DE60003109D1 - Strahlmittel und Strahlverfahren - Google Patents

Strahlmittel und Strahlverfahren

Info

Publication number: DE60003109D1
Authority: DE; Germany
Prior art keywords: abrasives; blasting processes; blasting; processes
Prior art date: 1999-03-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60003109T

Other languages

English (en)

Other versions

DE60003109T2 (de

Inventor

Masaharu Tanaka

Hachiro Hirano

Makoto Yoshida

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

AGC Inc

Original Assignee

Asahi Glass Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-03-29

Filing date

2000-03-28

Publication date

2003-07-10

2000-03-28 Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd

2003-07-10 Application granted granted Critical

2003-07-10 Publication of DE60003109D1 publication Critical patent/DE60003109D1/de

2004-01-29 Publication of DE60003109T2 publication Critical patent/DE60003109T2/de

2020-03-29 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C11/00—Selection of abrasive materials or additives for abrasive blasts
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

DE60003109T 1999-03-29 2000-03-28 Strahlmittel und Strahlverfahren Expired - Lifetime DE60003109T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP8634399		1999-03-29

Publications (2)

Publication Number	Publication Date
DE60003109D1 true DE60003109D1 (de)	2003-07-10
DE60003109T2 DE60003109T2 (de)	2004-01-29

Family

ID=13884226

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60003109T Expired - Lifetime DE60003109T2 (de)	1999-03-29	2000-03-28	Strahlmittel und Strahlverfahren

Country Status (4)

Country	Link
US (1)	US6478878B1 (de)
EP (1)	EP1040892B1 (de)
JP (2)	JP2000343435A (de)
DE (1)	DE60003109T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2000343435A (ja) *	1999-03-29	2000-12-12	Asahi Glass Co Ltd	ブラストメディア及びブラスト方法
JP3840632B2 (ja)	2000-05-08	2006-11-01	三井造船株式会社	ナトリウム系脱塩剤および廃棄物処理装置
US6817927B2 (en) *	2001-10-19	2004-11-16	Eastman Kodak Company	Method of removing material from an external surface using core/shell particles
JP3941573B2 (ja) *	2002-04-24	2007-07-04	宇部興産株式会社	フレキシブル両面基板の製造方法
JP2004148414A (ja) *	2002-10-28	2004-05-27	Seiko Epson Corp	研削材及び研削材の製造方法並びに製造装置
JP4367623B2 (ja)	2004-01-14	2009-11-18	住友電気工業株式会社	多孔質延伸ポリテトラフルオロエチレンシート製または多孔質延伸ポリテトラフルオロエチレンフィルム製の電気回路部品の製造方法、及び電気回路部品
DE102004003420B4 (de) *	2004-01-23	2006-10-26	Dr.Ing.H.C. F. Porsche Ag	Verfahren zur Behandlung von Aluminiumgussteilen
JP4947510B2 (ja) *	2004-12-24	2012-06-06	Ｎｌｔテクノロジー株式会社	アクティブマトリクス型表示装置及びその製造方法
US20070111642A1 (en) *	2005-11-14	2007-05-17	Davis Ian M	Apparatus and methods for slurry cleaning of etch chambers
US20080017734A1 (en) *	2006-07-10	2008-01-24	Micheli Paul R	System and method of uniform spray coating
DE102006035260A1 (de)	2006-07-26	2008-01-31	Martin GmbH für Umwelt- und Energietechnik	Verfahren und Vorrichtung zum Trennen von Reststoffen
KR101111930B1 (ko)	2008-09-30	2012-02-14	이비덴 가부시키가이샤	다층 프린트 배선판, 및 다층 프린트 배선판의 제조 방법
DE102009017231B4 (de) *	2009-04-09	2016-12-01	Epcos Ag	Horde
JP2012069854A (ja) *	2010-09-27	2012-04-05	Cmk Corp	多層プリント配線板とその製造方法
US10294019B2 (en) *	2016-08-17	2019-05-21	Raritan Pharmaceuticals Inc.	System for preparing medicinal beverages using cartridge-type beverage brewers
CN111050478B (zh) *	2019-12-25	2021-03-02	浙江振有电子股份有限公司	一种环氧基板微米级细孔去渣方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
IL93572A (en) *	1989-03-14	1993-06-10	Church & Dwight Co Inc	Process for removing coatings from sensitive substrates and blasting media useful therein
KR0149479B1 (ko)	1992-03-20	1998-10-15	마이클 제이 케니	연마성 피막 제거제 및 그를 사용하는 방법
US5308404A (en) *	1993-01-21	1994-05-03	Church & Dwight Co., Inc.	Less aggressive blast media formed from compacted particles
US6010546A (en)	1997-07-24	2000-01-04	Asahi Glass Company, Ltd.	Blasting medium and blasting method employing such medium
US5827114A (en) *	1996-09-25	1998-10-27	Church & Dwight Co., Inc.	Slurry blasting process
JPH11246217A (ja) *	1998-03-04	1999-09-14	Asahi Glass Co Ltd	ナトリウム塩の製造方法
JP2000343435A (ja) *	1999-03-29	2000-12-12	Asahi Glass Co Ltd	ブラストメディア及びブラスト方法

2000
- 2000-03-09 JP JP2000064754A patent/JP2000343435A/ja active Pending
- 2000-03-28 DE DE60003109T patent/DE60003109T2/de not_active Expired - Lifetime
- 2000-03-28 US US09/536,682 patent/US6478878B1/en not_active Expired - Fee Related
- 2000-03-28 EP EP00106027A patent/EP1040892B1/de not_active Expired - Lifetime
2010
- 2010-03-15 JP JP2010058094A patent/JP2010158770A/ja not_active Withdrawn

Also Published As

Publication number	Publication date
JP2000343435A (ja)	2000-12-12
US6478878B1 (en)	2002-11-12
JP2010158770A (ja)	2010-07-22
DE60003109T2 (de)	2004-01-29
EP1040892A1 (de)	2000-10-04
EP1040892B1 (de)	2003-06-04

Legal Events

Date	Code	Title	Description
2004-07-01	8364	No opposition during term of opposition

Publication	Publication Date	Title
GB0602182D0 (en)	2006-03-15	Porous abrasive segments and tools incorporating the same
AU2003297681A8 (en)	2004-06-30	Abrasive webs and methods of making the same
EP1423120A4 (de)	2005-12-28	2h-phthalazin-1-one und verfahren zu ihrer verwendung
AU3651002A (en)	2002-06-03	Seed-preferred regulatory elements and uses thereof
DE60008037D1 (de)	2004-03-11	Schleuderstrahlvorrichtung
NO20004814D0 (no)	2000-09-26	Malskive og fremgangsmÕte
DE60027505D1 (de)	2006-06-01	Schleifmittelzusammensetzung
DE69832657D1 (de)	2006-01-12	Empfangseinrichtungen und Empfangsverfahren
DE60130578D1 (de)	2007-10-31	Schleifstoff und polierverfahren
DE50112013D1 (de)	2007-03-22	Deodorantien und antiperspirantien
DE69835254D1 (de)	2006-08-31	Empfangseinrichtungen und Empfangsverfahren
HK1061212A1 (en)	2004-09-10	Pyranoindazoles and their use for the treatment ofglaucoma
DE69830372D1 (de)	2005-07-07	Gaserzeugende zusammensetzung und formmasse davon
DE60003109D1 (de)	2003-07-10	Strahlmittel und Strahlverfahren
ATE230305T1 (de)	2003-01-15	Feinzerkleinerer und feinzerkleinerungsverfahren
DE69917958D1 (de)	2004-07-22	Schleifkörper
DE60122160D1 (de)	2006-09-21	Antennenstruktur und zugehöriges verfahren
GB0120039D0 (en)	2001-10-10	Method for dressing and animating dressed beings
DE50000431D1 (de)	2002-10-10	Schleifvorrichtung
DE60223540D1 (de)	2007-12-27	Mundschutz und mundschutzfolie
DE69931255D1 (de)	2006-06-14	In antheren und pollen exprimierte promotorsequenzen
GB9904872D0 (en)	1999-04-28	Abrasive blasting apparatus
SG96553A1 (en)	2003-06-16	Abrasive
PL370031A1 (en)	2005-05-16	Novel amylases and uses thereof
DK1053077T3 (da)	2003-01-06	Blæsemiddel-injektorpistol