DE60029807D1 - Optoelektronische module mit doppelter umhüllung - Google Patents
Optoelektronische module mit doppelter umhüllungInfo
- Publication number
- DE60029807D1 DE60029807D1 DE60029807T DE60029807T DE60029807D1 DE 60029807 D1 DE60029807 D1 DE 60029807D1 DE 60029807 T DE60029807 T DE 60029807T DE 60029807 T DE60029807 T DE 60029807T DE 60029807 D1 DE60029807 D1 DE 60029807D1
- Authority
- DE
- Germany
- Prior art keywords
- optoelectronic modules
- double wrapping
- wrapping
- double
- optoelectronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US389864 | 1995-02-17 | ||
US09/389,864 US6252726B1 (en) | 1999-09-02 | 1999-09-02 | Dual-enclosure optoelectronic packages |
PCT/US2000/024023 WO2001016634A1 (en) | 1999-09-02 | 2000-09-01 | Dual-enclosure optoelectronic packages |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60029807D1 true DE60029807D1 (de) | 2006-09-14 |
DE60029807T2 DE60029807T2 (de) | 2007-03-15 |
Family
ID=23540069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60029807T Expired - Lifetime DE60029807T2 (de) | 1999-09-02 | 2000-09-01 | Optoelektronische module mit doppelter umhüllung |
Country Status (8)
Country | Link |
---|---|
US (1) | US6252726B1 (de) |
EP (1) | EP1218786B1 (de) |
JP (1) | JP4965781B2 (de) |
AU (1) | AU6949000A (de) |
CA (1) | CA2383706C (de) |
DE (1) | DE60029807T2 (de) |
IL (1) | IL148447A0 (de) |
WO (1) | WO2001016634A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112444920A (zh) * | 2019-08-27 | 2021-03-05 | 成都优博创通信技术股份有限公司 | 一种光模块组件及光通信设备 |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6207950B1 (en) * | 1999-01-11 | 2001-03-27 | Lightlogic, Inc. | Optical electronic assembly having a flexure for maintaining alignment between optical elements |
US6325552B1 (en) * | 2000-02-14 | 2001-12-04 | Cisco Technology, Inc. | Solderless optical transceiver interconnect |
JP4646166B2 (ja) * | 2000-11-08 | 2011-03-09 | 古河電気工業株式会社 | レーザダイオードモジュールからなる光源 |
JP2002280659A (ja) * | 2001-03-16 | 2002-09-27 | Furukawa Electric Co Ltd:The | レーザダイオードモジュールからなる光源 |
JP2002280660A (ja) * | 2001-03-16 | 2002-09-27 | Furukawa Electric Co Ltd:The | レーザダイオードモジュールからなる光源 |
US6762938B2 (en) * | 2001-03-16 | 2004-07-13 | Coretek, Inc. | Apparatus and method for providing auxiliary cooling and thermal stability to an opto-electronic component |
JP2002280654A (ja) * | 2001-03-19 | 2002-09-27 | Eco Twenty One:Kk | 光通信用モジュール |
US20020167976A1 (en) * | 2001-04-04 | 2002-11-14 | Seguin Vernon A. | Thermally efficient laser head |
US6697408B2 (en) * | 2001-04-04 | 2004-02-24 | Coherent, Inc. | Q-switched cavity dumped CO2 laser for material processing |
WO2002082596A2 (en) * | 2001-04-04 | 2002-10-17 | Coherent Deos | Q-switched co2 laser for material processing |
US6730993B1 (en) * | 2001-07-26 | 2004-05-04 | Ciena Corporation | Laser diode and heatsink quick connect/disconnect assembly |
US7453100B2 (en) * | 2001-08-28 | 2008-11-18 | The Furukawa Electric Co., Ltd. | DFB laser assembly and laser module |
US7070340B2 (en) * | 2001-08-29 | 2006-07-04 | Silicon Bandwidth Inc. | High performance optoelectronic packaging assembly |
US6663294B2 (en) * | 2001-08-29 | 2003-12-16 | Silicon Bandwidth, Inc. | Optoelectronic packaging assembly |
JP2003110182A (ja) * | 2001-09-28 | 2003-04-11 | Sumitomo Electric Ind Ltd | 半導体レーザモジュール |
JP4945874B2 (ja) * | 2001-09-28 | 2012-06-06 | 住友電気工業株式会社 | 発光モジュールおよび発光モジュール基板生産物 |
EP1309048A1 (de) * | 2001-11-06 | 2003-05-07 | Agilent Technologies, Inc. (a Delaware corporation) | Elektronische oder opto-elektronische Gehäuse |
US6936495B1 (en) | 2002-01-09 | 2005-08-30 | Bridge Semiconductor Corporation | Method of making an optoelectronic semiconductor package device |
US6891276B1 (en) | 2002-01-09 | 2005-05-10 | Bridge Semiconductor Corporation | Semiconductor package device |
US7126078B2 (en) | 2002-02-28 | 2006-10-24 | Emcore Corporation | Sub-micron adjustable mount for supporting a component and method |
US7430081B2 (en) * | 2002-02-28 | 2008-09-30 | Emcore Corporation | Sub-micron adjustable mount for supporting a component and method |
GB2387025A (en) * | 2002-03-26 | 2003-10-01 | Enfis Ltd | LED and laser diode array cooling |
AU2003219298A1 (en) * | 2002-03-26 | 2003-10-08 | Enfis Limited | Cooled light emitting apparatus |
WO2003105294A1 (en) * | 2002-06-07 | 2003-12-18 | Bookham Technology Plc | Wavelength stabilized optical device |
DE10229712B4 (de) * | 2002-07-02 | 2009-06-25 | Jenoptik Laserdiode Gmbh | Halbleitermodul |
EP1385277B1 (de) * | 2002-07-22 | 2005-06-08 | Agilent Technologies, Inc. - a Delaware corporation - | Überwachungsdatenübertragung in einem optischen Kommunikationssystem |
US20040042742A1 (en) * | 2002-08-27 | 2004-03-04 | Scott Bradshaw | Thermally equalized optical module |
US20040047571A1 (en) * | 2002-09-06 | 2004-03-11 | Boord Warren Timothy | Hermetically sealed ferrule |
EP1398655A1 (de) * | 2002-09-06 | 2004-03-17 | Agfa-Gevaert AG | Temperierung eines Optikmoduls |
US6973106B1 (en) * | 2002-10-11 | 2005-12-06 | Corvis Corporation | Optical package and optical systems apparatuses, and methods of use therein |
TWM241691U (en) * | 2003-02-24 | 2004-08-21 | Young Optics Inc | Holding apparatus for a rod |
KR101007164B1 (ko) * | 2003-03-14 | 2011-01-12 | 스미토모 덴키 고교 가부시키가이샤 | 반도체 장치 |
US7039079B2 (en) * | 2003-03-14 | 2006-05-02 | Coherent, Inc. | Pulsed CO2 laser including an optical damage resistant electro-optical switching arrangement |
US7556406B2 (en) * | 2003-03-31 | 2009-07-07 | Lumination Llc | Led light with active cooling |
US7543961B2 (en) * | 2003-03-31 | 2009-06-09 | Lumination Llc | LED light with active cooling |
US7204615B2 (en) * | 2003-03-31 | 2007-04-17 | Lumination Llc | LED light with active cooling |
US7299859B2 (en) * | 2003-04-28 | 2007-11-27 | Lucent Technologies Inc. | Temperature control of thermooptic devices |
US20070001177A1 (en) * | 2003-05-08 | 2007-01-04 | Koninklijke Philips Electronics N.V. | Integrated light-emitting diode system |
JP2005159104A (ja) * | 2003-11-27 | 2005-06-16 | Sony Corp | レーザ・システム |
US7186038B2 (en) | 2003-12-29 | 2007-03-06 | Adc Telecommunications, Inc. | Telecommunications connector protective device |
US7095110B2 (en) * | 2004-05-21 | 2006-08-22 | Gelcore, Llc | Light emitting diode apparatuses with heat pipes for thermal management |
WO2006069554A1 (de) | 2004-12-30 | 2006-07-06 | Osram Opto Semiconductors Gmbh | Kühlvorrichtung zur kühlung eines halbleiterbauelementes, insbesondere eines optoelektronischen halbleiterbauelementes |
US7457126B2 (en) * | 2005-06-27 | 2008-11-25 | Intel Corporation | Optical transponder with active heat transfer |
US8322889B2 (en) | 2006-09-12 | 2012-12-04 | GE Lighting Solutions, LLC | Piezofan and heat sink system for enhanced heat transfer |
US8031464B2 (en) * | 2008-09-08 | 2011-10-04 | Intergraph Technologies Corporation | Ruggedized computer capable of operating in high-temperature environments |
US8094388B1 (en) | 2009-01-12 | 2012-01-10 | Vortran Laser Technology, Inc. | Removable and replaceable modular optic package with controlled microenvironment |
US8749978B2 (en) | 2010-01-29 | 2014-06-10 | Nitto Denko Corporation | Power module |
JP2012049495A (ja) * | 2010-01-29 | 2012-03-08 | Nitto Denko Corp | 発光ダイオード装置 |
US8547465B2 (en) | 2010-01-29 | 2013-10-01 | Nitto Denko Corporation | Imaging device module |
US8427828B2 (en) | 2010-07-20 | 2013-04-23 | Themis Computer | Printed circuit board module enclosure and apparatus using same |
CN101963339A (zh) * | 2010-10-09 | 2011-02-02 | 王春 | 一种大功率led光源一体化散热装置 |
JP2012124245A (ja) * | 2010-12-07 | 2012-06-28 | Sae Magnetics(H K )Ltd | 光伝送モジュール及びその温度調節方法 |
US8905632B2 (en) | 2011-11-29 | 2014-12-09 | Cisco Technology, Inc. | Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components |
US9645333B2 (en) | 2014-10-17 | 2017-05-09 | Lumentum Operations Llc | Optomechanical assembly |
US9596761B2 (en) * | 2015-01-06 | 2017-03-14 | Fujitsu Limited | Different thermal zones in an opto-electronic module |
US10367284B2 (en) | 2015-07-27 | 2019-07-30 | Hewlett Packard Enterprise Development Lp | Socket to support boards in a spaced relation |
EP3278361A4 (de) | 2015-07-31 | 2019-02-20 | Hewlett-Packard Enterprise Development LP | Mehrchipmodul |
JP5895091B1 (ja) * | 2015-09-01 | 2016-03-30 | 株式会社フジクラ | 光モジュール |
CN105281197A (zh) * | 2015-11-11 | 2016-01-27 | 中国电子科技集团公司第四十四研究所 | 一种抗冲击能力强的半导体光源封装结构 |
DE112018007021B4 (de) * | 2018-02-06 | 2022-05-12 | Mitsubishi Electric Corporation | Schaft mit einem eingebauten thermoelektrischen Kühler |
JP2019212837A (ja) * | 2018-06-07 | 2019-12-12 | ルネサスエレクトロニクス株式会社 | 電子装置およびその製造方法 |
US10901161B2 (en) | 2018-09-14 | 2021-01-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Optical power transfer devices with an embedded active cooling chip |
US11249264B2 (en) * | 2020-07-02 | 2022-02-15 | Google Llc | Thermal optimizations for OSFP optical transceiver modules |
US11789221B2 (en) * | 2021-10-05 | 2023-10-17 | Aeva, Inc. | Techniques for device cooling in an optical sub-assembly |
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-
1999
- 1999-09-02 US US09/389,864 patent/US6252726B1/en not_active Expired - Lifetime
-
2000
- 2000-09-01 EP EP00957939A patent/EP1218786B1/de not_active Expired - Lifetime
- 2000-09-01 JP JP2001520536A patent/JP4965781B2/ja not_active Expired - Fee Related
- 2000-09-01 AU AU69490/00A patent/AU6949000A/en not_active Abandoned
- 2000-09-01 WO PCT/US2000/024023 patent/WO2001016634A1/en active IP Right Grant
- 2000-09-01 CA CA002383706A patent/CA2383706C/en not_active Expired - Fee Related
- 2000-09-01 DE DE60029807T patent/DE60029807T2/de not_active Expired - Lifetime
- 2000-09-01 IL IL14844700A patent/IL148447A0/xx unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112444920A (zh) * | 2019-08-27 | 2021-03-05 | 成都优博创通信技术股份有限公司 | 一种光模块组件及光通信设备 |
Also Published As
Publication number | Publication date |
---|---|
DE60029807T2 (de) | 2007-03-15 |
US6252726B1 (en) | 2001-06-26 |
EP1218786B1 (de) | 2006-08-02 |
IL148447A0 (en) | 2002-09-12 |
EP1218786A1 (de) | 2002-07-03 |
AU6949000A (en) | 2001-03-26 |
CA2383706C (en) | 2007-03-27 |
JP2003533009A (ja) | 2003-11-05 |
CA2383706A1 (en) | 2001-03-08 |
JP4965781B2 (ja) | 2012-07-04 |
EP1218786A4 (de) | 2005-05-04 |
WO2001016634A1 (en) | 2001-03-08 |
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Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: HEYER, V., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 806 |