DE60012762D1 - Einrichtung und verfahren zur qualitätsüberwachung mit hilfe statistischer prozessteuerung - Google Patents

Einrichtung und verfahren zur qualitätsüberwachung mit hilfe statistischer prozessteuerung

Info

Publication number
DE60012762D1
DE60012762D1 DE60012762T DE60012762T DE60012762D1 DE 60012762 D1 DE60012762 D1 DE 60012762D1 DE 60012762 T DE60012762 T DE 60012762T DE 60012762 T DE60012762 T DE 60012762T DE 60012762 D1 DE60012762 D1 DE 60012762D1
Authority
DE
Germany
Prior art keywords
aid
process control
quality monitoring
statistical process
statistical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60012762T
Other languages
English (en)
Other versions
DE60012762T2 (de
Inventor
J Toprac
J Campbell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of DE60012762D1 publication Critical patent/DE60012762D1/de
Application granted granted Critical
Publication of DE60012762T2 publication Critical patent/DE60012762T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41885—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32017—Adapt real process as function of changing simulation model, changing for better results
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32191—Real time statistical process monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32201—Build statistical model of past normal proces, compare with actual process
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/42—Servomotor, servo controller kind till VSS
    • G05B2219/42001—Statistical process control spc
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
DE60012762T 1999-10-05 2000-04-28 Einrichtung und verfahren zur qualitätsüberwachung mit hilfe statistischer prozessteuerung Expired - Lifetime DE60012762T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US412679 1999-10-05
US09/412,679 US6560503B1 (en) 1999-10-05 1999-10-05 Method and apparatus for monitoring controller performance using statistical process control
PCT/US2000/011522 WO2001025865A1 (en) 1999-10-05 2000-04-28 Method and apparatus for monitoring controller performance using statistical process control

Publications (2)

Publication Number Publication Date
DE60012762D1 true DE60012762D1 (de) 2004-09-09
DE60012762T2 DE60012762T2 (de) 2005-08-11

Family

ID=23633988

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60012762T Expired - Lifetime DE60012762T2 (de) 1999-10-05 2000-04-28 Einrichtung und verfahren zur qualitätsüberwachung mit hilfe statistischer prozessteuerung

Country Status (6)

Country Link
US (1) US6560503B1 (de)
EP (1) EP1218806B1 (de)
JP (1) JP2003511750A (de)
KR (1) KR100708009B1 (de)
DE (1) DE60012762T2 (de)
WO (1) WO2001025865A1 (de)

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US6556884B1 (en) 2000-06-16 2003-04-29 Advanced Micro Devices, Inc. Method and apparatus for interfacing a statistical process control system with a manufacturing process control framework
US6725402B1 (en) * 2000-07-31 2004-04-20 Advanced Micro Devices, Inc. Method and apparatus for fault detection of a processing tool and control thereof using an advanced process control (APC) framework
US7123978B2 (en) * 2000-12-27 2006-10-17 Insyst Ltd. Method for dynamically targeting a batch process
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
TW518645B (en) * 2001-09-24 2003-01-21 Powerchip Semiconductor Corp Method and system of automatic wafer manufacture quality control
US8180587B2 (en) * 2002-03-08 2012-05-15 Globalfoundries Inc. System for brokering fault detection data
US6772035B2 (en) * 2002-05-17 2004-08-03 Micron Technology, Inc. Synthesizing semiconductor process flow models
US6925347B1 (en) * 2002-08-19 2005-08-02 Advanced Micro Devices, Inc. Process control based on an estimated process result
DE10252605A1 (de) * 2002-11-12 2004-06-24 Infineon Technologies Ag Verfahren, Vorrichtung, computerlesbarer Speicher und Computerprogramm-Element zum rechnergestützten Überwachen und Regeln eines Herstellungsprozesses
US7272459B2 (en) 2002-11-15 2007-09-18 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US6941177B2 (en) * 2002-12-17 2005-09-06 Xerox Corporation System and method for implementing real-time applications based on stochastic compute time algorithms
US6912433B1 (en) * 2002-12-18 2005-06-28 Advanced Mirco Devices, Inc. Determining a next tool state based on fault detection information
US7581140B1 (en) * 2002-12-18 2009-08-25 Advanced Micro Devices, Inc. Initiating test runs based on fault detection results
KR101009384B1 (ko) * 2003-02-18 2011-01-19 도쿄엘렉트론가부시키가이샤 처리시스템의 자동 구성 방법
US8032348B2 (en) * 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US8036869B2 (en) * 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8050900B2 (en) * 2003-09-30 2011-11-01 Tokyo Electron Limited System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
US8073667B2 (en) * 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US7010382B2 (en) * 2004-02-26 2006-03-07 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for improving process control for semiconductor manufacturing operations
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US8615314B1 (en) * 2004-09-02 2013-12-24 Advanced Micro Devices, Inc. Process control using analysis of an upstream process
US7457729B2 (en) * 2005-01-11 2008-11-25 Verigy (Singapore) Pte. Ltd. Model based testing for electronic devices
US8675176B2 (en) * 2005-02-25 2014-03-18 Asml Netherlands B.V. Parameter control in a lithographic apparatus using polarization
US7117059B1 (en) * 2005-04-18 2006-10-03 Promos Technologies Inc. Run-to-run control system and operating method of the same
KR100699856B1 (ko) * 2005-07-29 2007-03-27 삼성전자주식회사 반도체소자를 제조하는 공정의 제어시스템 및 이를 이용한제어방법
US7720553B2 (en) * 2006-08-31 2010-05-18 Dell Products L.P. Service metric portfolio management
US8682466B2 (en) * 2007-05-04 2014-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic virtual metrology for semiconductor wafer result prediction
US7873585B2 (en) * 2007-08-31 2011-01-18 Kla-Tencor Technologies Corporation Apparatus and methods for predicting a semiconductor parameter across an area of a wafer
US9760073B2 (en) * 2010-05-21 2017-09-12 Honeywell International Inc. Technique and tool for efficient testing of controllers in development
TWI647630B (zh) * 2017-05-08 2019-01-11 萬泰科技股份有限公司 生產效率監控系統
JP7326344B2 (ja) 2018-05-24 2023-08-15 アプライド マテリアルズ インコーポレイテッド 空間分解ウエハ温度制御のための仮想センサ
KR102589004B1 (ko) * 2018-06-18 2023-10-16 삼성전자주식회사 반도체 불량 분석 장치 및 그것의 불량 분석 방법
EP4012421A1 (de) * 2020-12-11 2022-06-15 Nxp B.V. System und verfahren zur überwachung von rückkopplungsschaltungen
US20230081446A1 (en) * 2021-09-10 2023-03-16 Applied Materials, Inc. Using elemental maps information from x-ray energy-dispersive spectroscopy line scan analysis to create process models

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JP2655904B2 (ja) * 1989-02-06 1997-09-24 三菱重工業株式会社 適応制御装置
JPH06244261A (ja) * 1990-12-31 1994-09-02 Texas Instr Inc <Ti> 半導体装置製造プロセス制御用センサ
US5257206A (en) * 1991-04-08 1993-10-26 Praxair Technology, Inc. Statistical process control for air separation process
US5408405A (en) 1993-09-20 1995-04-18 Texas Instruments Incorporated Multi-variable statistical process controller for discrete manufacturing
US5546312A (en) 1993-09-20 1996-08-13 Texas Instruments Incorporated Use of spatial models for simultaneous control of various non-uniformity metrics
US5526293A (en) 1993-12-17 1996-06-11 Texas Instruments Inc. System and method for controlling semiconductor wafer processing
US5452218A (en) 1994-02-03 1995-09-19 Texas Instruments System and method for determining quality analysis on fabrication and/or assembly design using shop capability data
US5698455A (en) * 1995-02-09 1997-12-16 Micron Technologies, Inc. Method for predicting process characteristics of polyurethane pads
US5659467A (en) * 1996-06-26 1997-08-19 Texas Instruments Incorporated Multiple model supervisor control system and method of operation
KR19980026111A (ko) * 1996-10-07 1998-07-15 김광호 반도체 제조를 위한 통계적 공정관리 방법
US5987398A (en) 1998-04-30 1999-11-16 Sony Corporation Method and apparatus for statistical process control of machines and processes having non-constant mean of a response variable
US6230069B1 (en) 1998-06-26 2001-05-08 Advanced Micro Devices, Inc. System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control
US6298470B1 (en) * 1999-04-15 2001-10-02 Micron Technology, Inc. Method for efficient manufacturing of integrated circuits

Also Published As

Publication number Publication date
US6560503B1 (en) 2003-05-06
EP1218806B1 (de) 2004-08-04
KR100708009B1 (ko) 2007-04-16
WO2001025865A1 (en) 2001-04-12
DE60012762T2 (de) 2005-08-11
JP2003511750A (ja) 2003-03-25
KR20020047215A (ko) 2002-06-21
EP1218806A1 (de) 2002-07-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GLOBALFOUNDRIES INC., GRAND CAYMAN, KY

8328 Change in the person/name/address of the agent

Representative=s name: GRUENECKER, KINKELDEY, STOCKMAIR & SCHWANHAEUSSER,