2 (de) | Verfahren zur herstellung von pentafluorethan | |
DE69813588D1 (de) | Verfahren zur herstellung von 3-ispchromanon | |
DE59805432D1 (de) | Verfahren zur herstellung von 2-cyclododecyl-1-propanol |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
R082 | Change of representative |
Ref document number: 869453 Country of ref document: EP Representative=s name: RICHARDT PATENTANWAELTE, 65185 WIESBADEN, DE |
|
R082 | Change of representative |
Ref document number: 869453 Country of ref document: EP Representative=s name: RICHARDT PATENTANWAELTE, 65185 WIESBADEN, DE |