US6590907B1
(en)
*
|
1999-10-01 |
2003-07-08 |
Stmicroelectronics Ltd. |
Integrated circuit with additional ports
|
US7363422B2
(en)
*
|
2000-01-05 |
2008-04-22 |
Rambus Inc. |
Configurable width buffered module
|
US20050010737A1
(en)
*
|
2000-01-05 |
2005-01-13 |
Fred Ware |
Configurable width buffered module having splitter elements
|
US6658530B1
(en)
|
2000-10-12 |
2003-12-02 |
Sun Microsystems, Inc. |
High-performance memory module
|
US6889335B2
(en)
*
|
2001-04-07 |
2005-05-03 |
Hewlett-Packard Development Company, L.P. |
Memory controller receiver circuitry with tri-state noise immunity
|
US6625702B2
(en)
*
|
2001-04-07 |
2003-09-23 |
Hewlett-Packard Development Company, L.P. |
Memory controller with support for memory modules comprised of non-homogeneous data width RAM devices
|
US6678811B2
(en)
*
|
2001-04-07 |
2004-01-13 |
Hewlett-Packard Development Company, L.P. |
Memory controller with 1X/MX write capability
|
US6633965B2
(en)
*
|
2001-04-07 |
2003-10-14 |
Eric M. Rentschler |
Memory controller with 1×/M× read capability
|
US6721185B2
(en)
|
2001-05-01 |
2004-04-13 |
Sun Microsystems, Inc. |
Memory module having balanced data I/O contacts pads
|
US6714433B2
(en)
*
|
2001-06-15 |
2004-03-30 |
Sun Microsystems, Inc. |
Memory module with equal driver loading
|
US7234099B2
(en)
*
|
2003-04-14 |
2007-06-19 |
International Business Machines Corporation |
High reliability memory module with a fault tolerant address and command bus
|
KR100574940B1
(ko)
*
|
2003-04-15 |
2006-04-28 |
삼성전자주식회사 |
서로 다른 높이와 간격의 탭들을 포함하는 모듈
|
DE102004022347B4
(de)
*
|
2003-05-02 |
2008-04-03 |
Samsung Electronics Co., Ltd., Suwon |
Speichersystem mit Motherboard und zugehöriges Montageverfahren
|
KR100532432B1
(ko)
*
|
2003-05-02 |
2005-11-30 |
삼성전자주식회사 |
커맨드 신호와 어드레스 신호의 고속 전송이 가능한메모리 시스템
|
KR20050022798A
(ko)
*
|
2003-08-30 |
2005-03-08 |
주식회사 이즈텍 |
유전자 어휘 분류체계를 이용하여 바이오 칩을 분석하기위한 시스템 및 그 방법
|
US6961281B2
(en)
*
|
2003-09-12 |
2005-11-01 |
Sun Microsystems, Inc. |
Single rank memory module for use in a two-rank memory module system
|
DE10345978A1
(de)
*
|
2003-10-02 |
2005-04-28 |
Infineon Technologies Ag |
Speichervorrichtung mit Redundanz und Verfahren zur Datenspeicherung
|
KR100574951B1
(ko)
*
|
2003-10-31 |
2006-05-02 |
삼성전자주식회사 |
개선된 레지스터 배치 구조를 가지는 메모리 모듈
|
US7646649B2
(en)
*
|
2003-11-18 |
2010-01-12 |
International Business Machines Corporation |
Memory device with programmable receivers to improve performance
|
US8250295B2
(en)
|
2004-01-05 |
2012-08-21 |
Smart Modular Technologies, Inc. |
Multi-rank memory module that emulates a memory module having a different number of ranks
|
KR100593439B1
(ko)
*
|
2004-02-24 |
2006-06-28 |
삼성전자주식회사 |
메모리 모듈 및 이의 신호 라인 배치 방법
|
US7916574B1
(en)
|
2004-03-05 |
2011-03-29 |
Netlist, Inc. |
Circuit providing load isolation and memory domain translation for memory module
|
US7289386B2
(en)
|
2004-03-05 |
2007-10-30 |
Netlist, Inc. |
Memory module decoder
|
US7532537B2
(en)
*
|
2004-03-05 |
2009-05-12 |
Netlist, Inc. |
Memory module with a circuit providing load isolation and memory domain translation
|
US20060277355A1
(en)
*
|
2005-06-01 |
2006-12-07 |
Mark Ellsberry |
Capacity-expanding memory device
|
US8055833B2
(en)
|
2006-10-05 |
2011-11-08 |
Google Inc. |
System and method for increasing capacity, performance, and flexibility of flash storage
|
US7392338B2
(en)
|
2006-07-31 |
2008-06-24 |
Metaram, Inc. |
Interface circuit system and method for autonomously performing power management operations in conjunction with a plurality of memory circuits
|
US8244971B2
(en)
|
2006-07-31 |
2012-08-14 |
Google Inc. |
Memory circuit system and method
|
US8397013B1
(en)
|
2006-10-05 |
2013-03-12 |
Google Inc. |
Hybrid memory module
|
US8359187B2
(en)
|
2005-06-24 |
2013-01-22 |
Google Inc. |
Simulating a different number of memory circuit devices
|
US8081474B1
(en)
|
2007-12-18 |
2011-12-20 |
Google Inc. |
Embossed heat spreader
|
US8327104B2
(en)
|
2006-07-31 |
2012-12-04 |
Google Inc. |
Adjusting the timing of signals associated with a memory system
|
US9542352B2
(en)
|
2006-02-09 |
2017-01-10 |
Google Inc. |
System and method for reducing command scheduling constraints of memory circuits
|
US8796830B1
(en)
|
2006-09-01 |
2014-08-05 |
Google Inc. |
Stackable low-profile lead frame package
|
US9171585B2
(en)
|
2005-06-24 |
2015-10-27 |
Google Inc. |
Configurable memory circuit system and method
|
US10013371B2
(en)
|
2005-06-24 |
2018-07-03 |
Google Llc |
Configurable memory circuit system and method
|
US8060774B2
(en)
|
2005-06-24 |
2011-11-15 |
Google Inc. |
Memory systems and memory modules
|
US20080028136A1
(en)
|
2006-07-31 |
2008-01-31 |
Schakel Keith R |
Method and apparatus for refresh management of memory modules
|
US9507739B2
(en)
|
2005-06-24 |
2016-11-29 |
Google Inc. |
Configurable memory circuit system and method
|
US8386722B1
(en)
|
2008-06-23 |
2013-02-26 |
Google Inc. |
Stacked DIMM memory interface
|
US8111566B1
(en)
|
2007-11-16 |
2012-02-07 |
Google, Inc. |
Optimal channel design for memory devices for providing a high-speed memory interface
|
US8438328B2
(en)
|
2008-02-21 |
2013-05-07 |
Google Inc. |
Emulation of abstracted DIMMs using abstracted DRAMs
|
US7386656B2
(en)
|
2006-07-31 |
2008-06-10 |
Metaram, Inc. |
Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit
|
US8090897B2
(en)
|
2006-07-31 |
2012-01-03 |
Google Inc. |
System and method for simulating an aspect of a memory circuit
|
US8077535B2
(en)
|
2006-07-31 |
2011-12-13 |
Google Inc. |
Memory refresh apparatus and method
|
US8041881B2
(en)
|
2006-07-31 |
2011-10-18 |
Google Inc. |
Memory device with emulated characteristics
|
US20080082763A1
(en)
|
2006-10-02 |
2008-04-03 |
Metaram, Inc. |
Apparatus and method for power management of memory circuits by a system or component thereof
|
US8335894B1
(en)
|
2008-07-25 |
2012-12-18 |
Google Inc. |
Configurable memory system with interface circuit
|
US8089795B2
(en)
|
2006-02-09 |
2012-01-03 |
Google Inc. |
Memory module with memory stack and interface with enhanced capabilities
|
US8130560B1
(en)
|
2006-11-13 |
2012-03-06 |
Google Inc. |
Multi-rank partial width memory modules
|
GB2444663B
(en)
|
2005-09-02 |
2011-12-07 |
Metaram Inc |
Methods and apparatus of stacking drams
|
US7562271B2
(en)
|
2005-09-26 |
2009-07-14 |
Rambus Inc. |
Memory system topologies including a buffer device and an integrated circuit memory device
|
US7464225B2
(en)
|
2005-09-26 |
2008-12-09 |
Rambus Inc. |
Memory module including a plurality of integrated circuit memory devices and a plurality of buffer devices in a matrix topology
|
US11328764B2
(en)
|
2005-09-26 |
2022-05-10 |
Rambus Inc. |
Memory system topologies including a memory die stack
|
DE102005051497B3
(de)
*
|
2005-10-26 |
2006-12-07 |
Infineon Technologies Ag |
Speichermodul mit einer elektronischen Leiterplatte und einer Mehrzahl von gleichartigen Halbleiterchips
|
US9632929B2
(en)
|
2006-02-09 |
2017-04-25 |
Google Inc. |
Translating an address associated with a command communicated between a system and memory circuits
|
US7724589B2
(en)
|
2006-07-31 |
2010-05-25 |
Google Inc. |
System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits
|
KR100886629B1
(ko)
*
|
2006-09-28 |
2009-03-04 |
주식회사 하이닉스반도체 |
반도체 메모리 장치
|
US7907466B2
(en)
*
|
2007-03-09 |
2011-03-15 |
Hynix Semiconductor Inc. |
Semiconductor memory apparatus
|
US8209479B2
(en)
|
2007-07-18 |
2012-06-26 |
Google Inc. |
Memory circuit system and method
|
US8080874B1
(en)
|
2007-09-14 |
2011-12-20 |
Google Inc. |
Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
|
KR100892686B1
(ko)
|
2007-11-09 |
2009-04-15 |
주식회사 하이닉스반도체 |
스택뱅크 구조를 갖는 반도체 메모리 장치
|
US9123395B2
(en)
*
|
2007-11-09 |
2015-09-01 |
SK Hynix Inc. |
Stack bank type semiconductor memory apparatus capable of improving alignment margin
|
US8159898B2
(en)
*
|
2008-01-18 |
2012-04-17 |
Hynix Semiconductor Inc. |
Architecture of highly integrated semiconductor memory device
|
US8417870B2
(en)
|
2009-07-16 |
2013-04-09 |
Netlist, Inc. |
System and method of increasing addressable memory space on a memory board
|
US8516185B2
(en)
*
|
2009-07-16 |
2013-08-20 |
Netlist, Inc. |
System and method utilizing distributed byte-wise buffers on a memory module
|
US8154901B1
(en)
|
2008-04-14 |
2012-04-10 |
Netlist, Inc. |
Circuit providing load isolation and noise reduction
|
KR101075497B1
(ko)
|
2008-04-30 |
2011-10-20 |
주식회사 하이닉스반도체 |
반도체 메모리 소자
|
KR100929826B1
(ko)
*
|
2008-06-04 |
2009-12-07 |
주식회사 하이닉스반도체 |
반도체 메모리 소자
|
KR100942949B1
(ko)
*
|
2008-06-30 |
2010-02-22 |
주식회사 하이닉스반도체 |
반도체 메모리장치
|
EP2441007A1
(de)
|
2009-06-09 |
2012-04-18 |
Google, Inc. |
Programmierung von dimm-abschlusswiderstandswerten
|
US9128632B2
(en)
|
2009-07-16 |
2015-09-08 |
Netlist, Inc. |
Memory module with distributed data buffers and method of operation
|
KR20110047666A
(ko)
*
|
2009-10-30 |
2011-05-09 |
주식회사 하이닉스반도체 |
반도체 메모리 장치
|
KR101094917B1
(ko)
*
|
2009-11-30 |
2011-12-15 |
주식회사 하이닉스반도체 |
전원 회로 및 이를 이용한 반도체 메모리 회로
|
KR101062776B1
(ko)
*
|
2010-01-29 |
2011-09-06 |
주식회사 하이닉스반도체 |
반도체 메모리 장치
|
KR101796116B1
(ko)
|
2010-10-20 |
2017-11-10 |
삼성전자 주식회사 |
반도체 장치, 이를 포함하는 메모리 모듈, 메모리 시스템 및 그 동작방법
|
CN102955497A
(zh)
*
|
2011-08-18 |
2013-03-06 |
鸿富锦精密工业(深圳)有限公司 |
安装有固态硬盘的主板
|
CN110428855B
(zh)
|
2013-07-27 |
2023-09-22 |
奈特力斯股份有限公司 |
具有本地分别同步的内存模块
|
JP2015118724A
(ja)
*
|
2013-11-13 |
2015-06-25 |
株式会社半導体エネルギー研究所 |
半導体装置及び半導体装置の駆動方法
|
US10679722B2
(en)
|
2016-08-26 |
2020-06-09 |
Sandisk Technologies Llc |
Storage system with several integrated components and method for use therewith
|
WO2020159548A1
(en)
*
|
2019-02-01 |
2020-08-06 |
Hewlett-Packard Development Company, L.P. |
Upgrades based on analytics from multiple sources
|