DE60002758D1 - Integrierter konvektiver und wärmeleitender kühlkörper für mehrere montagepositionen - Google Patents

Integrierter konvektiver und wärmeleitender kühlkörper für mehrere montagepositionen

Info

Publication number
DE60002758D1
DE60002758D1 DE60002758T DE60002758T DE60002758D1 DE 60002758 D1 DE60002758 D1 DE 60002758D1 DE 60002758 T DE60002758 T DE 60002758T DE 60002758 T DE60002758 T DE 60002758T DE 60002758 D1 DE60002758 D1 DE 60002758D1
Authority
DE
Germany
Prior art keywords
die
heat sink
frame
electronic device
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60002758T
Other languages
English (en)
Other versions
DE60002758T2 (de
Inventor
A Tehan
Armand Losinski
Berkley Parkinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Application granted granted Critical
Publication of DE60002758D1 publication Critical patent/DE60002758D1/de
Publication of DE60002758T2 publication Critical patent/DE60002758T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE60002758T 1999-12-13 2000-12-11 Integrierter konvektiver und wärmeleitender kühlkörper für mehrere montagepositionen Expired - Fee Related DE60002758T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US460196 1999-12-13
US09/460,196 US6239972B1 (en) 1999-12-13 1999-12-13 Integrated convection and conduction heat sink for multiple mounting positions
PCT/US2000/033532 WO2001047333A2 (en) 1999-12-13 2000-12-11 Integrated convection and conduction heat sink for multiple mounting positions

Publications (2)

Publication Number Publication Date
DE60002758D1 true DE60002758D1 (de) 2003-06-18
DE60002758T2 DE60002758T2 (de) 2004-04-08

Family

ID=23827734

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60002758T Expired - Fee Related DE60002758T2 (de) 1999-12-13 2000-12-11 Integrierter konvektiver und wärmeleitender kühlkörper für mehrere montagepositionen

Country Status (14)

Country Link
US (1) US6239972B1 (de)
EP (1) EP1238574B1 (de)
JP (1) JP2003518761A (de)
KR (1) KR20020061000A (de)
AT (1) ATE240632T1 (de)
AU (1) AU769351B2 (de)
CA (1) CA2394064A1 (de)
DE (1) DE60002758T2 (de)
DK (1) DK1238574T3 (de)
ES (1) ES2195950T3 (de)
IL (2) IL150185A0 (de)
NZ (1) NZ520138A (de)
TW (1) TW499829B (de)
WO (1) WO2001047333A2 (de)

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US6377463B1 (en) * 2000-12-12 2002-04-23 Intel Corporation Retention module for processor and chipset thermal solutions
US6639801B2 (en) * 2001-08-10 2003-10-28 Agilent Technologies, Inc. Mechanical packaging architecture for heat dissipation
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US6873528B2 (en) * 2002-05-28 2005-03-29 Dy 4 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US6659168B1 (en) * 2002-07-09 2003-12-09 Hewlett-Packard Development Company, L.P. Heatsink with multiple fin types
US6741466B1 (en) 2002-07-18 2004-05-25 Rockwell Collins Modular electronics system chassis
US6975511B1 (en) * 2002-07-18 2005-12-13 Rockwell Collins Ruggedized electronic module cooling system
US6771508B1 (en) * 2003-02-14 2004-08-03 Intel Corporation Method and apparatus for cooling an electronic component
US7027299B2 (en) * 2003-08-19 2006-04-11 Sun Microsystems, Inc. Electronics assembly with arrangement for air cooling
JP4371210B2 (ja) * 2003-12-05 2009-11-25 日本電気株式会社 電子ユニットおよびその放熱構造
US7113406B1 (en) * 2004-07-22 2006-09-26 Cisco Technology, Inc. Methods and apparatus for fastening a set of heatsinks to a circuit board
CN100379333C (zh) * 2004-11-15 2008-04-02 广达电脑股份有限公司 散热装置
US20060232928A1 (en) * 2005-04-19 2006-10-19 Vinson Wade D Heat sink for multiple components
JP4617209B2 (ja) * 2005-07-07 2011-01-19 株式会社豊田自動織機 放熱装置
US7462934B2 (en) * 2006-06-20 2008-12-09 Microsoft Corporation Integrated heat sink
JP4796457B2 (ja) * 2006-08-16 2011-10-19 富士通株式会社 機器、演算装置および放熱部材
US20080060789A1 (en) * 2006-09-12 2008-03-13 Chang Sob Lee Heat transfer plate with retainer assembly
US7492598B2 (en) * 2006-09-20 2009-02-17 Cisco Technology, Inc. Heatsink attachment mechanism
US9380726B2 (en) * 2007-05-22 2016-06-28 James Charles Calder Retainer and thermal displacement apparatus for electronic components, methods of production and applications thereof
US8082978B2 (en) * 2007-08-07 2011-12-27 Georgia Tech Research Corporation Fluid-to-fluid spot-to-spreader heat management devices and systems and methods of managing heat
CN101907908B (zh) * 2009-06-04 2013-03-13 富准精密工业(深圳)有限公司 电子设备及其机箱
US8456846B2 (en) * 2010-01-20 2013-06-04 Wavetherm Corporation Wedge based circuit board retainer
US8270172B2 (en) * 2010-04-23 2012-09-18 GE Intelligent Platforms Embedded Systems, Inc. Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
DE102011107316A1 (de) * 2011-07-06 2013-06-06 Abb Ag Anordnung zum Kühlen von Baugruppen eines Automatisierungs- oder Steuerungssystems
US9417670B2 (en) 2012-08-07 2016-08-16 Lockheed Martin Corporation High power dissipation mezzanine card cooling frame
US9125299B2 (en) * 2012-12-06 2015-09-01 Apple Inc. Cooling for electronic components
US9223167B2 (en) 2013-06-26 2015-12-29 Apple Inc. Liquid crystal switching barrier thermal control
US9389029B2 (en) 2013-09-30 2016-07-12 Apple Inc. Heat transfer structure
CN105700646A (zh) * 2014-11-27 2016-06-22 英业达科技有限公司 服务器
US9674986B2 (en) 2015-08-03 2017-06-06 Apple Inc. Parallel heat spreader
US10794637B2 (en) 2016-10-03 2020-10-06 Ge Aviation Systems Llc Circular heatsink
CN113556908B (zh) * 2020-05-13 2022-09-13 浙江众合科技股份有限公司 插卡式集成电路板测试用板卡插拔结构
CN111487650B (zh) * 2020-05-14 2022-07-26 国网河北省电力有限公司沧州供电分公司 一种对数据采集变电站进行巡检用的定位装置

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US5258887A (en) * 1992-06-15 1993-11-02 Eaton Corporation Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
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DE19632545A1 (de) * 1996-08-13 1998-02-19 Bodenseewerk Geraetetech Elektronisches Gerät in Modulbauweise
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Also Published As

Publication number Publication date
NZ520138A (en) 2003-10-31
IL150185A0 (en) 2002-12-01
IL150185A (en) 2006-04-10
EP1238574B1 (de) 2003-05-14
US6239972B1 (en) 2001-05-29
WO2001047333A2 (en) 2001-06-28
CA2394064A1 (en) 2001-06-28
AU769351B2 (en) 2004-01-22
DK1238574T3 (da) 2003-07-21
DE60002758T2 (de) 2004-04-08
JP2003518761A (ja) 2003-06-10
ES2195950T3 (es) 2003-12-16
EP1238574A2 (de) 2002-09-11
TW499829B (en) 2002-08-21
ATE240632T1 (de) 2003-05-15
AU2258101A (en) 2001-07-03
KR20020061000A (ko) 2002-07-19
WO2001047333A3 (en) 2002-01-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee